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High-Speed, Reliable Plating with PACLINE®
PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution.
PacTech
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Technical Paper |
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
The white paper details a real-world use case where dummy IC packages converted to Open-Cavity Plastic Packages (OCPP) passed stringent burn-in and MSL tests equivalent to factory-fresh parts.
QP Technologies
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