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FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC

Technical Paper

How AiP/AoP Technology Helps Enable 5G And More

How AiP/AoP modules can be used In lieu of a separate RF SoC, baseband SoC, SMT matching circuits and a discrete antenna.
Amkor Technology, Inc.

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Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions