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FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC

Technical Paper

The Journey to Full-Scale Semiconductor Packaging Manufacturing

The challenges faced from package design and prototyping, through process development and process optimization are presented to ensure the device can indeed be manufactured with the desired throughput and quality.
Palomar Technologies

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Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions