Sponsor

FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC

Technical Paper

Innovations in Wire Bond Inspection

New 3D inspection system is specifically designed to meet the challenges of wire bonding. Among its features are substantially improved sensors, a high image resolution and fast image data processing.
Viscom AG

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Sponsor

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions