AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS
Technical Paper
CMP Carrier Head Film Replacement Testing
Semiconductor manufacturing relies on precise processes like CMP. With Pureon DF200 discontinued, Entrepix explores alternatives. Testing PR Hoffman 1000, PR Hoffman 7000, Pureon PF800 films shows promise.
Entrepix
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