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Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.

Technical Paper

Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation

This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Material compatibility on mixed metals, cleaning performance and bath life studies.
KYZEN Corporation

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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology