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Technical Paper

Die Attach Voiding Requirements in Eutectically Bonded GaAs and GaN MMIC Power Amplifiers

This WHITE PAPER will briefly review the eutectic die attach process, existing Mil-Std-883 die voiding specifications, along with additional concerns ...
TJ Green Associates LLC

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Sawa Ecobrid Fully Automatic Stencil Cleaner
This cleaner has 2 ultrasonic cleaning head panels for cleaning the front & back sides together. Ultrasonic energy is applied directly to the stencil.
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