October 24, 2025

The Opportunities and Challenges of FOPLP Technology ASE is advancing AI and HPC chip integration through Fan-out Panel Level Packaging (FOPLP), placing memory close to processors on large interposers. Their Chip Last approach enables larger reticle sizes, higher bandwidth, faster speeds, and greater efficiency than traditional processes. Semiconductor Engineering

Sponsor Ultrasonic Bonding: Cohesive connection between a chip & substrate Electrically conductive and mechanical bonds for temp-sensitive components or components that are difficult to heat with Ultrasonic Bonding. Tresky Automation

Enabling The Future: Heterogeneous Integration From Connected Devices To Data Centers The semiconductor industry is rapidly transforming as heterogeneous integration merges diverse technologies into unified systems. This advanced packaging drives smarter, faster electronics, enabling new capabilities in AI, 5G, edge computing & next-generation devices across industries. Semiconductor Engineering

Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Technical Paper

Sponsor How to Select RF Test Socket The classic function of a socket is to provide a replaceable connection mechanism from the IC (Integrated Circuit) to the circuit board with minimal signal loss. Ironwood Electronics

Applied Materials lays off 4% of workforce Applied Materials is cutting about 4% of its 36,100 employees—roughly 1,444 jobs—as it restructures to boost efficiency amid export restrictions and automation shifts. The company expects $160–$180 million in severance costs as it aims to stay competitive and productive. CNBC

Intel beats on sales in first earnings report since U.S. government became top shareholder Intel posted stronger-than-expected revenue as PC processor demand rebounded, driving a 6% stock rise. The company reported $4.1 billion net income, secured government and Nvidia investments, and highlighted ongoing growth in chips despite supply constraints. CNBC

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

Technical Papers Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) Peer viewpoint: AI data centers are driving a semiconductor revolution MORE TECHNICAL PAPERS

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies

Taiwan chip industry voices concerns over green energy supplies Taiwan's chipmakers question the government's green energy rollout, citing execution risks and delayed timelines. With nuclear power offline, renewables lagging, and rising fuel costs, the industry fears energy shortages could threaten production and financial stability. Taipei Times

US mulls software export curbs on China The Trump administration is considering broad export restrictions on critical software to China, potentially coordinated with G7 allies, in response to Beijing's rare earth export limits. Measures could affect major tech firms and escalate US-China trade tensions ahead of planned talks. Taipei Times

Sponsor How LAPLACE® Laser Assisted Bonding Saves Energy LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo. PacTech

What Too Many Enterprises Get Wrong About AI Global businesses are rushing into AI, but many lack strategy, infrastructure, and skilled teams, leading to wasted spend and delayed ROI. Success requires scalable technology, trusted data practices, purpose-built compute, and upskilled employees aligned with ethical, secure AI goals. EE Times

First rare earths and chips, now quantum computers: Trump reportedly eyes new U.S. stakes The Trump administration reportedly explored taking equity stakes in quantum-computing firms like IonQ, Rigetti, and D-Wave in exchange for federal funding, signaling a bid to secure critical tech amid U.S.-China rivalry, though Commerce officials denied ongoing talks. CNBC

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

Powering Efficiency: AI Transforms IC Manufacturing As ICs Fuel AI At SEMICON West, experts showcased how AI is reshaping semiconductor design and manufacturing. Digital twins are boosting yields, machine learning is improving defect detection, and AI-driven collaborations are accelerating innovation across fabs and supply chains. Semiconductor Engineering

Stop The Drip-Drip-Drip Of Intermittent In-Line Wafer Defects And Increase Your Yields Next-generation macro defect inspection lets fabs detect low-volume, intermittent wafer defects that traditional sampling often misses. By inspecting 100% of wafers inline, fabs can identify issues earlier, reduce scrap, improve yield, and boost profitability. Semiconductor Engineering

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Chip Firms Deepen Academic Outreach in India At electronica India 2025, GSSS Women's Engineering College students Spurthi Anand and Sridevika T.R. earned top honors for "Immersion Active," an electric two-wheeler immersion cooling system using Renesas RA62 MCUs & showcased via Renesas' Quick Connect Kit program. EE Times

Sponsor Targeted Sample Preparation for Deeply Buried ROI in Advanced Packages New fault isolation technique using 3D X-ray microscopy & LaserFIB to pinpoint, isolate & open a 20 µm wirebond without damage to adjacent wires. ZEISS Microscopy