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New Development of Thermally Enhanced GaN QFN with Heat Slug Attach Bonding Technology

GaN mosfet provides significantly lower resistance and low capacitance than silicon mosfet which makes GaN mosfet considered as alternative power devices to replace silicon mosfet, and by the adoption of GaN mosfet technology, the high-frequency power supply can be designed in small form factor by miniaturization of passive components.
UTAC Group
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