Technical Paper |
Next Gen Laser Assisted Bonding (LAB) Technology
A reverse-type LAB where laser emission is transmitted through the stage block from the bottom BGA side to bump. Download now.
Amkor Technology, Inc.
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Achieve Precision in WLCSP Bumping
Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts.
PacTech
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