Technical Paper

Highly Selective Epoxy Molding Compound Removal in Advanced Semiconductor Devices



Suitable sample preparation techniques and workflows are required to remove EMC to reveal defects to determine the root cause on advanced packages. This paper explores etching EMC using atmospheric plasma.
JIACO Instruments

Complete this form to download this Technical Paper.
Your Name


Your E-mail
Your Company


Your State, or Country if outside USA

More Technical Papers
Package and Die Attach Material Comparisons for High Power GaN Devices
Compatibility of pH-Neutral Cleaning Agent with Under-bump Materials
S-SWIFT® Packaging with Fine Pitch Embedded Trace RDL
Cleaning of Silicone and Hydrocarbon Contact Residue Using Atmospheric Plasma
Highly Selective Epoxy Molding Compound Removal in Advanced Semiconductor Devices
Motivation for pressure-assisted metallic sintering in Power Electronics
IR Laser Cleave Technology for 3D Packaging and Logic Scaling
Next Gen Laser Assisted Bonding (LAB) Technology
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
Revising 5G RF Calibration Procedures For RF IC Production Testing

Full Technical Paper List
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address