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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

Technical Paper

S-SWIFT® Packaging with Fine Pitch Embedded Trace RDL

S-SWIFT® packaging was successfully demonstrated by heterogeneous integration of the ASIC and HBMs with ETR technology and Flip Chip assembly.
Amkor Technology, Inc.

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More Technical Papers

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Full Technical Paper List

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Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation