We search for industry news, so you don't need to.
2.5D Package and HDFO – Advanced Heterogeneous Packaging Solutions

This article introduces packaging technology platforms developed by Amkor Technology including: 2.5D TSV interposer, CoS, CoW and HDFO.
Amkor Technology, Inc.
Complete this form to download
this Technical Paper.


Your Name


Your E-mail


Your Company


Your State or Country



More Technical Papers
False Fine Leak Testing of Hermetic Packages
Power Packaging for Automotive Semiconductors -- Now and Future
SB²-WB: A new process solution for advanced wire-bonding
CMOS Image Sensor Packaging Technology for Automotive Applications
Sockets and Adapters
Thin Is In
Advanced Wafer Level PKG Solutions for Telecom Infrastructure
New Generation Routable QFN for Power SiP Applications
2.5D Package and HDFO – Advanced Heterogeneous Packaging Solutions
Case Study: Extreme Low-Void, Lead Free Soldering for Power Modules

Full Technical Paper List