Technical Paper

Targeted Sample Preparation for Deeply Buried ROI in Advanced Packages



A new sample preparation technique for fault isolation of advanced packages, using correlated, high-resolution 3D X-ray microscopy and a LaserFIB to pinpoint, isolate and open a 20 ┬Ám wirebond without damage to adjacent wires.
ZEISS Microscopy

Complete this form to download this Technical Paper.
Your Name


Your E-mail
Your Company


Your State, or Country if outside USA

More Technical Papers
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
Revising 5G RF Calibration Procedures For RF IC Production Testing
Optimizing New Power Switch Technology Using Compound Semiconductors
Targeted Sample Preparation for Deeply Buried ROI in Advanced Packages
How AiP/AoP Technology Helps Enable 5G And More
Decapsulation of Multi-Tier Wire-Bonded Semiconductors
Series B : Adhesion and Bondibility of Al2O3-coated Bonding Wire
How to Select RF Test Socket
3D Sensing Solutions
Critical Cleaning Requirements to Overcome Advanced Packaging and Defluxing Challenges

Full Technical Paper List
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address