Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding. AI Technology, Inc.
Technical Paper
Series A: Electrical Insulation of Al2O3-Coated Bonding Wire
We introduce ceramic (Al2O3) coating at nm scales deposited on metal wires for enhancing electrical insulation, adhesion to encapsulation and passivation of corrosion resistant wires.
OxWires Co., Ltd
Complete this form to download this Technical Paper.
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
Sponsor
Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency. Indium Corporation