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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.

Technical Paper

Series A: Electrical Insulation of Al2O3-Coated Bonding Wire

We introduce ceramic (Al2O3) coating at nm scales deposited on metal wires for enhancing electrical insulation, adhesion to encapsulation and passivation of corrosion resistant wires.
OxWires Co., Ltd

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Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation