Technical Paper: Vacuum Fluxless Reflow Technology for Fine Pitch Interconnect Bumping Applications

Technical Paper

Vacuum Fluxless Reflow Technology for Fine Pitch Interconnect Bumping Applications

A process for fine pitch bumping involving vacuum and formic acid reflow (VFAR) suitable for high volume manufacturing is described. A joint study between Heller Industries and Intel Corporation.
Heller Industries, Inc.

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