Technical Paper

High Thermal Non-Conductive Die Attach



Tight die-to-die placement and higher voltage designs require a non-conductive die attach paste that can meet tough reliability and thermal requirements. Check out the latest development.
Henkel Corporation

Complete this form to download this Technical Paper.
Your Name


Your E-mail
Your Company


Your State, or Country if outside USA

More Technical Papers
The Effects of Long-Term Storage on Solderability of Components
Optimizing cycle times in the semiconductor industry with Openair-Plasma
Preparing TEM Specimens and Atom Probe Tips by Laser Machining
High Thermal Non-Conductive Die Attach
High-Resolution Roughness Metrology for the Wafer Fab
Efficient Manufacture of IR Sensors
Qualifying the ExposedPad TQFP for AEC-Q006 Grade 0
How to Wire Pull?
Monolithic Magnetic Sensors Manufactured by Selective Laser Annealing
Maximizing Protection of Flip Chip Interconnects

Full Technical Paper List
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address