Technical Paper: Removing Underfill for Analysis of 2.5D Modules Using CF4-Free Microwave Induced Plasma

Technical Paper

Removing Underfill for Analysis of 2.5D Modules Using CF4-Free Microwave Induced Plasma

Selective removal of underfill on a 2.5D package to enable subsequent analysis on interposer interconnects and Cu µbumps in cross-section using artifact-free decapsulation with atmospheric plasma.
JIACO Instruments

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