Technical Paper

Plasma Treatment during Fan-out Wafer-Level Packaging Optimizes Performance and Costs



Fan-out Wafer-Level (FOWLP) and Fan-out Panel-Level (FOPLP) semiconductor packaging benefit from plasma treatment, which ensures surfaces are contamination-free to aid the attachment process, maximizing performance and optimizing costs.
Nordson MARCH

Complete this form to download this Technical Paper.
Your Name


Your E-mail
Your Company


Your State, or Country if outside USA

More Technical Papers
Hermetic Package Process Development
Justifying the Purchase of Die or Wire Bonding Equipment
Die-to-wafer Bonding Accelerates Heterogeneous Integration (HI)
Advantages of Outsourced Test Services
Semiconductor Device Innovation Driving Automotive Advances
Non-Surface Contact Approach For Device Flip
BGA Socket Considerations - Prototype to Reality
EMI Shielding for System in Package Using Spray Coating and Silver Particle-Free Ink
Improved Wire Bond Reliability with Auxiliary Wires
Adding Value with Unit Level Traceability (ULT) in Automotive Packaging

Full Technical Paper List
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address