Technical Paper

Halogen-free Microwave Induced Plasma Decapsulation of System in Package Modules



For successful SiP root cause Failure Analysis, Microwave Induced Plasma (MIP) decapsulation exposes & preserves complex structures such as stacked-die, BOAC, CSP, PoP, SAW/BAW filters, GaAs, and original failure sites.
JIACO Instruments

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