Technical Paper |
Halogen-free Microwave Induced Plasma Decapsulation of System in Package ModulesFor successful SiP root cause Failure Analysis, Microwave Induced Plasma (MIP) decapsulation exposes & preserves complex structures such as stacked-die, BOAC, CSP, PoP, SAW/BAW filters, GaAs, and original failure sites. JIACO Instruments Complete this form to download this Technical Paper. |
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