Technical Paper: Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications

Technical Paper

Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications

In this paper, a novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling polymer/metal hybrid bonding.
Brewer Science, Inc.

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