Industry Press
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry's Path to $1 Trillion
SEMI
Semiconductor Wet Chemicals Growth Underway
TECHCET
ZEISS and Argolight announce partnership to enhance microscopy imaging quality control
ZEISS
CEA-Leti to Report Latest Results on 3-Layer Integration,High Density TSVs at ECTC 2024
CEA-Leti
Smoltek Gen-Zero enables high volumetric capacitance density in capacitors
Smoltek
Trymax Receives Multi System Orders from a large Asian based foundry
Trymax Semiconductor Equipment BV
Brooks Instrument Acquires Creative Machining Technology
Brooks Instrument
Automotive DC motor pre-driver from STMicroelectronics simplifies EMI optimization and saves power
STMicroelectronics
MORE INDUSTRY PRESS
What Year Was It?
The day was Apr 25. What year was it?
Andropov Writes to U.S. Student
What Year
The Soviet Union releases a letter that Russian leader Yuri Andropov wrote to Samantha Smith, an American fifth-grader from Manchester, Maine, inviting her to visit his country.
See the answer below.
What Year Was It Answer
Andropov Writes to U.S. Student
Answer: April 25, 1983
April 26, 2024
Intel shares fall after company provides weak forecast for the current quarter
Intel's first-quarter earnings exceeded Wall Street's EPS projections but lagged in sales, leading to an 8% stock drop in extended trading. With a weak forecast for the current quarter, Intel expects earnings of 10 cents per share on $13 billion revenue, falling short of analysts' expectations.
CNBC
A Quantum Problem AI Simulations Will Not Be Able to Address
Intel CEO Pat Gelsinger forecasts quantum supremacy by 2032-2035, echoed by GSMA's PQTN taskforce estimating quantum utility by 2027, with widespread adoption in the 2030s. Leading tech giants like IBM and Intel pursue quantum computing while addressing quantum threats with post-quantum cryptography.
EE Times
Next Gen Laser Assisted Bonding (LAB) Technology
A reverse-type LAB where laser emission is transmitted through the stage block from the bottom BGA side to bump.
Technical Paper
ASE Technology to raise its capex budget by 10%
ASE Technology Holding Co boosts equipment capital expenditure by 10% to meet rising demand for AI and high-performance computing chips. With a focus on advanced packaging and testing, ASE expects significant growth in revenue and gross margin expansion this year.
Taipei Times
‘A16’ chipmaking tech to arrive in 2026, TSMC says
TSMC unveils "A16" chip tech, targeting production by late 2026, intensifying rivalry with Intel. AI chipmakers likely first adopters. A16's speed potential challenges Intel's "14A." TSMC's innovative power supply tech further heats up competition. Analysts skeptical of Intel's claims.
Taipei Times
SIA Commends CHIPS Act Incentives for Micron’s Manufacturing Projects in New York and Idaho
SIA President John Neuffer praises new semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Micron, part of the CHIPS Act. Micron's facilities in New York and Idaho will benefit, joining other major players in a wave of investment, promising over 80 projects, thousands of jobs, and a boon to the U.S. economy.
Semiconductor Industry Association
EDA Looks Beyond Chips
EDA giants are seizing vast opportunities beyond semiconductors by merging large-scale multi-physics simulations with chip methodologies. With investments in machine learning, they aim to revolutionize system design, potentially reshaping the $3 trillion electronics market.
Semiconductor Engineering
Is There Any Hope For Asynchronous Design?
Asynchronous logic, though promising, struggles to compete with synchronous design due to complex challenges like clock skew and power consumption. With limited tools and expertise, it remains a niche area, awaiting a breakthrough to fulfill its potential in power-efficient computing.
Semiconductor Engineering
Revitalizing DAC
As the 61st Design Automation Conference approaches, a veteran reflects on nearly 45 years in the EDA industry. From wild parties to innovation slowdowns, DAC has evolved. Now, with industry attention renewed, the challenge lies in revitalizing the show floor to match the conference's resurgence.
Semiconductor Engineering
The 3D-IC Multiphysics Challenge Dictates A Shift-Left Strategy
The advent of 3D-IC design brings multifaceted challenges, blending electro-thermal and mechanical physics. Assembling diverse chiplets complicates traditional testing methods, demanding early-stage multiphysics analysis. A shift-left approach mitigates issues, ensuring optimal configurations through comprehensive verification, enhancing industry 3D-IC standards.
Semiconductor Engineering
TSMC aims to produce ultra-advanced 1.6-nm chips by 2026
TSMC plans to launch cutting-edge 1.6-nanometer chip production by 2026, revealed at the North America Technology Symposium. The breakthrough promises enhanced logic density and performance, solidifying TSMC's lead in the chipmaking race.
Nikkei Asia
Navigating The GPU Revolution
Enterprises embrace the GPU revolution, leveraging its power for AI, deep learning, and data analytics. Navigating complexities in GPU architecture, software, and ecosystem integration proves pivotal for successful adoption in diverse industries.
Semiconductor Engineering
Intel Foundry ticks another box in quest to fab mil-spec chips for US DoD
Intel's bid to become a trusted chip supplier for the US military advances as it nears approval to operate a foundry for producing secure semiconductors, boosting national security and reducing reliance on foreign manufacturers.
The Register
SkyWater Technology Is Lowering Barriers To Advanced Chip Packaging
SkyWater Technology's innovative approach is breaking down obstacles in advanced chip packaging, revolutionizing the industry by enhancing performance and lowering costs. This breakthrough promises a significant impact on technology development and accessibility.
Forbes
Leveraging Cryogenics and Photonics for Quantum Computing
Cryogenics and photonics merge in quantum computing, revolutionizing data processing. Innovations in cooling systems and light-based communication amplify quantum capabilities, promising breakthroughs in computation power and data encryption.
EE Times Europe
SK hynix to boost production of advanced DRAMs at new fab in Cheongju
SK hynix Inc. announced plans to boost production of next-gen DRAMs, responding to surging demand for AI semiconductors. Investing $3.85 billion to convert a new fab in Cheongju, it anticipates completing construction by November next year.
The Korea Times
OLED expected to welcome long-awaited bloom in 2024 due to arrival of Apple's new iPad
In 2024, market analysts anticipate a robust resurgence in the OLED display market, buoyed by Apple's debut of OLED screens in their upcoming iPad. Forecasts predict a significant revenue upturn, fueled by heightened demand and technological advancements.
Digitimes
Tech war: US is reviewing risks of China's use of open-source RISC-V chip technology
The US is actively assessing the security risks posed by China's adoption of open-source RISC-V chip technology. Concerns over potential exploitation of the technology highlight escalating tensions in the ongoing tech war between the two global powers.
South China Morning Post
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Test Your Knowledge
Arrange these Roman Numerals from largest to smallest value: L, X, D, C
See answer below.
Quote of the Day
"If lawyers are disbarred and clergymen defrocked, doesn't it follow that electricians can be delighted, musicians denoted?"
George Carlin
Industry Calendar
Apr 29, 2024
Onshoring 2024
IMAPS & IPC
Apr 30, 2024
ABCs of Basic Electronics and Devices
SEMI
Apr 30, 2024
The 27th Annual Components for Military & Space Electronics (CMSE) Conference & Exhibition
TJ Green Associates, LLC
May 1, 2024
MEMS & Sensors Technical Congress (MSTC)
SEMI
May 7, 2024
Intro to Semiconductor Design & Fabrication
SEMI
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Cartoon
"Sometimes it's smooth sailing, sometimes it gets rough and stormy and sometimes you sink to the bottom with your crew. That's why it's called leadership."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
Arrange these Roman Numerals from largest to smallest value: L, X, D, C
Answer: D = 500, C = 100, L = 50, X = 10