June 8, 2026

Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows Glass substrates gain momentum for AI chip packaging as commercialization targets 2027–2030, driven by NVIDIA and Google demand. TSMC, Intel, SKC, Samsung and LG advance pilot lines as CoWoS costs rise and density, power efficiency improve. TrendForce

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Global Semiconductor Sales Increase 11% Month-to-Month in April SIA reports global semiconductor sales hit $110.5B in April 2026, rising 11% month over month and 93.9% year over year, marking 14 straight months of growth. It backs a WSTS forecast projecting $1.5T in 2026 and $1.9T in 2027 driven by AI demand. Semiconductor Industry Association

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance. Technical Paper

Sponsor AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives 240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity. AI Technology, Inc.

Chinese memory firms edge closer to challenging Korea's chip giants China's leading memory chipmakers CXMT and YMTC advance toward IPOs while rapidly expanding output and market share, signaling stronger competition for Samsung and SK hynix as AI-driven demand fuels growth and Chinese firms close the technology gap in mature segments. The Korea Times

Geopolitics, AI, and Jensen Huang Fuel Electronics' Rock-and-Roll Era At Computex 2026 in Taipei, crowds treated Nvidia CEO Jensen Huang like a rock star as he showcased RTX Spark and AI advances. The event highlighted booming interest in GPUs, robotics, and agentic AI across Taiwan's full-stack semiconductor ecosystem. EE Times

Sponsor Amkor's Double Sided Molded BGA Solutions To improve the integration of RFFE solutions, Amkor offers a DSMBGA package that allows molded assembly of components on both sides of the substrate. Amkor Technology, Inc.

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Ultrasonic Bonding: Cohesive connection between a chip & substrate Electrically conductive and mechanical bonds for temp-sensitive components or components that are difficult to heat with Ultrasonic Bonding. Tresky Automation

Nvidia to expand capacity through next year: CEO Nvidia CEO Jensen Huang said the company will double capacity in the second half of this year to meet surging AI demand, warning supply chains remain tight. He predicted next year will far exceed current production levels. Taipei Times

Huawei chips refine DeepSeek model in major leap for China's AI self-reliance Researchers, including Huawei, used Ascend 910C chips to complete full-parameter post-training of DeepSeek-V4-Pro on a 1.6 trillion-parameter model across a 1,000-chip cluster, advancing China's AI capabilities from inference to large-scale model training despite U.S. chip restrictions. South China Morning Post

Sponsor 1 of 10 Applications: Thermosonic Flip-Chip This powerful technology works in a single step by bonding flip chips with gentle ultrasonic compression at temperatures below 160°C and with single-micron accuracy. Dr. Tresky AG

Tencent's chief AI scientist dismisses lag concerns, says race a 'long-term game' Former OpenAI researcher Yao Shunyu says the AI race is just beginning, with coding agents and embodied intelligence poised to create trillion-dollar markets. He argues success will depend on infrastructure, data quality, and long-term investment. South China Morning Post

Chip Industry Week In Review Arm and Nvidia launched RTX Spark AI with Grace CPU and Blackwell RTX GPU. Cadence introduced an AI engineer. Intel unveiled Xeon 6+ on 18A with partnerships, while firms showcased CPO, Micron SOCAMM2 and Samsung HBM5 advances. Semiconductor Engineering

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Packaging Technologies Redefine AI And HPC Scalability Limits At ECTC 2026 Intel Foundry showcased EMIB-T, co-packaged optics and glass substrates at the 2026 IEEE ECTC, advancing AI and HPC scaling. The technologies boost bandwidth, cut power consumption and enable multi-die chiplet architectures that surpass reticle-size limits. Semiconductor Engineering

Chips Act 2.0 Puts Demand at Center of Europe's Semiconductor Strategy The European Commission's Chips Act 2.0 shifts from supply-side semiconductor subsidies to a demand-driven strategy, boosting AI chip design, aligning production with market needs, closing scale-up funding gaps, and strengthening Europe's fragmented chip ecosystem. EE Times

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Finely tuned 1nm molybdenum disulfide tubes expand nanotube science beyond carbon Japanese researchers created 1-nanometer molybdenum disulfide nanotubes inside boron nitride shells, confirming theory and enabling atomic-scale control. The advance could support ultrasmall transistors and sensors, though scaling challenges remain. Nanowerk

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group