semiconductor
packaging news
Sponsor
Surfx-Technologies

Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
Industry Press
Dr. Brewer Inducted into Missouri Manufacturers Hall of Fame
Brewer Science, Inc.
ASMPT at OFC 2026 Los Angeles
ASMPT
Empower Semiconductor Showcases Vertical Power Delivery Innovations at APEC 2026
Empower Semiconductor
FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders
FAMES
IBM and Lam Research Announce Collaboration to Advance Sub-1nm Logic Scaling
IBM
Research and Innovation Factory for AI & Microelectronics
Fraunhofer IPMS
SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging
SCHMID Group
STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack
STMicroelectronics
MORE INDUSTRY PRESS
Sponsor
Advanced-Component-Labs

Quick Turn I/C Package Substrates USA Fabrication – THIN "Stay Flat" CORES
Organic Substrates/High Density Interposers - 20µm Dielectrics /12µm Traces 50um Cores - ITAR Approved. Learn more.
Advanced Component Labs, Inc.
MRSI
What Year Was It?
FDR Gives First Fireside Chat
What Year
President Franklin D. Roosevelt gives his first national radio address or "fireside chat," broadcast directly from the White House.
See the answer below.
Nordson-ASYMTEK
Sponsor
Henkel-AG-Co

Copper vs silver: a turning point for WBG die attach
Copper sintering is challenging silver's dominance in power semiconductors. Read how new materials are enabling high performance at lower cost.
Henkel AG & Co.
CyberOptics
Sponsor
Ontos-Equipment-Systems

Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
What Year Was It Answer
FDR Gives First Fireside Chat
Answer: March 12, 1933
March 12, 2026
image
How AI is Changing Computing and Why Testing is Critical
Surging AI compute demands are driving chipmakers toward heterogeneous chiplet designs with advanced 2.5D/3D packaging and HBM. To manage rising complexity, the industry is deploying testing, new standards, and ATE to verify known-good dies.
Semiconductor Engineering
Sponsor
Tresky

Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
VIEWPOINT 2026: Dr. Dev Gupta, CTO, APSTL llc
image
Advanced Packaging (AP) has now become recognized even by the Fabless Chip Designers of the now Silicon LESS Silicon Valley as the rapid & cost effective .way to rescue traditional Moore's Law from stagnation due to Physics (the rise of leakage current as FETs get smaller and the very complex & expensive ...
APSTL llc
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes.
Technical Paper
Sponsor
ECTC

2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
Global Semiconductor Sales Increase 3.7% Month-to-Month in January
Global chip sales hit $82.5B in Jan. 2026, rising 3.7% from December and 46.1% year over year, reports the Semiconductor Industry Association. Data compiled by World Semiconductor Trade Statistics show strong gains led by Asia Pacific and China markets.
Semiconductor Industry Association
Taiwan Extends Its Reach from Advanced Chips to Embedded Systems
Taiwan's semiconductor ecosystem is advancing next-gen embedded systems by combining AI, energy-efficient architectures, advanced packaging & secure computing. Strong foundry leadership & supply chain integration are accelerating innovation in edge and industrial platforms.
EE Times
Sponsor
XYZTEC

Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
Amkor-Technology

Amkor Antenna in Package (AiP) Solutions
As demand for packages that support 5G increase, Amkor is ready with the successful implementation of AiP/AoP technology. Learn more.
Amkor Technology, Inc.
The memory stock cycle of boom-bust-repeat is over, executives say
Artificial intelligence spending is reshaping the memory market, lifting shares of Micron and SanDisk. Executives say strong AI demand, long-term supply contracts, and tight capacity are ending the sector’s boom-bust cycle and pushing memory prices into a sustained rise.
CNBC
Samsung and SK are expanding fast, but why is memory still in short supply?
The AI boom is fueling surging demand for memory, but supply will stay constrained. Samsung Electronics and SK hynix are investing heavily in fabs, cleanrooms and advanced nodes, limiting near-term wafer output and extending global memory shortages until 2027.
Korea Joong Ang Daily
Sponsor
MicroCircuit-Laboratories-LLC

FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
GlobalWafers expects flat-to-slightly-higher revenue
GlobalWafers expects flat or slightly higher revenue as AI-driven demand boosts advanced 12-inch wafers and smaller diameters recover. Rising orders, improved factory utilization and expansion plans in Texas support a stronger product mix despite geopolitical uncertainty.
Taipei Times
Data-Driven Optimization In Semiconductor Manufacturing
Semiconductor manufacturers face rising costs, downtime risks and mounting production complexity as demand climbs. Industry experts say unified data orchestration, real-time visibility and AI-driven analytics can break data silos, cut downtime.
Semiconductor Engineering
Sponsor
Circuit-Technology-Center

Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center
Detecting Chemical Variability At Advanced Nodes
As semiconductor nodes shrink to angstrom scales and chiplet integration expands, hidden material variations increasingly threaten yield and reliability. Engineers deploy molecular analysis, circuit monitoring & AI-driven telemetry to catch subtle chemical & interface defects early.
Semiconductor Engineering
Meta rolls out in-house AI chips weeks after massive Nvidia, AMD deals
Meta unveiled four in-house AI chips under its MTIA program to boost data center efficiency. The company deployed MTIA 300 and plans MTIA 400, 450 and 500 for generative AI inference while reducing reliance on costly GPUs.
CNBC
Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
Improving Yield Through Shared Data
Advanced packaging, multi-die designs & rising device counts are increasing chip testing complexity & affecting yield, time to market, and costs. Siemens EDA's Jayant D'Souza highlights the need for secure data sharing among chipmakers, fabs & OSATs to address these challenges.
Semiconductor Engineering
Sponsor
Balazs-Nanoanalysis

Analytical Solutions
Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions.
Balazs Nanoanalysis
Today's Sponsor
Master-Bond
Sponsor
Master-Bond

High Temperature Resistant, Die Attach Epoxy
Master Bond EP17HTS-DA is an electrically conductive die attach epoxy that meets NASA low outgassing specifications and offers high temperature resistance.
Master Bond
Test Your Knowledge
What science deals with the motion of projectiles?
See answer below.
SEIKA-America
Quote of the Day
"One machine can do the work of fifty ordinary men. No machine can do the work of one extraordinary man."
Elbert Hubbard
Sponsor
kyzen

IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
Industry Calendar
Mar 16, 2026
EOS, ESD and How to Differentiate | Munich, Germany
Semitracks
Mar 19, 2026
Semiconductor Reliability and Product Qualification | Munich, Germany
Semitracks
Mar 25, 2026
SEMICON China 2026
SEMI
Mar 31, 2026
MEMS & Sensors Executive Congress—MSEC
SEMI
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
FULL INDUSTRY CALENDAR
EV-Group
Cartoon of the Day
Cartoon
"It's supposed to be inspirational, but most employees see it as permission to take a nap."
Copyright © Randy Glasbergen
Sponsor
StratEdge-Corporation

Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
AI-Technology-Inc
Test Your Knowledge Answer
What science deals with the motion of projectiles?
Answer: Ballistics