semiconductor
packaging news
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
Industry Press
Power Efficient PCIe Gen5 NVMe Enterprise SSD Controller for Data Center Boot Drives
SiliconMotion
Kaman Measuring Highlights Family of Precision Measuring Systems
Kaman
CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics
CEA-Leti
Dr. Brewer Inducted into Missouri Manufacturers Hall of Fame
Brewer Science, Inc.
ASMPT at OFC 2026 Los Angeles
ASMPT
Empower Semiconductor Showcases Vertical Power Delivery Innovations at APEC 2026
Empower Semiconductor
FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders
FAMES
IBM and Lam Research Announce Collaboration to Advance Sub-1nm Logic Scaling
IBM
MORE INDUSTRY PRESS
Sponsor
MRSI

Advanced Packaging: Flexible Die Bonder
Featuring a large, versatile working area, the MRSI-705 die bonder handles many input and output types, including 300mm wafers.
MRSI
Henkel-AG-Co
What Year Was It?
U.S. Army Launches K-9 Corps
What Year
The Quarter­master Corps of the United States Army begins training dogs for the newly established War Dog Program, or "K-9 Corps."
See the answer below.
Akrometrix
Sponsor
SEMI

SEMICON China 2026: Shanghai March 25-27
Sessions and forums on advanced packaging, materials, power, design, supply chain, smart manufacturing, sustainability, and more.
SEMI
Advanced-Component-Labs
Sponsor
CyberOptics

A Universal AI-Powered Segmentation Model
A new universal deep learning model enhances automated optical inspection by accurately segmenting images for both PCBAs and semiconductors. It boosts defect detection efficiency, simplifies model management & supports auto-programming.
Nordson Test and Inspection
What Year Was It Answer
U.S. Army Launches K-9 Corps
Answer: March 13, 1942
March 13, 2026
image
The Silicon Hegemon
Taiwan dominates advanced chip manufacturing, producing about 92% of sub-5-nm logic chips as TSMC leads the sector. Founded by Morris Chang, the foundry model powers firms like Nvidia and widens the gap with Samsung Electronics and Intel.
EE Times
Sponsor
XYZTEC

Magazine loader to test lead frames
Hands-free automatic bond testing with a Sigma MAG magazine handler. Optional with SEMI S2 safety cabinet and/or loadport for top and front-loading (OHT and AGV).
xyztec
India plans new fund to back domestic chipmaking
India plans to launch a ₹1 trillion ($10.8 billion) semiconductor fund within months to boost chip design, manufacturing equipment, and supply chains, as Narendra Modi pushes to build domestic capacity and attract global chipmakers while rival nations like Japan also expand investments.
Taipei Times
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
Sponsor
DL-Technology

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
Scale-Up, Scale-Out Get a New Partner
AI and HPC demands are pushing data centers past single‑rack limits, accelerating new scaling models. Experts outline scale‑up, scale‑out, and scale‑across designs that tackle latency, jitter, and resource‑distribution challenges in distributed computing.
Semiconductor Engineering
NVIDIA May Offer First Look at Feynman at GTC 2026, TSMC A16 and Taiwan Supply Chain in Focus
NVIDIA may preview new AI technology at GTC 2026 tied to its future Feynman chip, expected in 2028 on a 1nm-class process. The project could boost Taiwan's semiconductor supply chain as TSMC expands advanced node capacity to meet AI GPU demand.
TrendForce
Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
Nordson-ASYMTEK

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions
Google Makes First Appearance in Samsung’s Top Five Clients in 2025 amid Soaring TPU Demand
Samsung Electronics reshaped its customer mix in 2025 as Google entered its top five clients, replacing Verizon, highlighting booming AI memory demand. Sales to Big Tech lifted Americas revenue to nearly 40% of total, while China's share fell.
TeendForce
Samsung Semiconductor Technology Leaks to China Persist
South Korea is seeing a surge in semiconductor tech leaks as Samsung and SK hynix engineers are lured to China's ChangXin Memory Technologies, driving record arrests and intensifying fears that weak legal protections can't match lucrative overseas recruitment.
Business Korea
Sponsor
Tresky

Contract service: DIE Bonding prototyping & small series production
Our services reduce time-to-market. We can quickly produce small batches on demand without you having to build up production capacities. Learn more.
Tresky Automation
At MWC, Ericsson Details AI-Native 6G Timeline
Mobile World Congress 2026 saw Ericsson outline its 6G roadmap, advancing standards in 3rd Generation Partnership Project while promoting AI-native networks, distributed computing, AI-ready hardware, and ecosystem collaborations to prepare for commercialization later this decade.
EE Times
CPO Is Extending The Limits Of What's Possible In AI Data Centers
AI data centers are adopting co-packaged optics (CPO) to replace copper links, placing optical connections near chips to cut electrical losses, boost bandwidth, and reduce energy per bit. Hyperscalers and major chip firms drive adoption to meet AI's power and infrastructure demands.
Semiconductor Engineering
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
AI Power on the Edge
Edge AI prioritizes power efficiency, size, and cost over the large-scale compute focus of cloud training. Engineers increasingly co-design hardware, memory, and software to minimize energy use, reduce data movement, and optimize architectures for battery-powered devices.
Semiconductor Engineering
Customizing Foundation IP For Ultra-Low-Voltage Designs
Synopsys helped a customer develop a low-voltage chip for optical networks powering Edge AI by customizing its Foundation IP. Engineers redesigned memory compilers, improved bit cells, and enhanced dual-rail support to achieve reliable operation at 0.4 volts within an 8-month timeline.
Semiconductor Engineering
Sponsor
MicroCircuit-Laboratories-LLC

Hermetic Package Seam Seal with HDHS® Technology
Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS.
MicroCircuit Laboratories, LLC
The memory stock cycle of boom-bust-repeat is over, executives say
AI spending boom is reshaping the memory market, sending shares of Micron & Sandisk soaring & pushing prices higher as demand for AI infrastructure outstrips supply. Executives at Hewlett Packard, Seagate Technology & SK Hynix say long-term contracts & shortages will persist.
CNBC
Sponsor
Ontos-Equipment-Systems

OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
Today's Sponsor
Pac-Tech
Sponsor
Pac-Tech

Achieve Precision in WLCSP Bumping
Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts.
PacTech
Test Your Knowledge
Munich is on which river?
See answer below.
Uyemura
Quote of the Day
"He thought the formula for water was H-I-J-K-L-M-N-O (H-to-O)."
Unknown
Sponsor
Circuit-Technology-Center

Cold Precision Milling for Underfilled BGA Removal
Traditional thermal removal methods for underfilled BGAs risk pad cratering, substrate delamination, and damage to nearby circuitry.
Circuit Technology Center
Industry Calendar
Mar 16, 2026
EOS, ESD and How to Differentiate | Munich, Germany
Semitracks
Mar 19, 2026
Semiconductor Reliability and Product Qualification | Munich, Germany
Semitracks
Mar 25, 2026
SEMICON China 2026
SEMI
Mar 31, 2026
MEMS & Sensors Executive Congress—MSEC
SEMI
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
FULL INDUSTRY CALENDAR
Surfx-Technologies
Cartoon of the Day
Cartoon
"We're implementing new security standards in the office, so don't forget to use the ecret-say ode-cay!"
Copyright © Randy Glasbergen
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Balazs-Nanoanalysis
Test Your Knowledge Answer
Munich is on which river?
Answer: The Isar. Its source is in the Karwendel range of the Alps and reaches the Danube near Deggendorf.