semiconductor
packaging news
Sponsor
Surfx-Technologies

How heterogenous packaging benefits from atmospheric argon plasma
Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications.
Surfx Technologies
Industry Press
Seika Machinery Introduces the Laboratory Roll-to-Roll Coater (LR2RC) by infinityPV
Seika Machinery
405 nm OEM Laser for High-Accuracy Raman Spectroscopy
TOPTICA Photonics SE
PEMTRON Brings Next-Gen X-ray and Wafer Inspection Technologies to SEMICON Southeast Asia 2026
PEMTRON
Indium Presents Collaborative Research on Solder Alloy Reliability for HI at ICEP-HBS
Indium Corporation
Brewer Science Earns 2026 USA TODAY Top Workplaces Award
Brewer Science, Inc.
Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer
Aehr Test Systems
Silicon Carbide Heating Elements Help Optimize Electronics Manufacturing Processes
M-Kube Enterprise LLC
PacTech Launches Scalable Modular Wet-Bench System for Advanced Semiconductor Packaging
Pactech
MORE INDUSTRY PRESS
Sponsor
MicroCircuit-Laboratories-LLC

Seam Seal Hermetic Packages with Auer Carriers and 3D Trays
MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing.
MicroCircuit Laboratories, LLC
Brewer-Science
What Year Was It?
Castro Announces Mariel Boatlift
What Year
The Castro regime announces that all Cubans wishing to emigrate to the U.S. are free to board boats at the port of Mariel west of Havana, launching the Mariel Boatlift.
See the answer below.
Balazs-Nanoanalysis
Sponsor
CyberOptics

Award Winning Acquisition Mode Dynamic Planar CT
Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure.
Nordson Test & Inspection
Master-Bond
Sponsor
Ontos-Equipment-Systems

Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
What Year Was It Answer
Castro Announces Mariel Boatlift
Answer: April 20, 1980
April 21, 2026
Apple taps John Ternus as CEO to replace Tim Cook, who will become chairman
Apple named hardware chief John Ternus as CEO, replacing Tim Cook, who becomes executive chairman on September 1. Ternus joins the board while Apple promotes Johny Srouji. The company faces AI competition and supply-chain challenges.
CNBC
Sponsor
Indium-Corporation

Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
Marvell pops on report it will help Google with custom AI chips. Broadcom shares sink
Marvell Technology shares rose nearly 6% after reports that Google will use it for new AI chips, including a TPU and memory processing unit, diversifying away from Broadcom amid booming demand for custom AI accelerators.
CNBC
Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
Technical Paper
Sponsor
Circuit-Technology-Center

Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
Circuit Technology Center
Amazon to invest up to another $25 billion in Anthropic as part of AI infrastructure deal
Amazon invests up to $25 billion more in Anthropic, deepening a partnership tied to over $100 billion in AWS spending over a decade. Anthropic commits to Trainium chips and 5 GW capacity, scaling Claude models amid fierce AI infrastructure competition.
CNBC
Positron AI Enters Nvidia Turf With Oracle Deal
AI chip startup Positron challenges Nvidia in data centers by supplying Oracle with inference systems for mixture-of-experts workloads. The move highlights growing competition from new entrants targeting inference chips, as demand and investment in AI compute rapidly expand.
EE Times
Sponsor
Muhlbauer

Die Sorting with AI-supported AOI and Infrared Inspection
See Muehlbauer's DS Merlin 60K running live at Semicon SEA, Booth #1811. The world's benchmark in die sorting: ultra-high-speed technology with AI-driven vision inspection down to 1 µm resolution.
Muehlbauer
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
Nordson-ASYMTEK

Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
The hidden gap that could derail the future of 2D semiconductor chips
Researchers at TU Wien show many promising 2D materials fail for chip miniaturization because van der Waals gaps with insulating layers weaken performance. Their findings help identify viable materials and promote “zipper” designs that integrate semiconductors and insulators.
Nano Werk
Why AI Is Redefining the Future of Commercial Power Infrastructure
AI is reshaping commercial power infrastructure, pushing companies to redesign distribution systems for variable, high-density workloads. Businesses adopt modular designs, real-time monitoring, energy storage, and integrated cooling to manage rising demand, reduce failures, and improve efficiency.
EE Times
Sponsor
Intraratio-Corporation

Discover Real Operational Strategies from Proven Global Leaders
In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required.
Intraratio
YMTC’s NAND Design Surprise Alongside a New Fab
YMTC expands new fabs in Wuhan despite US sanctions, sourcing over half equipment locally, to mass-produce advanced NAND and DRAM chips amid AI-driven memory shortages. The company challenges Samsung, SK Hynix, Micron, and Kioxia, while boosting China’s semiconductor self-sufficiency.
EE Times
Why Proof Convergence Matters
Semiconductor verification struggles to deliver deterministic yes-or-no results as chip complexity grows with more cores, interactions, and AI-designed chips. Ashish Darbari of Axiomise highlights safety and security interactions, pattern-based bug prevention, and methods to improve coverage and speed sign-off.
Semiconductor Engineering
Sponsor
Henkel-AG-Co

Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Batteries Charge To The Edge
Advances in battery chemistry and materials science enable higher capacity, faster charging, and improved safety by reducing thermal runaway risk. Companies race toward solid-state and new electrolytes, but testing, thermal management, and manufacturing challenges slow widespread commercialization across industries.
Semiconductor Engineering
India’s first 3D semiconductor packaging unit signals a deeper shift in the chip supply chain
India advances its semiconductor ambitions as Odisha hosts its first advanced 3D chip packaging facility by 3D Glass Solutions. The project shifts focus from assembly to IP-heavy glass-based packaging for AI and computing, strengthening domestic ecosystem and supply chains.
CRN Asia.com
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
The global semiconductor talent shortage
Semiconductor shortages drive major US and EU investments like the CHIPS Act to expand production and talent pipelines. As the industry heads toward $1 trillion by 2030, companies and governments race to address a growing global skills shortage.
Deloitte
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Today's Sponsor
XYZTEC
Sponsor
XYZTEC

Xyztec's virtual reality showroom
Feel free to move around in the interactive xyztec showroom and discover all bondtesters and services with a mouse click. Watch product videos, brochures, and manuals. Explore xyztec!
xyztec
Test Your Knowledge
During its earliest days in development, Windows was known by what name?
See answer below.
Plasmatreat-GmbH
Quote of the Day
Problems are only opportunities in work clothes.
Henry Kaiser
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
Industry Calendar
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
May 12, 2026
iMAPS New England 52nd Symposium
iMAPS
FULL INDUSTRY CALENDAR
SEMI
Cartoon of the Day
Cartoon
"How come you never bring me any of your stupid ideas anymore?"
Copyright © Randy Glasbergen
Sponsor
ECTC

2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
Plasma-Etch
Test Your Knowledge Answer
During its earliest days in development, Windows was known by what name?
Answer: "Interface Manager," which was First developed in 1981 by computer scientist Chase Bishop who named the software project. Marketers at Microsoft later decided that the name "Windows" was more consumer-friendly.