Sep 22, 2026 The Silicon Heartland Wants To Be America's Next Chip Powerhouse The U.S. Midwest is building a semiconductor hub as Intel, SK hynix and regional firms expand investments. Research, manufacturing infrastructure, supply chains and workforce programs are strengthening the region's integrated ecosystem and growth. Semiconductor Engineering

Sponsor Next-Generation Epoxy Dispenser Introducing our latest ultra-high-speed, flexible solution capable of multiple dispensing methods & materials. 10µm accuracy available with 175Ag+ model. MRSI

Intel Unveils Micro-LED-Based Glass Substrate Packaging Technology Patent Intel disclosed a patent for glass-substrate packaging with embedded Micro LEDs powered through TGVs. The architecture could enable package-level indicators and lighting while advancing Intel's glass-core roadmap for AI and HPC chips. TrendForce

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. Technical Paper

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

TSMC Plans Mini-Loop at Kaohsiung to Speed CoWoS Tool Validation; Reportedly Eyes AUO Site for CoPoS TSMC is expanding supply-chain validation as AI drives CoWoS growth, using a Mini-Loop to test equipment before production. The company is also advancing CoPoS, glass substrates and TGVs to support larger AI packages and boost yields overall. TrendForce

Advanced packaging to drive AI chip boom Malaysia could deepen its semiconductor role by expanding advanced packaging as AI chip demand strains global capacity. Its skilled workforce, industrial land, neutrality and government support could attract more investment. The Star

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.

Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor Thank You, SEMICON Taiwan! Thank you to everyone who visited Muehlbauer at the Bavarian Pavilion and joined our presentation "AI, Sub-Micron Vision & Autonomous Manufacturing." Muehlbauer – serving billions of people. every day. Muehlbauer

Singapore: Turning Quantum Research into Business Opportunity Singapore is accelerating quantum commercialization with government funding, research infrastructure, semiconductor capabilities and talent programs. Its National Quantum Strategy advances computing, fabrication, sensing and communications. EE Times

Scaling Physical AI Deployment Beyond the Demo Vision-Language-Action models are advancing robotics with adaptable, language-driven control, but deployment faces compute, inference, real-time, safety and hardware hurdles. Intel's OpenVINO and π0.5 help bridge research and practical Physical AI. EE Times

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

China's DRAM Specialist CXMT Eyes NAND Flash Entry CXMT is preparing to enter NAND flash as AI-driven demand intensifies global memory shortages. The Chinese DRAM maker is developing NAND technology in Beijing, seeking to diversify its portfolio, reduce domestic supply risks, and challenge established global memory leaders. EE Times

AI, Crypto Mining Expose Global Compute Infrastructure Constraints Europe's AI and crypto expansion faces chip shortages, limited advanced-node capacity and aging power grids. Specialized ASICs are gaining importance, while energy costs push data centers toward modular generation and alternative power sources. EE Times

Sponsor Amkor's Double Sided Molded BGA Solutions To improve the integration of RFFE solutions, Amkor offers a DSMBGA package that allows molded assembly of components on both sides of the substrate. Amkor Technology, Inc.

IBM Takes a Billion-Dollar Step Toward Becoming Quantum's Foundry King The U.S. government awarded IBM subsidiary Anderon $1 billion to build America’s first pure-play quantum wafer foundry. IBM will invest another $1 billion, targeting commercial production of superconducting qubit arrays and quantum components at its New York facility. The Daily Upside

Direct imaging reveals how defects reshape Wigner solids in 2D semiconductors Berkeley Lab researchers imaged how defects affect electron Wigner solids in 2D semiconductors. Quantum Monte Carlo simulations showed defect density and type can stabilize disorder or trigger melting, guiding future miniaturized device design. Nanowerk

Sponsor Ultra-Thin Wafer Handling Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps. Brewer Science

The $2.3 trillion horizon: How AI is rewriting the semiconductor story AI-driven demand is propelling semiconductors into unprecedented growth, with sales surging and market revenue exceeding $1 trillion. Analysts now project a $2.3 trillion market by 2030, driven by rising chip prices, constrained supply and expanding data centers. McKinsey and Company

Sponsor Precision, Flexibility & Speed: MRSI-H-LD Achieve high-speed, high-precision photonics assembly with the MRSI-H-LD. Ideal for lasers, transceivers, and advanced packaging applications. MRSI Mycronic

Chip Industry Week In Review Semiconductor consolidation and AI-driven innovation are reshaping the industry as Infineon sells memory businesses to Winbond and Applied Materials, IBM, Fujifilm and Tata expand capacity. Rising 2nm design costs add pressure across global markets. Semiconductor Engineering