semiconductor
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Tresky

DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
Industry Press
StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336
StratEdge
SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair
SEMI
Smoltek Surpasses 1 Microfarad per Square Millimeter Capacitance Milestone
Smoltek
Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission
Imec
Surfx Technologies Acquired by Mycronic Advancing Heterogeneous Packaging
Surfx Technologies, LLC
Nordson Electronics Solutions develops panel-level packaging solution for Powertech Technology, Inc.
Nordson Electronics Solutions
SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements
SEMI
Smoltek Semi – clear path towards commercialization of capacitor technology
Smoltek
MORE INDUSTRY PRESS
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Amkor-Technology

Analysis Of Multi-Chiplet Package Designs and Requirements
This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows.
Amkor Technology
Master-Bond
What Year Was It?
First Roller Coaster in America Opens
What Year
The first roller coaster in America opens at Coney Island, in Brooklyn, New York. It traveled approximately six miles per hour and cost a nickel to ride.
See the answer below.
QPT
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
EV-Group
Sponsor
Brewer-Science

Temporary Bonding Materials
Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications.
Brewer Science
What Year Was It Answer
First Roller Coaster in America Opens
Answer: June 16, 1884
June 16, 2025
image
Taiwan Backlists Huawei and SMIC
Taiwan has blacklisted Huawei and SMIC, tightening restrictions on AI chip tech exports. The move blocks access to key semiconductor tools, striking a blow to China's ambitions and escalating cross-strait tech and political tensions.
Taipei Times
Sponsor
XYZTEC

How to Tweezer Pull
Learn how to perform an optimal Pull/Peel test using Tweezers. This guide covers test method settings and failures modes for Tweezer Pull/Peel testing. Download it now.
xyztec
Chip Industry Week in Review
China unveiled an AI chip design system to speed up semiconductor development, while Micron boosted U.S. investment plans to $200B. AMD launched powerful MI350 GPUs, and Harvard warned the U.S. tech lead is narrowing globally.
Semiconductor Engineering
The Economics of Electronic Component Salvage and Reuse
This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.
Technical Paper
Sponsor
Pac-Tech

A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech
SK Hynix unveils 30-Year DRAM roadmap with Vertical Gate, 3D stack in bid to extend Moore's Law
SK Hynix revealed a 30-year roadmap for next-gen DRAM, spotlighting sub-10nm tech, vertical gate architecture, and 3D DRAM at IEEE VLSI. The plan aims to overcome scaling limits and drive sustainable semiconductor innovation.
Digitimes
Samsung, TSMC set stage for fierce race in 2nm chip tech
TSMC and Samsung plan to begin mass production of 2nm chips in late 2025, intensifying the semiconductor race. Meanwhile, Intel bets on its 1.8nm process to revive its foundry business and challenge both rivals.
The Korea Herald
Sponsor
BTU-International

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International
Technical Papers
Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification
The Evolution of Inspection and Metrology in the AI Era
The Economics of Electronic Component Salvage and Reuse
How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing
Reducing CTE Mismatch Defects in Flip Chip Reflow
Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
MORE TECHNICAL PAPERS
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Plasma-Etch

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
ASMedia bullish on AMD desktop chip demand
ASMedia expects stronger Q3 revenue, driven by rising USB 4.0 demand and AMD's desktop chip gains over Intel. Its Techpoint acquisition and chipset business will jointly fuel growth, with a record-high NT$30 dividend approved.
Taipei Times
Almost all India iPhones sent to US
Apple ramped up iPhone exports from India to the U.S., with Foxconn shipping 97% of its $3.2B output there since March—up from 50% last year—as Apple accelerates efforts to bypass rising China tariffs.
Taipei Times
Sponsor
kyzen

IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
EnCharge Picks The PC For Its First Analog AI Chip
EnCharge AI unveiled its EN100 analog AI accelerator, delivering 200 TOPS performance with over 40 TOPS/W efficiency. Using capacitor-based compute-in-memory, it enables large AI models to run locally on laptops and PCs under tight power constraints.
EE Times
Huawei's AI semiconductor output limited to 200,000 in 2025, US commerce official says
A U.S. official estimates Huawei will ship under 200,000 AI chips in 2025, far behind Nvidia's 1 million China-specific GPUs. Despite sanctions, officials warn China's AI chip development is rapidly advancing and should not be underestimated.
South China Morning Post
Sponsor
Balazs-Nanoanalysis

Analytical Solutions
Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions.
Balazs Nanoanalysis
Huawei's HarmonyOS gains traction in China with 103 million smartphones shipped
Huawei has shipped over 103 million HarmonyOS smartphones and 21 million tablets, with nearly half in 2024, accelerating its pivot from Android. It also launched HarmonyOS laptops, pushing for platform autonomy amid ongoing U.S. tech sanctions.
South China Morning Post
SEMI appoints Tien Wu as new Chairman of international board of directors
SEMI appointed ASE Group COO Tien Wu as Chairman and Comet's Benjamin Loh as Vice Chairman of its International Board. The new leaders aim to boost global collaboration, innovation, and policy advocacy in the semiconductor industry.
Digitimes
Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
RISC-V's Increasing Influence
RISC-V's open architecture is gaining momentum across industries, offering flexibility for evolving workloads and gradual migration from legacy systems. While skeptics remain, its customizability and growing ecosystem are pushing it into mainstream applications.
Semiconductor Engineering
Sponsor
Ontos-Equipment-Systems

The Next Step in Surface Prep!
All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated
surfaces without a vacuum chamber.
Ontos Equipment Systems
Today's Sponsor
Circuit-Technology-Center
Sponsor
Circuit-Technology-Center

Tech Paper - Keys to Component Lead Tinning Success
This paper explores the challenges and best practices of component tinning, emphasizing temperature control, flux selection, and soldering techniques. Download this free tech paper.
Circuit Technology Center
Test Your Knowledge
What is an Integrated Circuit?
See answer below.
Indium-Corporation
Quote of the Day
"I am proud of the fact that I never invented weapons to kill."
Thomas Edison
Sponsor
Surfx-Technologies

Particle-Free Plasma Oxide Reduction
Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder.
Surfx Technologies
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Sep 1, 2025
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Dr.-Tresky-AG
Cartoon of the Day
Cartoon
"I'll keep your resume on file, but I don't have much need for an information systems analyst at this time."
Copyright © Randy Glasbergen
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology
CyberOptics
Test Your Knowledge Answer
What is an Integrated Circuit?
Answer: An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon. The integration of large numbers of tiny transistors into a small chip results in circuits that are orders of magnitude smaller, less expensive, and faster than those constructed of discrete electronic components.