April 21, 2026

Apple taps John Ternus as CEO to replace Tim Cook, who will become chairman Apple named hardware chief John Ternus as CEO, replacing Tim Cook, who becomes executive chairman on September 1. Ternus joins the board while Apple promotes Johny Srouji. The company faces AI competition and supply-chain challenges. CNBC

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

Marvell pops on report it will help Google with custom AI chips. Broadcom shares sink Marvell Technology shares rose nearly 6% after reports that Google will use it for new AI chips, including a TPU and memory processing unit, diversifying away from Broadcom amid booming demand for custom AI accelerators. CNBC

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Remove Underfilled BGAs Without the Risk Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal. Circuit Technology Center

Amazon to invest up to another $25 billion in Anthropic as part of AI infrastructure deal Amazon invests up to $25 billion more in Anthropic, deepening a partnership tied to over $100 billion in AWS spending over a decade. Anthropic commits to Trainium chips and 5 GW capacity, scaling Claude models amid fierce AI infrastructure competition. CNBC

Positron AI Enters Nvidia Turf With Oracle Deal AI chip startup Positron challenges Nvidia in data centers by supplying Oracle with inference systems for mixture-of-experts workloads. The move highlights growing competition from new entrants targeting inference chips, as demand and investment in AI compute rapidly expand. EE Times

Sponsor Die Sorting with AI-supported AOI and Infrared Inspection See Muehlbauer's DS Merlin 60K running live at Semicon SEA, Booth #1811. The world's benchmark in die sorting: ultra-high-speed technology with AI-driven vision inspection down to 1 µm resolution. Muehlbauer

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Explore Reliable Solutions for WLP & PLP For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions. Nordson Electronics Solutions

The hidden gap that could derail the future of 2D semiconductor chips Researchers at TU Wien show many promising 2D materials fail for chip miniaturization because van der Waals gaps with insulating layers weaken performance. Their findings help identify viable materials and promote “zipper” designs that integrate semiconductors and insulators. Nano Werk

Why AI Is Redefining the Future of Commercial Power Infrastructure AI is reshaping commercial power infrastructure, pushing companies to redesign distribution systems for variable, high-density workloads. Businesses adopt modular designs, real-time monitoring, energy storage, and integrated cooling to manage rising demand, reduce failures, and improve efficiency. EE Times

Sponsor Discover Real Operational Strategies from Proven Global Leaders In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required. Intraratio

YMTC’s NAND Design Surprise Alongside a New Fab YMTC expands new fabs in Wuhan despite US sanctions, sourcing over half equipment locally, to mass-produce advanced NAND and DRAM chips amid AI-driven memory shortages. The company challenges Samsung, SK Hynix, Micron, and Kioxia, while boosting China’s semiconductor self-sufficiency. EE Times

Why Proof Convergence Matters Semiconductor verification struggles to deliver deterministic yes-or-no results as chip complexity grows with more cores, interactions, and AI-designed chips. Ashish Darbari of Axiomise highlights safety and security interactions, pattern-based bug prevention, and methods to improve coverage and speed sign-off. Semiconductor Engineering

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

Batteries Charge To The Edge Advances in battery chemistry and materials science enable higher capacity, faster charging, and improved safety by reducing thermal runaway risk. Companies race toward solid-state and new electrolytes, but testing, thermal management, and manufacturing challenges slow widespread commercialization across industries. Semiconductor Engineering

India’s first 3D semiconductor packaging unit signals a deeper shift in the chip supply chain India advances its semiconductor ambitions as Odisha hosts its first advanced 3D chip packaging facility by 3D Glass Solutions. The project shifts focus from assembly to IP-heavy glass-based packaging for AI and computing, strengthening domestic ecosystem and supply chains. CRN Asia.com

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

The global semiconductor talent shortage Semiconductor shortages drive major US and EU investments like the CHIPS Act to expand production and talent pipelines. As the industry heads toward $1 trillion by 2030, companies and governments race to address a growing global skills shortage. Deloitte

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS