Nov 3, 2026 TSMC's Overseas Expansion is a Necessity, Not a Choice TSMC's global expansion across the US, Japan and Europe reflects its dependence on an interconnected semiconductor supply chain. Geopolitical pressures, customer demands, economic realities and logistics make overseas investments essential to sustaining its business. Taipei Times

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

TSMC Reportedly Eyes Potential US$45B Fab Expansion in Sherman, Texas, Raising Stakes for Samsung TSMC is reportedly considering a $45 billion Sherman, Texas, expansion, intensifying competition with Samsung for semiconductor talent, infrastructure, suppliers and AI chip manufacturing capacity. TrendForce

Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Technical Paper

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Intel Cuts Intel 3, 18A Costs by ~15%, ~40% Since 1Q; Confirms Nova Lake to Use 18A-P Intel is improving 18A yields and cutting costs as server CPU demand accelerates. The company is reallocating fab capacity to data centers while advancing its 18A-P and 14A processor roadmaps. TrendForce

Intel foundry push faces critical test after stock's 45% plunge in October Intel faces mounting pressure to revive its foundry business after a historic stock plunge and weakening PC demand. Capacity shortages, delayed projects and a lack of major external customers threaten its ambitions to challenge TSMC. CNBC

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Technical Papers ■ The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days MORE TECHNICAL PAPERS

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

Canada's Quantum Sector Sets Sights on Commercialization Canada is accelerating quantum commercialization through funding, defence partnerships and industry investment, developing scalable computers, sensing technologies and domestic manufacturing to retain expertise and economic value. EE Times

China's EDA champion buys start-up to address weak link, support Huawei's Tau Scaling Law Empyrean Technology will acquire a 50.38% stake in Easy-Logic Technology for US$33 million, strengthening China's domestic EDA capabilities. The deal supports Huawei’s advanced chip ambitions and Beijing's push to reduce reliance on Western semiconductor technologies. South China Morning Post

Sponsor Electrically Insulating, Toughened Epoxy Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened epoxy system that transfers heat effectively and can be used for bonding, sealing, coating, potting and glob topping. Master Bond

China's CXMT defends bet on risky new DRAM architecture to circumvent US chip curbs CXMT plans to introduce 4F² server-grade DRAM samples by year-end, pursuing higher memory density without advanced EUV lithography. While Micron rejects the architecture over cost and complexity, China's chipmaker sees it as a strategic alternative. South China Morning Post

A flexible new route to designer materials built from nanoparticles MIT researchers developed a nanoparticle assembly technique that creates novel crystal structures, potentially advancing scalable, high-performance materials for electronics, medicine, energy storage and catalysis. MIT News

Sponsor Die-Module Attach for High Power Devices High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding. AI Technology, Inc.

Jevons' Paradox and the Silicon Roadmap AI infrastructure investments face profitability risks from chip depreciation, rising costs and uncertain returns, while falling AI costs, specialized workloads and evolving silicon roadmaps could unlock future demand and growth. EE Times

Shift Left Is Becoming A System-Level Problem Semiconductor leaders examine how shift-left strategies are advancing system-level validation and how AI can improve chip design, verification efficiency and overall system reliability. Semiconductor Engineering

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology

Putting AI To The Test AI-driven semiconductor verification tools show promise but still miss critical design defects, according to independent testing of three leading LLMs. The findings highlight inconsistent results, limited capabilities, and the continuing importance of human engineering oversight. Semiconductor Engineering

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

Samsung tops global smartphone market in Q3 despite shipment decline Samsung retained its position as the world’s largest smartphone vendor in the third quarter, shipping 57.8 million devices despite a market downturn. Strong Galaxy A series sales and premium Galaxy Z Fold 8 demand supported its performance, ahead of Apple. Yonhap News Agency