May 26, 2026

AMD to Promote Packaging Ecosystem AMD invests $10 billion in Taiwan's microchip packaging ecosystem to expand advanced capacity for surging AI demand. It develops EFB technology alongside CoWoS alternatives, partnering with local firms, as CEO Lisa Su projects sustained AI growth through 2029. Taipei Times

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

U.S. Quantum Bet Puts Hardware First, But Utility Remains the Test U.S. Commerce backs nine quantum firms with $2.013 billion CHIPS Act incentives, expanding support across foundries and competing hardware modalities. The initiative accelerates domestic quantum manufacturing, but industry must still prove real-world applications & enterprise value. EE Times

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

Sponsor SB²®-Jet: Your Soldering Game-Changer SB²®-Jet offers high-precision solder ball jetting technology, handling ball diameters from 40µ-760µm. Perfect for flip chip, PCB, reballing, BGA, CSP applications. PacTech

Huawei touts chip breakthrough to close TSMC gap Huawei says it plans to narrow its semiconductor gap with TSMC by developing LogicFolding and a new scaling law, targeting 1.4-nanometer chips by 2031, while TSMC aims for 2028, potentially bypassing reliance on advanced EUV lithography. Taipei Times

ASML plans to hire 1,000 in Taiwan to meet client demand growth ASML plans to hire 1,000 additional employees in Taiwan this year, up from 600, to meet rising client demand. It will strengthen customer support, manufacturing and supply chain roles, supporting EUV production and major customers like TSMC. Taipei Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Wafer supplier seeks price rise as costs increase GlobalWafers plans wafer price hikes in the second half of the year as geopolitical tensions, energy and raw material costs rise. Strong AI and industrial demand and full utilization support sales, but higher expenses and depreciation pressure profitability. Taipei Times

Pavona Launches Open Hardware Ecosystem for Secure Chips Pavona, launched by GlobalPlatform with zeroRISC's Dominic Rizzo, builds a modular open hardware ecosystem with reference designs and tools to simplify chip integration. It targets secure, standardized silicon for IoT & data centers, driven by AI, quantum & regulatory demand. IEEE Spectrum

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

Data Centers in Space: A Brilliant Idea or Delusional? Tech companies are exploring orbital data centers powered by solar energy, but experts warn that extreme launch costs, heat dissipation limits, and operational complexity make the concept highly impractical, suggesting it may remain an expensive, attention-grabbing but unviable idea. EE Times

Taiwan, China wafer foundry industry, 2Q 2026: Cross-strait revenues to surge over 25% Wafer foundry revenues in Taiwan and China grew in Q1 2026 despite seasonal weakness, driven by AI demand and policy support. Strong utilization and pricing momentum are expected to push both markets over 10% quarterly growth in Q2 and 25% annual growth. Digitimes

Sponsor Thermally Conductive, Low Outgassing Epoxy Master Bond EP54TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively. Master Bond

Qualcomm's stock pop shows investors are 'waking up' to boom in AI devices Qualcomm shares surged 12% on Friday and 75% in a month as investors embrace its role in the physical AI boom. The company expands into connected devices, automotive systems, edge AI, and upcoming data center chips. CNBC

U.S. Injects $2B into Quantum Computing Companies The U.S. government awarded $2 billion in CHIPS Act grants to nine quantum computing firms, including IBM, while taking equity stakes. The investment speeds commercialization, strengthens supply chains and boosts quantum tech's national security role. EE Times

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

Imec Says AI Scaling Needs More Orchestration Across Research, Design, Manufacturing At ITF World 2026, imec CEO Patrick Vandenameele likened AI scaling to an orchestra, urging cross-stack co-design. Microsoft's Rani Borkar and other leaders called for collaboration and standards to manage rising semiconductor and AI complexity. EE Times

Sponsor Plasma as a Key Technology Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®. Plasmatreat GmbH