semiconductor
packaging news
Sponsor
EV-Group

Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
Industry Press
Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
Indium Corporation
New Wafer Inspection and Metrology Platform
Test Research, Inc.
ZEISS and EDGE leverage AI to transform bioimaging in the biopharma industry
ZEISS
ViTrox Showcases AI-Driven Semiconductor & SMT Vision Innovations at SEMICON Southeast Asia 2026
ViTrox Technologies Sdn. Bhd.
MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX® CD 560-1 at SEMICON Southeast Asia 2026
MacDermid Alpha Electronics Solutions
STMicroelectronics brings always-on vision to next-generation personal electronics
STMicroelectronics
Indium Corporation Joins India's IDSPS Industry Consortium Partnership
Indium Corporation
Molybdenum Heating Element Technology Strengthens Process Control in Semiconductor Production
M-Kube Enterprise LLC
MORE INDUSTRY PRESS
Sponsor
Akrometrix

The Global Leader in Warpage Metrology Solutions
We manufacture, sell, & provide Thermal and Room Temperature Warpage System Solutions, and Testing Services for Warpage and Strain.
Akrometrix
CyberOptics
What Year Was It?
World War II Monument Opens in Washington
What Year
The National World War II Memorial opens in Washington, D.C., to thousands of visitors, providing overdue recognition for the 16 million U.S. men and women who served in the war.
See the answer below.
Ontos-Equipment-Systems
Sponsor
Dr.-Tresky-AG

High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
Ormet-TLPS
Sponsor
Intraratio-Corporation

What Would You Ask Proven Global Manufacturing Leaders?
In this 4-part series we asked about: Key Drivers of Success, Scaling Operations Effectively, AI in Manufacturing, and Tools to Empower Operations. No registration Required.
Intraratio
What Year Was It Answer
World War II Monument Opens in Washington
Answer: April 29, 2004
April 30, 2026
US halts orders to Chinese chip firm Hua Hong
US Commerce Department ordered chip equipment makers to halt shipments to China’s Hua Hong Semiconductor and Huali Microelectronics, targeting tools for advanced chip production. The move aims to curb China’s progress in cutting-edge semiconductors and AI chip development.
Taipei Times
Sponsor
Tresky

Motivation for pressure-assisted metallic sintering in Power Electronics
Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics.
Tresky Automation
ASE to raise budget 20 percent this year
ASE Technology raised capital spending 20% to US$1.5 billion, citing stronger-than-expected demand for advanced AI chip packaging. The firm expects higher LEAP revenue growth, expanding capacity and forecasting even greater investment and growth momentum next year.
Taipei Times
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
Technical Paper
Sponsor
Balazs-Nanoanalysis

Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
NXP Semiconductors soars 26%, best day ever after earnings beat
NXP Semiconductors shares surged 26%, their best day since 2010, after the company beat first-quarter earnings and revenue estimates. Strong industrial and automotive demand plus rising data center AI applications boosted growth, prompting analysts to raise price targets.
CNBC
Microsoft calls for $190 billion in 2026 capital spending on soaring memory prices
Microsoft reported stronger-than-expected quarterly results, with revenue rising 18% and net income increasing sharply, while forecasting $190 billion in capital spending driven by soaring memory costs as Azure and AI services fuel cloud growth above expectations.
CNBC
Sponsor
StratEdge-Corporation

Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
MicroCircuit-Laboratories-LLC

FSO Seam Seal Hermetic Packages with AI.
Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories.
MicroCircuit Laboratories, LLC
Alphabet ups 2026 capex to as much as $190 billion, expects to ‘significantly increase’ in 2027
Alphabet reported strong Q1 earnings, topping revenue estimates as cloud surged 20% and AI demand drove growth. Net income jumped 81%. The company raised capital spending guidance to expand AI infrastructure amid compute constraints, boosting shares and investor optimism.
CNBC
AI in Design Verification: Where It Works and Where It Doesn’t
AI now assists IC design verification by improving coverage analysis, regression triage, and bug grouping, reducing engineering effort. However, it cannot replace signoff decisions due to confidence, explainability, and generalization limits, so teams apply it selectively in structured workflows.
EE Times
Sponsor
Plasma-Etch

Convenient Desktop Plasma System
The PE-100 utilizes a capacitive parallel plate design for the most effective plasma generation available. Our systems offer uniform plasma with a low environmental impact at a great value.
Plasma Etch
TSMC exits Arm investment with US$231 million sale
TSMC sold its entire Arm Holdings stake, about 1.11 million shares at $207.65 each, raising $231 million. The divestment generated roughly $174 million in retained earnings, the company disclosed on April 29, 2026, according to its filing.
Digitimes
TSMC CoWoS Wafer ASP Nears 7nm; Advanced Packaging to Become a Key Driver
AI demand is elevating advanced packaging into a critical battleground, with TSMC's CoWoS scarce and priced near $10,000 per wafer. Strong margins, rapid capacity growth, and roadmap advances position packaging as a rising profit driver in the AI chip race.
TrendForce
Sponsor
Surfx-Technologies

Interested in a demonstration?
We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day.
Surfx Technologies
Semiconductor Packaging Services Market Set to Record US$ 107.5 billion by 2033
DataM Intelligence releases its 2026 Semiconductor Packaging Services Market report, outlining regional growth, segmentation, and CAGR forecasts. It tracks top players' revenues, sizes the market by value and volume, and highlights key drivers, emerging opportunities, and outlook.
Open PR
India Semiconductor Mission 2.0
India's ISM 2.0 shifts semiconductor strategy toward mature 28–65nm nodes, backed by over $13 billion, expanding into a full-stack ecosystem. It leverages global partnerships, especially Taiwan, while improving execution, building fabs, talent pipelines, and supply chain resilience.
Taipei Times
Sponsor
DL-Technology

Buy Ceramic Dispensing Needles Online
Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online.
DL Technology
Better Hardware Could Turn Zeros into AI Heroes
Researchers spotlight sparsity in large AI models, where most parameters are zero, enabling skipped computations and compact storage. Stanford's Onyx accelerator leverages this to cut energy use up to 70x versus CPUs while delivering roughly 8x faster performance.
IEEE Spectrum
Sponsor
SEMI

SEMIEXPO Heartland — April 29–30, 2026, Detroit, Michigan
Explore Smart Manufacturing & Mobility in the Midwest, a growing semiconductor hub with $44B+ in investments. Connect, innovate, & lead the future! Click here to register.
SEMI
Today's Sponsor
Amkor-Technology
Sponsor
Amkor-Technology

Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.
Test Your Knowledge
How many bytes are in one megabyte?
See answer below.
AI-Technology-Inc
Quote of the Day
"Strive for excellence, not perfection."
H. Jackson Brown Jr.
Sponsor
Pac-Tech

A study about 3D stacking of passive SMD elements
This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven.
PacTech
Industry Calendar
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
May 12, 2026
iMAPS New England 52nd Symposium
iMAPS
FULL INDUSTRY CALENDAR
Henkel-AG-Co
Cartoon of the Day
Cartoon
"I'd like you to spend more time working and less time peeking over your cubicle."
Copyright © Randy Glasbergen
Sponsor
kyzen

Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN
Circuit-Technology-Center
Test Your Knowledge Answer
How many bytes are in one megabyte?
Answer: 1,048,576 bytes are in one megabyte.