semiconductor
packaging news
Sponsor
Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
Industry Press
Q3 2025 GaN Innovation: KnowMade Releases Its Latest Patent Monitor
KnowMade
Taming AI's hunger for data: Using the smallest technology nodes for energy-efficient AI
Fraunhofer IPMS
The Recap: An Enriched Joint Session in Dresden
TECHCET
STMicroelectronics extends highly integrated VIPerGaN family
STMicroelectronics
Key Management System (KMS) for Quantum-Secure Networks
Fraunhofer Institute for Photonic Microsystems IPMS
Spectrum Scientific Highlights Proven DUV/VUV Coatings with New Vacuum UV Measurement Capability
Spectrum Scientific, Inc.
100V-capable current-sense amplifier from STMicroelectronics
STMicroelectronics
NanoGlue as a key technology for photonics and quantum computing
nanosystec GmbH
MORE INDUSTRY PRESS
Sponsor
StratEdge-Corporation

Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
AI-Technology-Inc
What Year Was It?
Squadron Lost in Bermuda Triangle
What Year
Five U.S. Navy Avenger torpedo-bombers comprising Flight 19 take off from the Ft. Lauderdale Naval Air Station in Florida on a routine three-hour training mission. They never returned.
See the answer below.
Uyemura
Sponsor
Plasma-Etch

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
EV-Group
Sponsor
Circuit-Technology-Center

Tough Engineering Changes? Where Can You Turn?
Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably?
Circuit Technology Center
What Year Was It Answer
Squadron Lost in Bermuda Triangle
Answer: December 5, 1945
December 5, 2025
image
Global Semiconductor Sales Increase 4.7% Month-to-Month in October
The Semiconductor Industry Association reported global chip sales of $72.7 billion in October 2025, up 4.7% from September and 27.2% year-on-year. Growth surged in the Americas and Asia Pacific, with forecasts projecting nearly $1 trillion in 2026.
Semiconductor Industry Association
Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
The hottest new AI company is...Google?
Google's Gemini 3 ignites the AI race as tech leaders praise its speed and capabilities, boosting Google shares and sparking Meta's interest in its Tensor chips. The model tops benchmarks, signaling rising competition for Nvidia even as GPUs remain dominant.
CNN
Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach and wire bonding processes.
Technical Paper
Sponsor
ZEISS

Improve WLCSP Failure Analysis with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL and Cu-pillar microbumps. Read more.
ZEISS Microscopy
Worldwide Smartphone Market to Grow 1.5% in 2025, Boosted by Record Apple Shipments in 2025 of 247.4 Million Units and 6.1% YoY Growth, according to IDC
Smartphone shipments will rise 1.5% to 1.25 billion units in 2025 as Apple drives stronger-than-expected demand, especially in China. Apple is set for a record year, though 2026 shipments will dip due to component shortages and product-cycle shifts.
IDC
UMC signs production deal with Polar Semiconductor
United Microelectronics (UMC) signed an MOU with Polar Semiconductor to produce 8-inch wafers at Polar's Minnesota facility, boosting U.S. semiconductor manufacturing, strengthening supply chain resilience, and supporting critical automotive, data center, and industrial chip needs.
Taipei Times
Sponsor
DL-Technology

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
Technical Papers
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
A Universal AI-Powered Segmentation Model for PCBA & Semiconductor
Peer viewpoint: semiconductor innovation for telecommunication networks
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
MORE TECHNICAL PAPERS
Sponsor
CyberOptics

New Quadra Pro Manual X-Ray System
Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more.
Nordson TEST & INSPECTION
Room-Size Particle Accelerators Go Commercial
TAU Systems debuts the first commercial laser-driven wakefield accelerator, compressing kilometer-scale particle acceleration into a single room. The device delivers high-energy electron beams and targets practical, reliable applications starting in 2026.
IEEE Spectrum
Geometry Challenges in Multidie Thermal Management
Researchers confront thermal risks in 3D stacked semiconductors by deploying advanced simulations, heat-mapping algorithms, and test chips to optimize chiplet placement, enhance cooling strategies, and curb heat buildup while ensuring efficient power delivery.
EE Times
Sponsor
MicroCircuit-Laboratories-LLC

FSO and LiDAR hermetic microelectronic miniature packages
Largest area lenses in covers are routine for Robotic Cover Sealer with Automated Processing. Robotic Materials Manager provides walk away automation.
MicroCircuit Laboratories, LLC
Securing The Design Journey
Safety-critical industries are abandoning outdated, datasheet-driven semiconductor engagement as risks rise. Design enablement now turns suppliers into active partners who guide engineers through tough tradeoffs, compliance, and lifecycle management.
Semiconductor Engineering
Small Language Models Create New Security Risks
Edge AI and small language models are driving faster, localized computing across cars and smart sensors. But as SLMs self-optimize and interact outside traditional IT controls, they introduce escalating security risks that require modern, adaptive safeguards.
Semiconductor Engineering
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Harnessing Silicon Lifecycle Management For Chip Security
Silicon lifecycle management is shifting from basic reliability checks to active device security, using embedded monitoring to spot counterfeits, detect real-time threats, boost performance, and fortify supply chains in fast-moving sectors like automotive.
Semiconductor Engineering
Huawei's 2022 patent details novel technique to make 2-nm-class chips without EUV tool
Huawei has unveiled a patent for a 2-nanometre-class chip process using deep ultraviolet (DUV) lithography, potentially bypassing US sanctions. The technique, based on advanced patterning, could challenge TSMC's 2-nm lead, though commercial viability remains unproven.
South China Morning Post
Sponsor
Ontos-Equipment-Systems

OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
The EU's Semiconductor Strategy: CHIPS Act 2.0, Investments, and More
At SEMICON Europa, industry leaders highlighted the EU's semiconductor ambitions, including CHIPS Act 2.0, new investments, and R&D pilot programs. Despite challenges in AI, advanced logic, and bureaucracy, Europe aims for 20% market share by 2030.
3DInCites
Sponsor
kyzen

Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation
This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more.
KYZEN
Today's Sponsor
Master-Bond
Sponsor
Master-Bond

Thermally Conductive Epoxy
Master Bond Supreme 11AOHTLP is a two component adhesive featuring thermal conductivity and electrical insulation for high performance bonding, sealing and coating.
Master Bond
Test Your Knowledge
What's the hardest bone in the human body?
See answer below.
Nordson-ASYMTEK
Quote of the Day
"The volume of paper expands to fill the available briefcase."
Jerry Brown
Sponsor
Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
Industry Calendar
Dec 17, 2025
SEMICON Japan 2025
SEMI
Jan 26, 2026
Understanding semiconductor technology and business/ Phoenix, AZ
PTI International, Inc.
Jan 27, 2026
Overview of semiconductor manufacturing / Phoenix, AZ
PTI International, Inc.
Feb 19, 2026
Defect-Based Testing | Munich, Germany
Semitracks
Feb 23, 2026
Wafer Fab Processing | Munich, Germany
Semitracks
FULL INDUSTRY CALENDAR
Tresky
Cartoon of the Day
Cartoon
"I found room in the budget to update your office equipment. Would you rather have a box of paperclips or a new pencil?"
Copyright © Randy Glasbergen
Sponsor
Pac-Tech

Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech
Surfx-Technologies
Test Your Knowledge Answer
What's the hardest bone in the human body?
Answer: The jawbone