April 29, 2026

Better Hardware Could Turn Zeros into AI Heroes Researchers highlight sparsity in large AI models, where most parameters are zero, enabling skipped computations and compressed storage. Stanford’s Onyx accelerator exploits unstructured and structured sparsity, cutting energy use up to 70x versus CPUs while boosting speed about eightfold. IEEE Spectrum

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies

India Semiconductor Mission 2.0 India’s ISM 2.0 shifts semiconductor strategy toward mature 28–65nm nodes, backed by over $13 billion, expanding into a full-stack ecosystem. It leverages global partnerships, especially Taiwan, while improving execution, building fabs, talent pipelines, and supply chain resilience. Taipei Times

Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Technical Paper

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.

TSMC valuation still fair despite stock surge: analyst TSMC shares hit record highs as analysts say valuation remains within historical range, supported by AI-driven demand and strong earnings outlook, while ETFs may boost demand under new rules, though analysts warn of overheating risks near NT$3,000. Taipei Times

TSMC expects 70% 2nm growth TSMC projects 2-nanometer chip capacity to grow at a 70% CAGR through 2028 as five fabs ramp production in Taiwan, delivering 45% higher initial output than 3nm, while also expanding advanced packaging and overseas manufacturing in Arizona and Japan. Taipei Times

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Seam Seal Hermetic Packages with Auer Carriers and 3D Trays MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing. MicroCircuit Laboratories, LLC

OpenAI Prepares AI-First Smartphone for 2028 OpenAI partners Qualcomm, MediaTek to build AI-first smartphone co-designed by Luxshare for 2028 launch, aiming AI agents replace apps, blending on-device and cloud intelligence, potentially disrupting Apple and Samsung smartphone dominance through real-time data capture and agentic AI design. EE Times

Semiconductor Packaging Services Market Set to Record US$ 107.5 billion by 2033., Growth by surge - Wafer Packaging, 3D Packaging, AI Chips & OSAT Growth | Top Companies 2026 - Taiwan Semiconductor Manufacturing Company Limited, ChipMOS TECHNOLOGIES INC., DataM Intelligence released a research report on the Semiconductor Packaging Services Market 2026, analyzing regional growth trends, segmentation, CAGR projections, and leading players’ revenue performance while highlighting key growth drivers, market size in value and volume, emerging opportunities, and outlook. Open PR

Sponsor A Universal AI-Powered Segmentation Model A new universal deep learning model enhances automated optical inspection by accurately segmenting images for both PCBAs and semiconductors. It boosts defect detection efficiency, simplifies model management & supports auto-programming. Nordson Test and Inspection

What the DRAM Crunch Teaches Us About System Design DRAM shortages intensify as manufacturers prioritize DDR5 and HBM, driving prices up 3–4x and constraining AI systems. This forces redesigns toward smaller models and edge AI accelerators, reducing memory dependence, costs, and supply risk for practical, efficient inference. EE Times

New CPU Memory Module Data centers face growing challenges moving, processing, and storing massive data. Frank Ferro of Cadence explains how SOCAMMs, a next-gen low-power modular memory standard, improve efficiency over DDR, reduce heat, and may eliminate need for active cooling. Semiconductor Engineering

Sponsor OntosIS Atmospheric Plasma System The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices. Ontos Equipment Systems

Research Bits: Apr. 28 Researchers developed laser-patterned parchment paper circuits enabling disposable electronics, MIT built ultra-efficient post-quantum cryptography chip for biomedical devices, and scientists revealed single-electron-driven silicon-hydrogen bond breaking behind hot-carrier degradation, advancing materials reliability and device security research. Semiconductor Engineering

ASML as the last polite monopolist TSMC publicly criticizes ASML EUV pricing, highlighting tensions in semiconductor supply chain. Fab equipment is widely available, but manufacturing leadership depends on decades of process know-how. New entrants like Musk’s Terafab and Japan’s Rapidus test limits of capital versus experience. Asia Times

Sponsor Die Sorting with AI-supported AOI and Infrared Inspection See Muehlbauer's DS Merlin 60K running live at Semicon SEA, Booth #1811. The world's benchmark in die sorting: ultra-high-speed technology with AI-driven vision inspection down to 1 µm resolution. Muehlbauer

US chip packaging capacity to hit 10% by 2032 Trump administration pushes to reshore semiconductor manufacturing to the US as TSMC, Intel, and Samsung expand advanced fabs domestically, while efforts also strengthen local OSAT capabilities to build a more resilient and self-sufficient chip supply chain. Digitimes

Sponsor Contract service: DIE Bonding prototyping & small series production Our services reduce time-to-market. We can quickly produce small batches on demand without you having to build up production capacities. Learn more. Tresky Automation