January 16, 2026

Liquid Cooling Gains Traction In Data Centers AI-driven power density is pushing data centers past air cooling limits, making liquid cooling the norm. Single-phase leads today, while two-phase and immersion rise, forcing early design choices that reshape infrastructure, not total power use. Semiconductor Engineering

Sponsor Improve WLCSP Reliability with Advanced 3D X-ray Microscopy Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL and Cu-pillar microbumps. Read more. ZEISS Microscopy

VIEWPOINT 2026: José Manuel Ramos, CEO, Wooptix Many important developments and investments in chip manufacturing have come about over the past year, and the chase is on to increase chip performance by packing more layers inside. That places more attention on metrology for defect detection. Consequently, I'm very optimistic about the industry's outlook ... Wooptix

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

TSMC plans record expenditure to meet AI demand TSMC plans a record US$52–56 billion capital spend in 2026, boosting advanced chip and packaging capacity to meet surging AI demand. Expansion includes Taiwan's 2nm fabs and Arizona's gigafab cluster, supporting strong revenue and supply growth through 2029. Taipei Times

Taiwan will invest $250 billion in U.S. chipmaking under new trade deal The U.S. and Taiwan struck a trade deal requiring Taiwanese chip companies, including TSMC, to invest at least $250 billion in U.S. production. In return, the U.S. will cut tariffs and allow certain imports, boosting domestic semiconductor capacity. CNBC

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

Technical Papers EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor MORE TECHNICAL PAPERS

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

Not time to worry about TSMC's reported expansion in US Experts say talk of TSMC rapidly expanding U.S. chip fabs is overstated, as economic and structural hurdles keep Taiwan dominant in advanced manufacturing. U.S. investments are long-term, politically driven, and constrained by infrastructure. Taipei Times

US sets 25% tariff on select chips The US imposed a 25% tariff on select advanced semiconductors, allowing Nvidia's Taiwan-made H200 AI chips to ship to China. Trump tied the tariff to export licenses, while negotiations continue on broader tariffs and boosting domestic chip production. Taipei Times

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

ASML value soars above US$500bn on TSMC's outlook ASML surged past US$500 billion in market value, becoming Europe's third company to do so, after TSMC projected stronger-than-expected capital spending. The Dutch chip-equipment maker is benefiting from AI-driven demand, boosting European market sentiment & investor optimism. Taipei Times

Efficient cooling method could enable chip-based trapped-ion quantum computers MIT researchers developed ultra-compact photonic chips that cool trapped ions nearly 10 times below standard laser limits, far faster and more efficiently, advancing scalable, stable trapped-ion quantum computers without bulky optics. MIT News

Sponsor Tresky DIE Sorting Cycle time optimized re-sorting or re-organization of semiconductor chips from one component presentation into another presentation. Chips are often rearranged from a wafer to a waffle pack. Tresky Automation

Will 2026 Be Dominated By AI? AI's explosive growth strains compute, memory, networks, power and supply chains, forcing new architectures, open interconnects, heterogeneous systems & 3D integration. In 2026, shortages, energy limits & inference-led designs could reshape data centers & chip strategies. Semiconductor Engineering

AI's Memory Squeeze: Capacity, Conflict, and a Market in Flux AI-driven demand has thrown the DRAM industry into turmoil, with HBM shortages persisting beyond 2026. Micron seeks new fab capacity amid sellouts, while China's CXMT eyes an IPO to expand output and disrupt global memory dynamics. EE Times Asia

Sponsor Particle-Free Plasma Oxide Reduction Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies

Cerebras scores OpenAI deal worth over $10 billion ahead of AI chipmaker's IPO Cerebras has struck a $10 billion-plus deal with OpenAI to provide 750 megawatts of AI computing power through 2028, diversifying beyond its UAE client G42. The partnership boosts real-time AI performance, challenging Nvidia in large-scale model training and inference. CNBC

Sponsor Tough Engineering Changes? Where Can You Turn? Engineering changes are a reality that need to be dealt with. Do you have qualified rework technicians to do the job efficiently and reliably? Circuit Technology Center