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Pre-molded, Air Cavity QFN Packages
Do you need fast, high-quality solutions for IC packaging or assembly? Use our Open-molded Plastic Packages (OmPPs) to meet your market requirements.
QP Technologies
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What Year Was It?
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Andropov Writes to U.S. Student
The Soviet Union releases a letter that Russian leader Yuri Andropov wrote to Samantha Smith, an American fifth-grader from Manchester, Maine, inviting her to visit his country.
See the answer below.
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SQ3000+ All-in-One Solution
With all-in-one functionality for AOI, SPI plus CMM applications to attain in-line coordinate measurements much faster than a traditional CMM in seconds, not hours.
Nordson TEST & INSPECTION
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Full automation bond testers
A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more.
xyztec
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What Year Was It Answer
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Andropov Writes to U.S. Student Answer: April 25, 1983
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April 25, 2025
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TSMC Announces World-Leading A14 Node to Power AI
TSMC unveiled its A14 chip process, promising 15% speed boosts or 30% power cuts over N2, plus 20% higher logic density. Set for 2028 AI deployments, A14 integrates silicon photonics and aims to cut data center energy consumption.
EE Times
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Touch Free BGA Solder Ball Removal
Watch a video that shows touch-free BGA component deballing. This precision process is highly reliable when preparing BGA components prior to reballing.
Circuit Technology Center
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Tape-Out Failures Are The Tip Of The Iceberg
The latest Wilson Research/Siemens survey exposes a steep fall in manufacturable chip designs—from 24% to 14%—and growing delays, as AI pressure, lagging EDA productivity, and inflated expectations fuel systemic inefficiency and industry-wide recklessness.
Semiconductor Engineering
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Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance changes, and current-carrying capacity estimations crucial for advanced electronics design.
Technical Paper
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Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
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Intel AI Trick Spots Hidden Flaws in Data-Center Chips
Intel engineers are using reinforcement learning to boost detection of silent data errors in Xeon chips, which often evade traditional tests in hyperscale data centers. Their method improves detection fivefold by optimizing matrix-based Eigen test selection.
IEEE Spectrum
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Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
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TSMC's cutting-edge A14 tech to hit fabs in 2028
TSMC unveiled its A14 chip process, set for 2028 production, promising faster AI computing and improved power efficiency. The company also announced an A16 intermediary process for 2025, underscoring its push to lead in next-gen semiconductor innovation.
Taipei Times
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Data Movement Is the Energy Bottleneck of Today's SoCs
As AI accelerates SoC complexity, efficient data movement now rivals compute power in importance. Packet-based network-on-chip (NoC) architectures lead the way, enabling low-latency communication, cache coherence & chiplet integration across modular, high-performance semiconductor designs.
Semiconductor Engineering
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High-volume Manufacturing
The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations.
Surfx Technologies
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AI-Driven Verification Regression Management
Synopsys VC ExecMan is revolutionizing chip verification by integrating AI, machine learning, and advanced regression automation to streamline planning, execution, analysis, and debugging—boosting efficiency, coverage, and quality while slashing time to tape-out.
Semiconductor Engineering
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Two Part, Room Temperature Curing Epoxy
Master Bond EP39MAOHT is a thermally conductive, electrically insulative adhesive with low exotherm, suitable for large castings and potting applications.
Master Bond
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TSMC Unveils Advanced A14 Process Amid AI Boom
At its North America Technology Symposium, TSMC unveiled its A14 process, promising major gains in AI chip performance and efficiency. Set for 2028 production, A14 strengthens TSMC’s edge amid fierce Intel rivalry and rising geopolitical pressures.
EE Times
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Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
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Intel Poised to Cut More Than 20% of Staff
Intel plans to cut over 20% of its workforce this week under new CEO Lip-Bu Tan, aiming to slash bureaucracy and revive its engineering focus. The move follows past layoffs and asset sales as part of a broader turnaround strategy.
Taipei Times
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Today's Sponsor |
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Sponsor |
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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
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Test Your Knowledge
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What puts the fizz in soda water?
See answer below.
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Quote of the Day
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"How wonderful it is that nobody need wait a single moment before starting to improve the world." Anne Frank
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28th Annual CMSE
The premier event focuses on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military. April 29 - May 1, 2025
TJ Green Associates
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Cartoon of the Day
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"It's your attitude, not your aptitude that determines your altitude. That's the philosophy that got me kicked out of pilot school."
Copyright © Randy Glasbergen
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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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Test Your Knowledge Answer
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What puts the fizz in soda water? Answer: Carbon dioxide
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