July 6, 2026

US unlikely to match TSMC’s Taiwan production capacity, minister says Taiwan says Taiwan Semiconductor Manufacturing Company will retain its manufacturing base despite expanding in Arizona, citing plans for 16 new fabs and advanced packaging facilities at home. Authorities also approved a US$20 billion investment to expand the company's US operations. Taipei Times

Sponsor Precision BGA Rework Services for High-Reliability Electronics Proven solutions for BGA replacement, reballing, site dressing, and repair that help restore functionality, improve reliability, and extend the life of assemblies. Circuit Technology Center

Chip Industry Week In Review South Korea launched a major AI and semiconductor investment strategy linking chipmaking, robotics and AI data centers while expanding regional infrastructure and workforce support. Meanwhile, Infineon opened its $5.7 billion Smart Power Fab in Dresden ahead of schedule, creating 1,000 jobs. Semiconductor Engineering

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs. Technical Paper

Sponsor Real-Time Metrology Solutions Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies. Akrometrix

Chinese AI chip start-up exits stealth mode, bets on 3D stacking to bypass US controls Chinese AI chip start-up Dongfang Suanxin has emerged from stealth, unveiling domestically built AI accelerators using software-defined chips and 3D stacked near-memory computing. Led by industry veteran Wei Shaojun, the company aims to strengthen China's self-reliant semiconductor ecosystem despite US export controls. South China Morning Post

Memorychip makers warn price meddling could bite SEMI urged the Trump administration to avoid intervening in memory chip pricing or production, warning such measures would deepen AI-driven supply shortages. Instead, it called for expanded tax incentives and long-term customer agreements to strengthen US manufacturing and supply resilience. Taipei Times

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

Chip Industry's Message to Washington SEMI urged governments to avoid intervening in memory chip pricing and allocation, arguing market forces and manufacturing incentives better support AI-driven capacity expansion. The group warned that political interference could weaken investment, prolong shortages, and undermine long-term semiconductor competitiveness. Wealth Advisor

SK Hynix Plans $713B Domestic Investment SK Hynix unveiled a KRW 1,100 trillion ($713 billion) investment plan to expand semiconductor manufacturing across South Korea, accelerate fab construction, boost HBM and NAND production, and pursue a Nasdaq listing to help finance its long-term AI memory growth strategy. EE Times

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

Spain’s Semiconductor Landscape: Six Stories from a Growing Ecosystem Spain is strengthening its semiconductor role by advancing photonics, quantum computing, chip design, advanced packaging, and applied research. Regional ecosystems in Catalonia and the Canary Islands are translating scientific expertise into commercial technologies while supporting Europe's next-generation semiconductor strategy. EE Times

Chip R&D Is Accelerating to Keep Pace With AI UCLA and five leading semiconductor companies have launched a $125 million research hub to accelerate AI-driven chip innovation. The partnership strengthens university-industry collaboration, speeds commercialization, aligns research with manufacturing needs, and prepares skilled talent to meet surging semiconductor demand. IEEE Spectrum

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

Shanghai unveils quantum computing hub as China races for tech supremacy Shanghai launched a quantum computing incubation zone in Xuhui district, bringing together 26 companies with funding, subsidies and research support to accelerate commercialization. The initiative strengthens Shanghai’s bid to become China’s leading quantum hub amid intensifying competition from Beijing, Hefei and Shenzhen. South China Morning Post

Defending Against AI-Enabled Data Fusion AI-powered data fusion is creating detailed digital twins that expose individuals to sophisticated cyberattacks and privacy risks. Experts urge secure-by-design chips, verified data, strong encryption, trusted AI pipelines, and strict data protection to counter expanding AI-driven attack surfaces. Semiconductor Engineering

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.

Semiconductor Investment That Gets Ahead of the AI Era AI has propelled the global semiconductor market past $1 trillion years ahead of forecasts, intensifying demand and competition. Korea is accelerating large-scale chip investments, strengthening supply chains and advanced packaging to maintain leadership as governments and rivals expand AI-driven semiconductor capacity. Seoul Economic Daily

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura