Industry Press
First full wafer-scale fabrication of electrically-pumped GaAs-based nano-ridge lasers
Imec
Complete Probe Solutions Announces Single-Die-Alignment feature for the APEX wafer prober
Complete Probe Solutions Inc.
Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
SEMI
2025 Device Research Conference Announces Call for Papers
Device Research Conference
Aehr Announces Initial FOX-XP Multi-wafer Test and Burn-in Production System Order
Aehr Test Systems
CEA-Leti Will Unveil Major R&D Gains At Photonics West
CEA-Leti
IMAPS Device Packaging and Advanced Packaging for Medical Microelectronics to Co-locate in Phoenix, AZ
IMAPS
Silicon photonics: accelerating growth in the race for high-speed optical interconnects
YOLE Group
MORE INDUSTRY PRESS
What Year Was It?
The day was Jan 13. What year was it?
Pope Recognizes Knights Templar
What Year
Pope Honorius II grants a papal sanction to the military order known as the Knights Templar, declaring it to be an army of God.
See the answer below.
What Year Was It Answer
Pope Recognizes Knights Templar
Answer: January 13, 1128
January 13, 2025
VIEWPOINT 2025: Greg DeLarge, President, Plasma Etch, Inc.
image
As we close out another successful year, we reflect on the tremendous growth and innovation we and our customers have achieved. Our commitment to reliable and innovative plasma systems shows in all of the projects we work on. We continue to place a strong emphasis on customer success; ensuring our clients receive ...
Plasma Etch Inc
TSMC has begun 4-nm chip production in US, official says
TSMC has begun producing advanced 4-nanometer chips in Arizona, marking a milestone for U.S. semiconductor efforts under President Biden. With $6.6 billion in grants, TSMC plans expanded fabs, including 2-nanometer chips by 2028.
Taipei Times
Ultrasonic Bonding in semiconductor industry – The fast and clean process
Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power devices, RF components, and 3D packaging in modern electronics.
Technical Paper
CES 2025: Day 2 Wrap and Interview with EdgeCortix's CEO
AI dominated CES 2025, featuring innovations in edge intelligence and smart tech. EdgeCortix CEO Sakya Dasgupta spotlighted their AI processors' aerospace success, the upcoming Sakura line, and Japanese government-backed funding propelling their advancements.
EE Times
TSMC sales top estimates
TSMC surpassed sales expectations with a 39% revenue surge in Q4 2024, fueled by robust AI hardware demand. While concerns about potential overbuilding and bottlenecks persist, the chipmaker's growth reflects optimism for AI-driven data center expansion.
Taipei Times
Ministry lifts overseas limits on TSMC
Taiwan's Ministry of Economic Affairs announced that TSMC, a key Nvidia chip supplier, can invest in 2-nanometer chip production in the US. However, TSMC will proceed cautiously, balancing its $30 billion investment while safeguarding Taiwan's semiconductor technology leadership.
Taipei Times
Chip Industry Week In Review
Global semiconductor sales soared 20.7% in November 2024, hitting $57.8 billion. Innovations like Imec's GaAs laser diode and Micron's HBM facility drove growth, while investments in 3D packaging and AI reshaped the market amid supply chain challenges.
Semiconductor Engineering
Cryptography Does Not Equal Security
Rambus stresses that strong cryptography isn't enough for security, unveiling a process to guide customers in creating tailored threat assessments. By categorizing assets—Data-at-Rest, Data-in-Motion, and Data-in-Use—it ensures semiconductor products receive precise, comprehensive cryptographic protection.
Semiconductor Engineering
Rapidus plans to supply 2nm chip samples to Broadcom
Japanese foundry Rapidus plans to deliver 2nm chip samples to Broadcom, following trial production set for April 2025. With mass production targeted for 2027, Rapidus is actively pursuing major customers to stabilize operations and achieve profitability, reports Nikkei Asia.
Digitimes
TSMC cuts ties with Singapore firm over chip found in Huawei processor
TSMC cut ties with Singapore-based PowerAIR after discovering a TSMC chip in Huawei's AI processor, raising concerns about a potential breach of U.S. export controls. This follows similar scrutiny of Chinese clients amid tightened U.S. restrictions.
South China Morning Post
Micron to build semiconductor packaging facility in Singapore
Micron Technology is investing $7 billion to build an advanced memory packaging facility in Singapore, boosting AI-driven production. Launching in 2026, the plant will create 1,400 jobs initially, with plans to expand to 3,000 amid growing Southeast Asian chip investments.
iTnews Asia
Nvidia's tiny $3,000 computer for AI developers steals the show at CES
Nvidia CEO Jensen Huang wowed a CES 2025 crowd, unveiling Project Digits, a $3,000 AI supercomputer aimed at empowering machine-learning researchers and small businesses. The compact system enables AI development without costly data center investments.
CNBC
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Test Your Knowledge
Which of these materials is the best conductor of heat? Copper, Silver, Aluminum, Diamond
See answer below.
Quote of the Day
The only real mistake is the one from which we learn nothing.
John Powell
Industry Calendar
Jan 16, 2025
IEEE Hybrid Bonding Symposium
IEEE
Jan 23, 2025
ISSB Standards Adoption and Reporting
SEMI
Jan 27, 2025
Industry Strategy Symposium - ISS 2025
SEMI
Jan 27, 2025
Overview of semiconductor manufacturing webinar for American attendees
SEMI
Jan 31, 2025
Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting
SEMI
FULL INDUSTRY CALENDAR
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Copyright © Randy Glasbergen
Test Your Knowledge Answer
Which of these materials is the best conductor of heat? Copper, Silver, Aluminum, Diamond
Answer: Diamond