November 13, 2025

AMD predicts accelerating sales growth on data center demand in next five years AMD forecasted over 35% annual revenue growth for the next five years, driven by soaring demand for its AI data center products. CEO Lisa Su said AI revenue would rise 80% annually, as partnerships with OpenAI and Oracle fuel strong market momentum. Taipei Times

Sponsor How to Wire Pull? Learn how to perform an optimal pull test on wires or ribbons. This extensive guide also covers loop height measurement, vector pull, and SMD gull-wing leads pull. Download now. xyztec

Taiwan confident in Dresden fab, Tsai Ing-wen says Former Taiwanese president Tsai Ing-wen reaffirmed Taiwan’s confidence in TSMC’s first European fab during her visit to its Dresden construction site. The €10 billion plant, set to open in 2027, will create over 5,000 jobs and strengthen Europe’s semiconductor ecosystem. Taipei Times

Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows. Technical Paper

Sponsor Motivation for pressure-assisted metallic sintering in Power Electronics Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics. Tresky Automation

Advanced Packaging: A Community Coming Together At SEMICON West in Phoenix, 3D InCites celebrated the growth of the advanced packaging community, showcasing innovations in 3D integration, testing, and power management. Companies like ACM Research, Saras Micro Devices, Advantest, and Circuits Integrated unveiled technologies driving the trillion-dollar packaging industry forward. 3DInCites

Improving IC System Quality And Performance Chipmakers face growing challenges ensuring multi-die assemblies and advanced SoCs perform reliably throughout their lifecycle. ProteanTecs’ Alex Burlak discusses detecting manufacturing defects, predicting chip failures in operation, and optimizing voltage-timing balance to enhance performance and power efficiency. Semiconductor Engineering

Sponsor Tech Paper - Keys to Component Lead Tinning Success This paper examines the challenges and best practices of component tinning, with a focus on temperature control, flux selection, and soldering techniques. Circuit Technology Center

Technical Papers Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG A Universal AI-Powered Segmentation Model for PCBA & Semiconductor Peer viewpoint: semiconductor innovation for telecommunication networks Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) Peer viewpoint: AI data centers are driving a semiconductor revolution MORE TECHNICAL PAPERS

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

Supply Chain and Digital Sovereignty Face AI Triple Threat At the Gartner IT Symposium-Xpo, experts warned that while AI offers transformative potential, only 1 in 5 initiatives achieve measurable ROI. Speakers, including Margrethe Vestager, urged CIOs to balance rapid technological change with human capability, financial transparency, and digital sovereignty. EE Times

Nvidia supplier Foxconn third-quarter profit beats expectations, rising 17% on AI demand Foxconn reported a 17% year-on-year profit surge in the third quarter, fueled by booming demand for AI servers and data centers. The company expects continued growth, leveraging partnerships with Nvidia and Mitsubishi Electric while expanding beyond consumer electronics. CNBC

Sponsor Award Winning Acquisition Mode Dynamic Planar CT Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure. Nordson Test & Inspection

ASML completes construction of chip equipment plant in S. Korea ASML, the world’s leading maker of EUV lithography systems, completed its new 16,000-square-meter manufacturing campus in Hwaseong, South Korea. The facility will strengthen semiconductor supply chains, enhance technology cooperation with Samsung and SK hynix, and expand ASML’s presence in Asia. Yonhap News Agency

AI agents open door to new hacking threats Cybersecurity experts are warning that AI agents—the next phase of generative AI—could be hijacked by hackers through “query injection” attacks. As these autonomous systems gain more online control, researchers urge stricter safeguards and human oversight to prevent malicious exploitation. Taipei Times

Sponsor The experts agree Performance and reliability top the priority list for semiconductor experts. Get our latest Research Report to explore how they’re addressing AI demands, integration challenges, and next-gen materials. Henkel AG & Co.

How Advanced Packaging is Unleashing Possibilities for Edge AI The rapid shift of AI from the cloud to edge devices is driving a 17% CAGR, with over 2 billion devices expected by 2030. To meet strict power and cost limits, chipmakers are adopting selective 3D vertical stacking to boost performance and efficiency. EE Times

HBM Leads The Way To Defect-Free Bumps High-bandwidth memory (HBM) is powering AI breakthroughs but straining manufacturing limits. As TSV, microbump, and wafer-thinning issues mount, SK hynix, Samsung, and Micron are turning to hybrid bonding and advanced inspection to maintain yields at sub-10-micron scales. Semiconductor Engineering

Sponsor Buy Ceramic Dispensing Needles Online Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online. DL Technology

TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea’s DB HiTek Samsung and TSMC are retreating from 200mm foundry production to prioritize 300mm wafers for advanced chips like GPUs. Their shift is fueling growth for Korea's DB HiTek, whose 200mm expertise and surging power semiconductor demand are driving profits and utilization. TrendForce

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies