Aug 24, 2026 Micron CEO: AI has 'Totally Changed' the Boom-and-Bust Memory Industry Micron CEO Sanjay Mehrotra says AI has transformed memory from a cyclical component into strategic infrastructure, with demand outpacing supply. The company expects AI-powered data centers, vehicles, robots & devices to drive sustained growth & long-term customer agreements. CNBC

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Chip Industry Week In Review AI inference costs per agentic workflow could rise fivefold by 2028 as innovation outpaces savings. Samsung and SMIC raised foundry prices, while Mitsubishi Chemical expanded CMP materials. Cerebras and proteanTecs unveiled AI chip solutions. Semiconductor Engineering

Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Technical Paper

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From Pricing War to Pricing Power: Behind Samsung Foundry's Reported up to 15% Price Hikes Samsung is raising foundry prices up to 15% as tight capacity boosts pricing power. Strong 4nm demand from Google, Qualcomm and AI chips drives the squeeze, while 2nm yield gains remain crucial to sustaining its foundry recovery and growth. TrendForce

Anthropic market debut could break SpaceX IPO record Anthropic could seek more than $100 billion in its IPO, potentially valuing the AI startup at $2 trillion and surpassing SpaceX's record. The Claude maker may list this autumn while expanding custom-chip efforts to address computing shortages. TaipeiTimes

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Technical Papers ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging ■ Revolutionizing IC Packaging with High-Density RDL Technology ■ EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices ■ Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems MORE TECHNICAL PAPERS

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Nvidia announces AI-related price hikes Nvidia customers face server price increases exceeding 15% as soaring memory costs drive higher expenses for AI systems. The hikes will affect Vera Rubin and Grace Blackwell platforms, highlighting memory makers' growing leverage amid surging AI infrastructure demand. TaipTimes

Anthropic IPO filing will show AI backlash as a risk factor, sources say Anthropic is preparing for a major IPO potentially valuing it at $2 trillion, but growing opposition to AI data centers poses a key risk. Investors are also questioning competition, margins, infrastructure spending and growth prospects. CNBC

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Report outlines AI's workplace effects AI is reshaping workplaces, not eliminating jobs, as 61% of Asia-Pacific executives expect workforce growth. Skills shortages are the biggest barrier, pushing companies to create flexible offices that boost collaboration and human-machine work. TaipTimes

SEMI launches chip materials alliance Taiwan launched a semiconductor materials alliance with more than 30 companies to strengthen supply-chain resilience as AI demand surges. The initiative targets critical shortages while supporting 2nm chips and next-generation packaging efforts. TaipeiTimes

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Beyond Nanometers: Who Really Leads Asia's Chip Race? The semiconductor race now hinges on more than smaller nodes. Taiwan leads advanced manufacturing, the US dominates chip design and IP, and South Korea excels in memory. Resilient supply chains, talent and innovation will sustain leadership. E-International Relations

China's NAND Specialist YMTC Moves Closer to IPO YMTC is preparing for a Shanghai STAR Market IPO after CXMT's successful listing, seeking capital to expand NAND production and compete globally. Rising AI-driven storage demand creates an opportunity, but U.S. restrictions and limited enterprise SSD exposure remain challenges. EE Times

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Samsung plans up to $80 billion in shareholder returns after SK Hynix buyback Samsung Electronics announced a record 90 trillion to 110 trillion won shareholder return package for 2026, following SK Hynix's 40 trillion won buyback. Samsung will also pay about 30 trillion won in third-quarter dividends, combining dividends and potential share buybacks. CNBC

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The Human Brain Versus AI: Similar Results, Very Different Machines Brains and LLMs both predict through networks, but their methods differ sharply. The brain performs complex tasks on about 20 watts after 600 million years of evolution, while LLMs rely on energy-hungry silicon hardware to mimic neural processes. EE Times