April 3, 2026

Automated Multiphysics For Successful 3D-IC Design 3D-IC adoption boosts performance but introduces complex power, thermal & multiphysics challenges. Designers must shift left, using early analysis, automation & cross-team collaboration to manage interdependencies, prevent reliability issues & optimize stacked architectures. Semiconductor Engineering

Sponsor DIE Stacking on a Small Area Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area. Tresky Automation

Nexperia's China unit nears fully local production of chips: company sources Nexperia's China arm is pivoting to fully domestic semiconductor production, sidestepping European restrictions amid rising geopolitical tensions. The shift aims to rebuild supply chains, expand capacity, and localize most output by late 2026 despite friction with its Dutch parent. Taipei Times

Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Technical Paper

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Nanya Q1 revenue surges by 582.91% Nanya Technology reported a record-breaking first-quarter revenue surge, driven by DRAM supply shortages and rising prices. Strong AI demand, constrained DDR4 output & industry shifts toward advanced memory boosted growth, prompting expansion plans and higher capital investment. Taipei Times

Anthropic's AI code leak ignites frenzy among Chinese developers Anthropic accidentally exposed over 512,000 lines of Claude Code, drawing sharp interest from Chinese developers. Though quickly removed, experts say the leak reveals key engineering choices while leaving core model weights and user data secure. South China Morning Post

Sponsor Handheld Plasma Activation Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more. Plasma Etch

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Plasma Processing Wafers and Dies The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames. Surfx Technologies

Developing A Security Framework For Chiplet-Based Systems Chiplet architectures push hardware security beyond a single root of trust to platform-wide validation. Designers must build strong identity provisioning, trust chains, and policies to verify chiplets, support multi-vendor integration, and protect system integrity. Semiconductor Engineering

AI Demand Resets Memory Market Priorities, Tightening NOR Flash Availability The AI memory boom pushes suppliers to prioritize high-margin HBM, DRAM, and NAND, diverting resources from NOR flash. This shift tightens NOR supply, hitting automotive and industrial sectors as AI demand reshapes production and investment. Semiconductor Engineering

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

IC Security Threats Spike With Quantum, AI, And Automotive Chip security now demands early design choices that balance power, cost, and performance. Experts warn of post-quantum risks, supply-chain gaps, and AI-driven threats, pushing for built-in trust, transparency, and full lifecycle protection. Semiconductor Engineering

The One Bit Problem That Can Break a System Tiny bit flips from radiation, interference, or glitches can silently corrupt data, crash systems, and even bypass security, as seen in Airbus A320 recalls. Rising chip complexity is pushing engineers to deploy layered defenses, error correction, and hardware-based safeguards. Semiconductor Engineering

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

Embedded World 2026: Bringing Edge AI Into The Real World Embedded World 2026 showcased AI moving from cloud to edge, embedding real-time intelligence in devices. Synaptics revealed platforms that speed decisions, enhance privacy, and scale development, driving efficient AI adoption across homes, industry, and new applications. Semiconductor Engineering

Hassane El-Khoury: Immigrant Success Story, Semiconductor Visionary, and President and CEO of Onsemi Hassane El-Khoury transformed Onsemi into a focused leader in intelligent power and sensing, leveraging EV and AI megatrends. Rising from war-torn Lebanon, he drove strategic shifts, expanded silicon carbide investments, and strengthened growth, profitability, and sustainability. BBN Times

Sponsor 100+ Expert Repair & Rework Guides - All in One Place Take the guesswork out of circuit board repair. This guidebook delivers proven methods to help you repair and rework assemblies to IPC standards. Circuit Technology Center

Bell Called Watson; Today, We Call AI From Alexander Graham Bell’s first call to today's AI era, telecom operators invest heavily in 5G yet face weak returns. Industry leaders at Mobile World Congress 2026 say AI-driven services and enterprise solutions now offer a clearer path to monetization. EE Times

Sponsor Seam Seal Hermetic Packages with Auer Carriers and 3D Trays MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing. MicroCircuit Laboratories, LLC