Sep 4, 2026 Semiconductor Equipment Billings Increased 23% Year-Over-Year SEMI reports semiconductor equipment billings rose 23% year over year to $40.53 billion in Q2 2026, up 11% sequentially. The second record quarter reflects accelerating AI investment and capacity expansion across Asia, North America and Europe. SEMI

Sponsor Corner fill inspection A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly. Nordson Test & Inspection

AI Is Forcing Data Centers To Rethink Trust Data centers are moving beyond traditional defenses to zero-trust security, continuously verifying hardware, software, supply chains and AI models. Developers add provenance tracking, cryptographic agility and runtime monitoring to counter risks. Semiconductor Engineering

Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Technical Paper

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

China's 2nd-largest Foundry Hua Hong Unveils US$2B Wuxi Expansion, Adding 55K Wafers/M and 30% More Capacity Hua Hong plans to invest over $2 billion in a new Wuxi 12-inch specialty foundry, adding 55,000 wafers monthly to ease shortages. Strong memory demand and surging profits support the expansion as China boosts domestic chipmaking capacity. TrendForce

Micron Reportedly to Add 60K HBM Wafers/M, Reaching 100K by Year-End to Narrow Gap With Rivals Micron plans to boost HBM capacity by up to 60K wafers monthly, targeting 100K by year-end as 12-Hi HBM4 gains share. Samsung and SK hynix remain ahead, while surging AI demand accelerates HBM4 production and competition worldwide for AI memory. TrendForce

Sponsor Lights-Out KGD – The Future of Die Sorting Visit Muehlbauer at SEMICON Taiwan, Hall 2 | Bavarian Pavilion | Booth R7112/7. Join our presentation "AI, Sub-Micron Vision & Autonomous Manufacturing" on September 4, 2026. Muehlbauer – serving billions of people. every day. Muehlbauer

Technical Papers ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging ■ Revolutionizing IC Packaging with High-Density RDL Technology MORE TECHNICAL PAPERS

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

Data center spending to reach US$31.6tn by 2050 PwC forecasts global data center spending could reach US$31.6 trillion by 2050, driven by AI demand. Power availability, semiconductor supply chains and data sovereignty will shape investment, while local opposition threatens to delay projects and slow expansion. Taipei Times

Fabrication platform could enable flexible, transparent next-generation photonic chips MIT scientists created a scalable process to make silicon-photonics chips flexible and transparent on 300mm wafers. The advance could enable conformable health monitors, curved AR displays and lightweight optical systems while preserving performance. MIT News

Sponsor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Nordson Test & Inspection

India's Quantum Journey Goes Beyond the Qubit India will gain IBM's advanced quantum computing through a planned Quantum System Two in Amaravati. The National Quantum Mission backs local hardware, startups, research and quantum-safe technologies, strengthening India's quantum ecosystem. EE Times

Building Trust Into Physical AI Systems Physical AI is transforming vehicles, robots, drones, and smart infrastructure, but it also creates new security threats. Organizations must protect data, sensors, hardware, software, and runtime behavior while continuously validating safety, reliability, and trust. Semiconductor Engineering

Sponsor High-Reliability BGA Reballing BGA reballing requires controlled deballing, precise ball placement, proper thermal processing, and rigorous inspection. Circuit Technology Center provides repeatable BGA reballing services. Circuit Technology Center

Humanoid Compute, Security More Complex Than AVs Humanoid robotics is advancing rapidly, but developers must extend battery life, cut costs, and strengthen cybersecurity. Hybrid AI architectures, advanced sensors, and chip-level security are improving robots’ perception, safety, reliability, and performance. Semiconductor Engineering

What Can Go Wrong In 800VDC AI Data Centers 800V DC power distribution could improve data-center efficiency as AI workloads drive rack power toward 1MW. However, higher voltage increases safety risks, requiring advanced hot-swap circuits, isolation, fault protection, arc-flash mitigation, grounding, and reliable system design. Semiconductor Engineering

Sponsor Cu Pillar Flip Chip Cleaning Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability. KYZEN

Chinese chipmaker Enflame 4,073 times oversubscribed in Shanghai IPO amid Nvidia race Enflame Technology's Shanghai IPO drew huge investor demand, with its retail tranche oversubscribed 4,073 times. The Tencent-backed AI chipmaker's debut underscores China's semiconductor self-sufficiency drive and appetite for Nvidia alternatives. South China Morning Post

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Scientech eyes 50% expansion in shipments Scientech expects semiconductor equipment shipments to surge 50% this year as AI fuels advanced packaging demand. With orders booked through 2028, the company is expanding capacity, targeting CoPoS technology and pursuing new AI-driven opportunities. Taipei Times