Nov 5, 2026 Silicon Photonics Hits the Big Time Silicon photonics is rapidly emerging as a key solution to AI data center power and connectivity challenges. Major acquisitions, startup investments, and optical switching innovations signal growing industry confidence in scalable optical interconnects beyond copper. EE Times

Sponsor Better Component Tinning Starts with Process Control Gold removal, solder thickness, and thermal control all influence tinning results. Explore how robotic hot solder dip processing helps improve consistency and solderability. Circuit Technology Center

Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries Applied Materials plans to increase its stake in Besi to approximately 20%, strengthening their strategic partnership. The companies will expand collaboration on hybrid bonding, advanced 3D chip integration and next-generation interconnect technologies to support AI-driven semiconductor scaling. 3D InCites

Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Technical Paper

Sponsor Real-Time Metrology Solutions Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies. Akrometrix

AMD forecast exceeds estimates after AI chip demand soars AMD forecast fourth-quarter revenue of $17 billion, surpassing analysts’ expectations as strong AI infrastructure demand boosts growth. CEO Lisa Su projected over 80% revenue growth next year, driven by expanding data center sales despite weakness in PC markets. Taipei Times

Intel Joins Semiconductor Pathways Fund to Strengthen The U.S. Engineering Talent Pipeline Intel has joined the Semiconductor Pathways Fund, a six-company coalition targeting $20 million to support 6,700 students facing financial barriers. The initiative aims to strengthen America’s semiconductor workforce by helping future engineers and technicians graduate by 2028. PR News Wire

Sponsor High power atmospheric plasma system Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength! Plasma Etch

Technical Papers ■ The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days MORE TECHNICAL PAPERS

Sponsor Temporary Bonding Materials Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm. Brewer Science

SpaceX’s Qualcomm deal could be a precursor to a telecom takeover SpaceX’s major deal with Qualcomm intensifies its competition with U.S. telecom giants and signals ambitions to become a leading wireless operator. Analysts suggest SpaceX could accelerate its expansion by acquiring an established telecommunications company. Market Watch

SIA Urges Senate to Pass Bipartisan Permitting Reform Legislation to Boost U.S. Competitiveness The Semiconductor Industry Association urges Congress to pass the Bipartisan American Affordability and Jobs Act of 2026, which aims to strengthen U.S. competitiveness, accelerate domestic semiconductor production and innovation, and streamline federal permitting and environmental reviews. Semiconductor Engineering

Sponsor From Heterogeneous Integration to 3D Front-End of Line Technologies This paper explores how hybrid and fusion wafer bonding have become foundational technologies in enabling both "More than Moore" heterogeneous integration and "More Moore" transistor scaling & recent advancements driving future architectures. EV Group

Quantum Roadmaps Are Finally Meeting Reality Quantum computing surpassed $1 billion in global revenue in 2025, despite major companies missing forecasts. The industry now faces growing scrutiny over commercial adoption, technical milestones, funding, and progress toward fault-tolerant systems and measurable quantum advantages. EE Times

Accelerating Plug-And-Play Prototyping In Chiplet-Based Designs Verifying multi-die chip designs increasingly requires simulation, emulation, and FPGA prototyping. SignatureIP CEO Purna Mohanty highlights challenges involving chiplets, shared memory, I/O version control, and synchronization between hardware-accelerated verification tools and evolving designs. Semiconductor Engineering

Sponsor IC Device & Micro-Electronic Cleaning Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge. Kyzen Corporation

Adding Network Security to AI, HPC and Data Centers AI and HPC workloads are reshaping data center networking by separating front-end and back-end domains. The white paper explores their distinct performance, scalability, and security requirements, highlighting strategies to protect critical communications without compromising computing performance. Semiconductor Engineering

Beyond The Chip: How AI Is Reshaping Semiconductor Design And Manufacturing Intel Foundry is advancing AI chip manufacturing by combining advanced process technologies, backside power delivery, chiplet architectures, and 3D packaging. It also integrates AI into manufacturing to improve yields, accelerate innovation, strengthen supply chains, and meet growing AI demands. Semiconductor Engineering

Sponsor High-Speed, Reliable Plating with PACLINE® PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution. PacTech

Global Semiconductor Sales Increase 24.1% from Q2 2026 to Q3 2026 Global semiconductor sales rose 24.1% from Q2 to Q3 2026, reflecting strong market demand and growth in the semiconductor industry worldwide, according to the Semiconductor Industry Association. Semiconductor Industry Association

Sponsor Proven Flip-Chip Flux for AI Packages WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications. Indium Corporation

Is There Room for Small-Scale OSATs in India’s Chip Packaging Boom? India's expanding OSAT industry creates opportunities for smaller firms in specialized semiconductor packaging, but they must secure anchor customers, maintain utilization, recruit skilled engineers and overcome qualification delays. EE Times