April 28, 2026

Cisco's Universal Quantum Switch Ushers in Quantum Networking Cisco unveils a prototype quantum switch that enables interoperability across vendors' quantum systems. Its conversion engine recognizes encoding types, routes over telecom fiber at room temperature, and preserves data with ~4% loss, advancing scalable quantum networking. EE Times

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

Micron and Sandisk continue rally as demand for memory expected to persist Memory stocks Micron and Sandisk surged as AI-driven chip shortages and strong pricing fuel demand forecasts. Analysts upgraded outlooks, citing long-term contracts and HBM/NAND constraints. Companies expand capacity while investors expect growth through the decade. CNBC

Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Technical Paper

Sponsor "Build Up" I/C Packages -- USA Fabrication High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more. Advanced Component Labs, Inc.

New quantum technology office launched in Taipei Taiwan advances into quantum computing by leveraging strengths in semiconductors, packaging, and system integration. Officials expand global partnerships, grow R&D hubs, and deepen industry ties to attract investment, aiming to shift from a "silicon island" to a "quantum island." Taipei Times

Offenders sentenced up to 10 years for spying on TSMC Taiwan court sentences a former TSMC engineer to 10 years for leaking 2-nanometer trade secrets, marking the first corporate case under the National Security Act. Other employees receive prison terms, while Tokyo Electron Taiwan faces fines and oversight penalties. Taipei Times

Sponsor Thermally Conductive, Low Outgassing Epoxy Master Bond EP54TC is a thermally conductive, electrically insulating adhesive that combines good physical properties and the ability to transfer heat rapidly and effectively. Master Bond

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Real-Time Metrology Solutions Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies. Akrometrix

What Intel's comeback says about the AI transition Intel stages a major turnaround as its stock jumps 110% and hits a 25-year high. The AI boom rewards hardware firms while pressuring software, signaling creative destruction as CPUs regain central importance in the new computing era. Axios

Why Data Centers Must Become System‑Aware Cloud and AI convergence is transforming data centers into adaptive, system-integrated infrastructure amid rising energy constraints. Driven by AI workloads and 5G, operators balance latency, bandwidth, and power while aligning compute with strained grids and telecom networks. EE Times

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

When Semiconductor Materials Misbehave Advanced semiconductor packaging widens the gap between lab results and production as heterogeneous integration drives complex material interactions and variability. Simulations fall short, pushing engineers toward real-time monitoring and iterative validation. Semiconductor Engineering

TSMC Tech Symposium 2026, By The Numbers TSMC unveiled A13, A12 and N2U process technologies, advancing its AI-driven roadmap. It highlighted strong N2 adoption, expanding CoWoS and SoW-X packaging, and COUPE optical tech, while AI and HPC revenues surpassed smartphones in its latest earnings update. Semiconductor Engineering

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

A faster way to estimate AI power consumption Researchers from MIT and the MIT-IBM Watson AI Lab developed EnergAIzer, a fast tool that predicts AI workload power use on GPUs in seconds with about 8% error, helping data center operators improve efficiency and reduce energy consumption. MIT News

TSMC Plans Chip Packaging Plant in Arizona by 2029 TSMC will build and operate an advanced chip packaging facility in Arizona by 2029, adding CoWoS and 3D-IC capabilities. The move aims to ease supply-chain bottlenecks, reduce shipments to Taiwan, and expand US manufacturing alongside partners like Amkor. Taiwan News

Sponsor Analytical Solutions Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions. Balazs Nanoanalysis

Why Chip Sovereignty Is No Longer About Chips—But Systems Governments push chip sovereignty, but AI is shifting value from standalone fabs to integrated systems spanning accelerators, CPUs, packaging, memory, and software. Industry now prioritizes heterogeneous architectures and global supply chains over chip-level control. EE Times

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation