March 21, 2025

What Exactly Are Chiplets And Heterogeneous Integration? The chiplet boom has spotlighted confusion over its true definition. Experts disagree on whether die-to-die interfaces or open-market standardization define a chiplet, complicating discussions around heterogeneous integration and hindering industry-wide clarity for future innovation. Semiconductor Engineering

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The Rise Of Thin Wafer Processing The shift to 3D-ICs and advanced packaging drives demand for ultrathin wafers, critical for improving performance, reducing power, and enabling AI, mobile, and wearable devices. Precision thinning, bonding, and debonding processes are essential to prevent damage and ensure yield. Semiconductor Engineering

Large Area Sintering (Half-Bridge Modules) in Power Electronics Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics where efficiency and reliability are essential. Technical Paper

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Nvidia CEO Huang says he was wrong about timeline for quantum, surprised his comments hurt stocks At Nvidia's Quantum Day, CEO Jensen Huang walked back his January remarks doubting near-term quantum computing. Acknowledging he "was wrong," Huang emphasized Nvidia's role in supporting quantum development through simulators, GPUs, and a new Boston research center. CNBC

Micron shares jump on earnings beat, rosy guidance as data center revenue triples Micron shares jumped 6% after strong Q2 results beat expectations. Revenue surged 38%, net income doubled, and data center sales tripled. The company also issued bullish Q3 guidance, topping analyst forecasts and boosting investor confidence. CNBC

Sponsor Multi-Sensor Metrology Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for packaging applications. Camtek

Technical Papers Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components In situ hydrogen plasmas — A New Paradigm for Advanced Packaging Multi-Sensor Metrology for the most challenging Advanced Packaging Applications Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling Package Integrated Vapor Chamber Heat Spreaders Ultrasonic Bonding in semiconductor industry – The fast and clean process Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry MORE TECHNICAL PAPERS

Sponsor Plasma Treatment during FOWLP Optimizes Performance and Costs Fan-out Wafer-Level (FOWLP) & Fan-out Panel-Level (FOPLP) benefit from plasma treatment, which ensures surfaces are contamination-free. Read more MARCH | Nordson Electronics Solutions

Synopsys: Autonomous AI Agents to Tame Chip Design Complexity At SNUG 2025, Synopsys CEO Sassine Ghazi outlined a bold AI-driven future for chip design, comparing AI agents to autonomous vehicles. He emphasized re-engineering engineering through agentic AI to tackle exponential design complexity and accelerate product development cycles. EE Times

Nvidia planning massive outlay on US electronics Nvidia plans to spend hundreds of billions on U.S.-made chips over four years, boosting domestic production through TSMC and Foxconn. CEO Jensen Huang emphasized supply chain resilience and dismissed concerns over AI models reducing chip demand. Taipei Times

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Musk Says Chip Capacity Will Decide Winner of AI Race Elon Musk warns that U.S. dominance in AI hinges on control of advanced chipmaking, currently centered in Taiwan. He's backing major investments to onshore production, calling Taiwan's monopoly a national security threat amid rising tensions with China. EE Times

AMD's Lisa Su has already vanquished Intel. Now she's going after Nvidia When Lisa Su took over as AMD's CEO in 2014, the company teetered on bankruptcy. A decade later, Su transformed AMD into a $172 billion tech powerhouse, leading a stunning turnaround and betting big on AI to fuel future growth. CNBC

Sponsor Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT) AI Technology pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding. We now have extended our adhesive line. See more A.I. Technology, Inc.

Using Glass As A Dielectric In Electronic Packaging Glass substrates are emerging as a high-performance alternative to epoxy in semiconductor packaging, attracting major chipmakers. Driven by glass’s strength, thermal stability, and signal performance, companies are ramping up R&D to tackle integration challenges. Semiconductor Engineering

AI And Semiconductor In Reciprocity AI and advanced semiconductor packaging are driving each other's growth in a powerful feedback loop. As AI demands intensify, packaging innovations like 2.5D, FO-RDL, and active interposers become essential. The semiconductor market is projected to hit $1 trillion by 2030. Semiconductor Engineering

Sponsor Advancing the future of driver assistance Explore how cutting-edge material innovations are enhancing the integration and performance of Advanced Driver Assistance Systems (ADAS) in the evolving automotive landscape. Henkel Corporation

Sustainable AI Systems For Energy-Efficient Computing AI's explosive growth is driving soaring demand for semiconductors, expected to push the industry to $1 trillion by 2030. But energy consumption and hardware limits pose major challenges. SEMI leads efforts to drive innovation and cross-industry collaboration. Semiconductor Engineering

Sponsor Tresky DIE Sorting Cycle time optimized re-sorting or re-organization of semiconductor chips from one component presentation into another presentation. Chips are often rearranged from a wafer to a waffle pack. Tresky Automation