semiconductor
packaging news
Sponsor
Dr.-Tresky-AG

1 of 10 Applications: UV Curing
Swiss made die bonders from Tresky handle bonding processes with fast curing UV adhesives easily. A high-power UV source attached to the dispenser takes care of the curing step.
Dr. Tresky AG
Industry Press
Littelfuse Introduces Industry-First Nano2 415 SMD Fuse with 1500A Interrupting Rating at 277V
Littelfuse
STMicroelectronics combines activity tracking and high-impact sensing
STMicroelectronics
The future of CIS manufacturing: Make the impossible possible...
YOLE Group
ASMPT presents die bonder with intelligent features
ASMPT
EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for HI to be Highlighted at ECTC
EV Group
Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025
Brewer Science
Carl Zeiss Meditec achieves revenue growth and stable operating profit
Carl Zeiss Meditec AG
SMART launches new research group WISDOM
Singapore-MIT Alliance for Research and Technology (SMART)
MORE INDUSTRY PRESS
Sponsor
kyzen

IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
CyberOptics
What Year Was It?
First Academy Awards Ceremony
What Year
The Academy of Motion Picture Arts and Sciences hands out its first awards, at a dinner party in the Roosevelt Hotel in Hollywood, California.
See the answer below.
Camtek-USA-Inc
Sponsor
Koki-Americas

Koki 2025 Webinar Series: Advanced Soldering Solutions
oin Koki's 2025 Webinar Series for exclusive insights into soldering materials, process optimization, and reliability improvements, designed for manufacturers and engineers.
Koki Americas
Henkel-AG-Co
Sponsor
Tresky

Ultrasonic Bonding: Cohesive connection between a chip & substrate
Electrically conductive and mechanical bonds for temp-sensitive components or components that are difficult to heat with Ultrasonic Bonding.
Tresky Automation
What Year Was It Answer
First Academy Awards Ceremony
Answer: May 16, 1929
May 16, 2025
image
Die-to-die Interconnect Standards In Flux
UCIe 2.0 raised concerns for being overly complex, but many of its new features are optional and tailored for future chiplet marketplaces. While most current designs are captive and don't need full interoperability, flexibility remains a key strength.
Semiconductor Engineering
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
TSMC to Build 9 Facilities in 2025, Sub-2nm Production Set for Taichung by 2028
TSMC is aggressively expanding with plans to build nine new sites in 2025, including eight fabs and an advanced packaging plant. The company is ramping 2nm production, growing 3nm output, and scaling packaging for AI and HPC demand.
Trend Force
Large Area Sintering (Half-Bridge Modules) in Power Electronics
Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics where efficiency and reliability are essential.
Technical Paper
Sponsor
BTU-International

TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle.
BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now!
BTU International
Vietnam's Semiconductor Packaging & Testing Industry Picks up Steam
Vietnam aims to build 100 chip design firms and one semiconductor plant by 2030, scaling to 300 firms and three plants by 2050. Major investments from CT Semiconductor, Amkor, Samsung, and Intel are fueling this ambitious growth.
Trend Force
Cerebras CEO says chipmaker's 'aspiration' is to hold IPO in 2025
Cerebras CEO Andrew Feldman aims to take the AI chipmaker public in 2025, following U.S. approval to sell shares to UAE-based Group 42. With strong sales and new tech announcements, Cerebras positions itself against Nvidia in a rebounding IPO market.
CNBC
Sponsor
Pac-Tech

Achieve Precision in WLCSP Bumping
Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts.
PacTech
Technical Papers
How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing
Reducing CTE Mismatch Defects in Flip Chip Reflow
Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
Multi-Sensor Metrology for the most challenging Advanced Packaging Applications
MORE TECHNICAL PAPERS
Sponsor
Akrometrix

The Global Leader in Warpage Metrology Solutions
We manufacture, sell, & provide Thermal and Room Temperature Warpage System Solutions, and Testing Services for Warpage and Strain.
Akrometrix
Canada's Chip Industry Charts Best Path to Growth
At the CHIPS NORTH Summit, industry leaders urged Canada to define a long-term semiconductor strategy. While large-scale fabs seem unlikely, experts see opportunity in design, talent retention & targeted investment to boost homegrown innovation & global competitiveness.
EE Times
What to Look Out for When Acquiring AI Systems
The IEEE has finalized draft standard IEEE 3119-2025 to guide government procurement of high-risk AI systems. It offers a risk-based, operational framework to ensure responsible purchasing, adding a key step—solicitation preparation—based on EU feedback.
IEEE Spectrum
Sponsor
Aim-Solder

The Role of Solder in Advanced Semiconductor Packaging
See how solder products drive innovation in packaging technologies, highlighting the growing integration of ASP and SMT processes.
AIM Solder
TSMC outlines work on nine new advanced factories
TSMC plans to build nine new fabs in 2025—including eight wafer plants and one advanced packaging facility—to meet surging AI and HPC chip demand. The company is expanding in Taiwan, the U.S., and Japan while ramping CoWoS capacity.
Taipei Times
Apple's China shift begins with Foxconn's $433M chip deal in India
Foxconn and HCL received Indian government approval to build a ₹37.06 billion ($433M) semiconductor plant in Uttar Pradesh. Operational by 2027, the facility will produce display driver chips, as Apple shifts manufacturing from China to India.
CNBC
Sponsor
Ontos-Equipment-Systems

OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
Development Flows For Chiplets
Chiplets promise a revolution in semiconductor design, but fragmented standards and ecosystem immaturity stall progress. Experts stress the need for unified models, cross-vendor collaboration & trusted frameworks to truly unlock scalable, interoperable 3D-IC & chiplet-based architectures.
Semiconductor Engineering
AI Accelerators Moving Out From Data Centers
AI's data surge is pushing chipmakers to move beyond traditional planar SoCs. In a recent panel, industry leaders emphasized the growing need for advanced compute architectures and highlighted chiplets as a key solution to meet AI demands.
Semiconductor Engineering
Sponsor
Nordson-ASYMTEK

Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
US smartphone shipments jumped 30% in March on tariff anticipation, analysts say
Smartphone shipments to the U.S. surged 30% in March as Apple, Samsung, and Motorola rushed to beat looming tariffs. Apple airlifted $2 billion in iPhones from India, highlighting a sharp supply chain pivot away from China.
South China Morning Post
Sponsor
DL-Technology

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
Today's Sponsor
AI-Technology-Inc
Sponsor
AI-Technology-Inc

Proven Die-Attach Pastes and Films
Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity.
AI Technology, Inc.
Test Your Knowledge
Which one of the following animals is not found exclusively in Africa: Lion, Orangutan, Gorilla, or Gazelle?
See answer below.
Ormet-TLPS
Quote of the Day
"The advantage of a classical education is that it enables you to despise the wealth which it prevents you from achieving."
Russell Green
Sponsor
Surfx-Technologies

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
Hydrogen plasmas drive breakthroughs in 3D chip technology, enabling ultra-dense interconnects and faster signal speeds above 5 GHz.
Surfx Technologies
Industry Calendar
May 19, 2025
Semiconductor Reliability and Product Qualification
Semitracks, Inc.
May 20, 2025
SEMICON Southeast Asia 2025
SEMI
May 27, 2025
ECTC
ECTC
Jun 3, 2025
Overview of semiconductor manufacturing webinar for American attendees
PTI International
Jun 9, 2025
Understanding semiconductor technology and business/ Boston/Wakefield, MA
PTI International
FULL INDUSTRY CALENDAR
XYZTEC
Cartoon of the Day
Cartoon
"Information security is becoming a big problem here. Do you still have my Captain Crunch decoder ring?"
Copyright © Randy Glasbergen
Sponsor
Brewer-Science

Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science
SEIKA-America
Test Your Knowledge Answer
Which one of the following animals is not found exclusively in Africa: Lion, Orangutan, Gorilla, or Gazelle?
Answer: Orangutan (found only in Asia)