July 13, 2026

TSMC to Build 3 New Packaging Fabs in Chiayi Science Park's Phase II TSMC will build three advanced packaging facilities in Chiayi Science Park's Phase II, creating an AI semiconductor cluster. The expansion aims to meet rising computing demand, boost Taiwan's chip supply resilience, generate jobs and strengthen global packaging leadership. Taipei Times

Sponsor Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more. Ontos

Apple's $30B Broadcom Deal Signals Expansions in AI, U.S. Supply Chain Apple expands its U.S. manufacturing push with a $30B Broadcom deal to secure custom chips and wireless components. The partnership boosts Broadcom's Fort Collins site, creates jobs, produces billions of chips and strengthens U.S. supply chains. EE Times

Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Technical Paper

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

Taiwan, US not chip competitors, US researcher says US academic Michael Cunningham disputes Donald Trump's claim that Taiwan took the US chip industry, arguing the two are key semiconductor partners. He says US design expertise and Taiwan's manufacturing strengths are complementary, not competitive. Taipei Times

Micron's massive profits are a guarantee of trouble AI-driven demand has pushed Micron, SK Hynix and Samsung into record profits as memory shortages inflate prices. The chip giants face customer backlash, regulatory scrutiny and Chinese competition while expanding capacity to meet surging demand through 2028. Taipei Times

Sponsor Chemically Resistant, UV Curable Epoxy Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating. Master Bond

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

Chinese chip start-up aims to build 5-nanometre equivalent chips without using EUV by 2029 Chinese chip start-up Yuanjiwei launched an 8-inch production line for 2D semiconductors, advancing efforts to build alternatives to silicon chips and bypass US equipment curbs. The company targets 5nm-equivalent chips by 2029 without EUV lithography. South China Morning Post

The AI race is shifting from bigger models to cheaper, smarter systems AI competition is shifting from building bigger models to deploying efficient systems that match models to specific tasks, budgets and data needs. Open-weight models are gaining ground, lowering costs, enabling customization and challenging top AI labs' pricing power. CNBC

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Taiwan's AI boom widens finance gap Taiwan's AI boom is reshaping finance, boosting securities firms, banks and insurers through market gains, lending and demand growth while exposing leasing companies to China's slowdown and weak industries. Taiwan Ratings expects widening earnings gaps as risks rise across sectors. Taipei Times

SK Hynix raises US$26.5bn in record debut in the US SK Hynix raised US$26.5 billion in its record US depositary share offering, attracting strong investor demand as the memory leader funds AI infrastructure expansion. The company's ADR debut became the largest US first-time foreign listing, boosting its global ambitions. Taipei Times

Sponsor Award Winning Acquisition Mode Dynamic Planar CT Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure. Nordson Test & Inspection

GlobalWafers eyes expansion at Texas facility GlobalWafers secured a 10-year supply deal and $500 million funding from Micron, prompting US capacity expansion. The company will expand its Texas 12-inch wafer fab, strengthening domestic semiconductor supply chains and supporting AI, HPC and advanced memory demand. Taipei Times

Nanya to increase capital expenditure Nanya Technology will quadruple next year's capital spending to NT$200 billion to expand DRAM capacity as AI-driven demand fuels memory shortages. The chipmaker expects tight supply through 2028, rising prices, and longer customer agreements to secure future supply. Taipei Times

Sponsor Chiplets and Advanced Packaging Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now. xyztec

The next frontier of AI: how 'world models' are simulating reality and virtual spaces AI companies are shifting beyond text and image generation toward world models, which simulate changing physical and digital environments over time. China is rapidly testing diverse approaches in robotics, autonomous driving and virtual worlds as firms compete to build systems. South China Morning Post

Sponsor 1 of 10 Applications: Sinter Sintering high-power semiconductors with silver or copper interfaces is easy with Swiss made Tresky die bonders at temperatures over 300°C and low or high bond forces. Dr. Tresky AG