May 12, 2026

Chinese chip pioneer calls for focus on ‘pragmatic breakthroughs’ over chasing 2nm hype SMIC founder Richard Chang urges China’s semiconductor industry to prioritise mature chips and niche technologies for supply chain security, warning against overemphasis on advanced nodes. He highlights workforce shortages and suggests focusing on practical innovation amid US export controls. South China Morning Post

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

Chinese chip pioneer calls for focus on ‘pragmatic breakthroughs’ over chasing 2nm hype SMIC founder Richard Chang urges China’s chip industry to prioritize mature nodes and niche applications for supply chain security, warning against overemphasis on advanced process nodes. He highlights their dominance in demand and stresses engineering talent shortages. South China Morning Post

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

China’s AI ascent leaves Trump a stark choice: escalate or relax chip controls? Nvidia CEO Jensen Huang faces escalating US-China chip tensions as Beijing restricts H20 imports and delays H200 sales while China pivots toward Huawei. Ahead of Xi-Trump talks, sides manage not resolve AI semiconductor rivalry amid export controls and self-sufficiency push. South China Morning Post

Wall Street thinks memory is AI’s golden ticket. Harvard’s chip expert warns: ‘Curves that just go to the sky with no end…never continue forever’ Semiconductor stocks surged as the Philadelphia index jumped 60% in six weeks and Micron rallied 38%, driven by AI memory demand. Harvard’s Willy Shih warns the boom mirrors past cycles and won’t last despite soaring chip prices. Fortune

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor UV DIE Bonding Special Technology Liquid adhesive is cured using ultraviolet (UV) light. In contrast to epoxy, the UV adhesive remains in the liquid state until it is exposed to high-energy UV radiation with UV DIE Bonding technology. Tresky Automation

Applied Materials and TSMC Partner at the EPIC Center to Accelerate AI Scaling Applied Materials and TSMC expand decades-long collaboration through a new EPIC Center partnership in Silicon Valley, co-developing semiconductor materials, equipment, and process innovations to speed AI chip development, improve energy efficiency, and accelerate commercialization from research to manufacturing. 3DInCites

The Memory Wall Is Real, Here Is the Door Major DRAM makers invest heavily to expand capacity, but relief may not arrive until 2027–2028, as AI demand drives shortages and prices surge. Companies face feature cuts and strategic trade-offs, while hardware memory compression emerges as a near-term solution. EE Times

Sponsor Automatic Grading Without Assistance Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images. xyztec

EDITORIAL: The growing AI skills gap AI adoption is reshaping workplaces, creating a growing skills mismatch where companies cannot find workers with the right expertise while routine roles decline. Experts warn businesses need AI-integrated talent and expanded training as job demand rapidly shifts. Taipei Times

TSMC’s Arizona project proceeds well but faces water, labor challenges TSMC’s Arizona project progresses better than expected, earning NT$16.14 billion profit in 2024, while expanding fabs. However, it still confronts water shortages, labor and visa constraints, and regulatory challenges as it scales US investment and supply chain plans. Taipei Times

Sponsor A Safer Approach to Underfilled BGA Removal Traditional heat-based removal methods can damage circuit boards and compromise reliability. Learn how cold precision milling helps eliminate risks. Circuit Technology Center

Innovation abounds in device charging Chargers have evolved from bulky accessories into efficient, multi-device power systems using GaN, USB-C standardization and smart controls. Manufacturers are advancing silicon carbide and wireless technologies while developing adaptive, intelligent chargers that dynamically manage energy across connected devices. MIT Technology Review

Research Bits: May 11 Researchers use terahertz waves to monitor electrical activity inside packaged semiconductors in real time, while others develop a 96.2% efficient piezoelectric DC-DC converter and a silicon-based oscillatory Ising machine that improves scalable combinatorial optimization for industry applications. Semiconductor Engineering

Sponsor 1 of 10 Applications: Thermosonic Flip-Chip This powerful technology works in a single step by bonding flip chips with gentle ultrasonic compression at temperatures below 160°C and with single-micron accuracy. Dr. Tresky AG

TSMC to Remain Top Apple Chipmaker Despite Reported Intel Deal Experts say TSMC will remain Apple's main chipmaker despite reports of Intel deals. They cite TSMC's superior packaging, yields, and efficiency, while Intel and Samsung lag. Strong AI chip demand, especially from Nvidia, tightens capacity rather than technology issues. Taipei Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura