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Award Winning Acquisition Mode Dynamic Planar CT
Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure.
Nordson Test & Inspection
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1 of 10 Applications: RFID
Swiss made Tresky die bonders provide hassle-free bonding of flip chip circuits to flexible antenna substrates with highest flexibility and operator training within minutes.
Dr. Tresky AG
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What Year Was It?
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English Channel Tunnel Opens
A rail tunnel under the English Channel was officially opened, connecting Britain and the European mainland for the first time since the Ice Age.
See the answer below.
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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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What Year Was It Answer
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English Channel Tunnel Opens Answer: May 6, 1994
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Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.
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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
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GlobalWafers mulls price hike amid global turmoil
GlobalWafers plans to discuss wafer price hikes in the second half as geopolitical tensions raise costs for materials, energy and logistics. Strong demand and high capacity utilization support shipments, while government funding helps offset rising depreciation and margin pressure.
Taipei Times
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Vanguard adjusting new fab plans
Vanguard International Semiconductor adjusts its Singapore 12-inch fab to produce AI chip interposers using TSMC-licensed technology, scaling capacity to 44,000 wafers monthly. The US$6.7 billion plant operated with NXP will also make analog & power chips amid strong demand.
Taipei Times
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Interested in a demonstration?
We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day.
Surfx Technologies
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Looming Quantum Threat as PQC Market Expands
Juniper Research projects post-quantum cryptography market rising from $1.2B in 2026 to $13B by 2035 as Q-Day fears and regulations drive adoption, while firms counter "harvest now, decrypt later" threats using hybrid cryptography to secure legacy systems.
EE Times
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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Changes for chips
Taiwan tightens semiconductor safeguards with tougher trade secret laws, export controls, and outbound investment reviews focused on advanced chips. Authorities levy steep fines and prison terms to curb leaks, police cross-strait ties, and protect strategic high-tech exports.
Asia Business Law Journal
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The Next Phase of Europe's Semiconductor Strategy
Europe is reshaping its semiconductor strategy, moving from urgency to realism. Policymakers balance geopolitics, market pressures, and institutional limits while focusing on critical chips like automotive and power, and reforming Chips Act 2.0 to build a coherent long-term ecosystem.
EE Times
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Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
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Research Bits: May 5
MIT and MIT-IBM researchers unveil a fast model to estimate AI workload power use across chips with ~8% error, enabling operators to optimize energy efficiency. It replaces slow emulations and improves comparisons across hardware and data centers.
Semiconductor Engineering
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No more cartridge exchanges
The unique Revolving Measurement Unit (RMU) houses up to 6 sensors of any type that enable continuous pull/push and shear testing up to 200 kgf. Learn more.
xyztec
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| Today's Sponsor |
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Seam Seal Hermetic Packages with Auer Carriers and 3D Trays
MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing.
MicroCircuit Laboratories, LLC
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Test Your Knowledge
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What do you call the natural, molecular-attraction force that inhibits the spread of a liquid at its interface with a solid surface.
See answer below.
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Quote of the Day
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"Whatever the mind can conceive and believe, the mind can achieve." Dr. Napoleon Hill
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2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
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| Cartoon of the Day
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"I want you to prepare a dynamic, intense, powerful, energy-charged Relaxation Workshop!"
Copyright © Randy Glasbergen
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OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
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Test Your Knowledge Answer
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What do you call the natural, molecular-attraction force that inhibits the spread of a liquid at its interface with a solid surface. Answer: Surface Tension
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