Oct 12, 2026 Shift Left Complicates Fab Data Management Semiconductor fabs are deploying AI/ML models and real-time equipment data to detect yield issues earlier and optimize process control. However, surging data volumes challenge storage and processing, forcing manufacturers to balance data optimization with preserving critical context. Semiconductor Engineering

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

Chip Industry Week In Review Semiconductor firms are investing in advanced packaging, quantum computing, photonics and AI infrastructure as global chip sales surpass $1 trillion year-to-date. Rising inference workloads drive demand for specialized chips, optical networking and power infrastructure. Semiconductor Engineering

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. Technical Paper

Sponsor Real-Time Metrology Solutions Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies. Akrometrix

AI Interposers Grow Larger, Raising HBM4E Cooling Challenges: How Samsung, SK hynix Are Responding As AI packages grow, Samsung is developing HCB and HPB technologies to manage rising HBM4E heat. With interposers expanding dramatically, Samsung and SK hynix are targeting hotspots with improved thermal paths to support next-generation AI computing. TrendForce

NVIDIA's NVHBM Reshapes Base Die Strategies: How Micron, Samsung Are Bringing TSMC Into the Fold NVIDIA's custom NVHBM is reshaping memory sourcing as Micron, Samsung and SK hynix explore external foundries for base dies. The technology promises higher bandwidth, lower power consumption and improved chip area efficiency for AI accelerators. TrendForce

Sponsor Two Component, Thermally Conductive Epoxy Master Bond EP21AOLV-1 is a thermally conductive, electrically isolating adhesive featuring a low CTE, excellent dimensional stability, and high compressive strength. Master Bond

Technical Papers ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor MORE TECHNICAL PAPERS

Sponsor IC Device & Micro-Electronic Cleaning Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge. Kyzen Corporation

Master AI Chip Principles With New IEEE Design Program The growing complexity of AI models is driving demand for specialized processors that overcome memory and computational bottlenecks. IEEE's program explores AI processor architectures, hardware design principles, and hardware-network co-optimization for efficient deployment. IEEE Spectrum

OpenAI expects US$70bn in annualized revenue OpenAI expects annualized revenue to reach $70 billion by year-end, driven by enterprise growth, up from $50 billion last month. The company is seeking $30 billion or more in funding at a $1.4 trillion valuation. Taipei Times

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

GlobalFoundries rallies after US$2bn TSMC deal GlobalFoundries shares rose 7% after securing a five-year, $2 billion agreement to supply silicon interposers to TSMC. The deal expands US advanced-packaging capacity, supports growing AI and high-performance computing demand, and targets volume production in 2028. Taipei Times

Soaring component costs force laptop makers to rethink shift away from China: report TrendForce reports rising component costs are pushing notebook makers to rethink production shifts outside China. As brands prioritize manufacturing efficiency over supply-chain diversification, weakening demand threatens shipments, margins and laptop affordability. South China Morning Post

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Scaling 3D IC design: Trends, Challenges and Practical Workflows Siemens and Futurum Group will explore 3D IC market trends, adoption drivers, and design challenges in AI and HPC systems. The webinar will demonstrate Innovator3D IC workflows for architecture exploration, die-package-system co-design, and integrated planning. EE Times

TSMC and GlobalFoundries: How a $2 Billion Deal Could Reshape America's Advanced Packaging Supply Chain GlobalFoundries and TSMC signed a $2 billion, five-year deal to produce silicon interposers in New York, expanding US chipmaking capacity and advancing packaging technology to meet AI processors' growing performance and integration demands. SemiVision

Sponsor 1 of 10 Applications: Hybrid Bonding Maximum flexibility is the hallmark of Swiss made die bonders from Tresky. To apply adhesive before bonding, dispensing and stamping systems are available, as are flux systems. Dr. Tresky AG

The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control Advanced packaging boosts semiconductor performance as AI, computing & networking demand greater bandwidth & efficiency. Manufacturers must control residual static charge from materials and processes to improve device reliability, ensure consistency and increase production yield. Semiconductor Engineering

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

CPO Testing Faces A Moving Target Problem The rapid data center expansion is increasing demand for near-packaged and co-packaged optics, challenging test manufacturers to develop high-volume production tools. Industry experts from Teradyne, Advantest, ASE Group, and Keysight discuss emerging optical testing requirements. Semiconductor Engineering