August 5, 2026

From Blueprint to Build: Engineering the World's Largest AI Chips Intel Foundry unveiled AI packaging innovations at IEEE ECTC 2026, enabling hyper-large chip packages up to 240 mm × 240 mm. The designs increase compute density, bandwidth, and energy efficiency while supporting scalable AI systems for data centers and supercomputers. Semiconductor Engineering

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Nvidia will soon face a chip limit, warns Huawei's top scientist Huawei's top chip scientist said physical limits will slow traditional chip scaling, positioning the company's Tau Scaling Law as an alternative. He argued China must build a self-reliant semiconductor ecosystem and co-design AI hardware and models to overcome US sanctions. The Business Times

Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. Technical Paper

Sponsor Chiplets and Advanced Packaging Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now. xyztec

Automotive Cybersecurity: AI Attack Surfaces Grow Automotive cybersecurity threats are accelerating as software-defined vehicles and AI expand attack surfaces. Upstream Security's 2026 report found sharp increases in cyber incidents, threat actors and vulnerabilities, driving demand for AI-powered defenses and continuous monitoring. EE Times

Silicon, not software, will decide the AI race AI's rapid growth stems from a self-reinforcing cycle in which breakthroughs, mass-market demand and infrastructure investment drive semiconductor innovation. Success now depends as much on chips, energy, manufacturing and computing capacity as on advances in AI models. Taipei Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor LAB Flip Chip Reflow Process Robustness Prediction Predicting laser-assisted bonding (LAB) parameters and ideal solder temperature range for a black box substrate. Read more. Amkor Technology, Inc.

Powerchip says revenue to increase in second half Powerchip Semiconductor expects double-digit revenue growth in the second half, plans its first cash dividend in four years, and targets rapid expansion in AI-related foundry services after returning to profitability despite the recent death of chairman Frank Huang. Taipei Times

Demand prompts Vanguard expansion Vanguard International Semiconductor is accelerating capacity expansion as AI-driven demand outpaces supply. The chipmaker expects AI revenue to rise sharply, plans higher wafer prices next year, and is ramping its Singapore fab to ease shortages and support long-term growth. Taipei Times

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

New Space: Power, Computing and Thermal Challenges Beyond Earth The New Space eBook explores technologies transforming the commercial space economy, from CubeSat power systems and AI onboard computing to advanced semiconductors, HAPS and space data centers, highlighting innovation, design tradeoffs and new commercial opportunities. EE Times

Chinese chip-tool maker AMEC says first-half profit to nearly quadruple amid soaring demand AMEC expects first-half profit to nearly quadruple as US sanctions accelerate demand for Chinese chipmaking equipment and domestic semiconductor expansion. The company is also speeding product development and targets supplying most high-end tools within five years. South China Morning Post

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

Invest In Junior Engineers AI is reshaping engineering, but replacing junior engineers risks weakening future talent and innovation. Companies should redefine engineering roles, combine AI with human creativity, and invest in developing junior staff to ensure experienced leaders and sustained competitiveness. Semiconductor Engineering

Research Bits: Aug. 4 Researchers developed three stretchable wearable technologies: a reprogrammable transistor, thread-based circuits, and paint-on e-tattoos. They process physiological signals, enable adaptive health sensing, and advance personalized bioelectronics and smart medical devices. Semiconductor Engineering

Sponsor A Universal AI-Powered Segmentation Model A new universal deep learning model enhances automated optical inspection by accurately segmenting images for both PCBAs and semiconductors. It boosts defect detection efficiency, simplifies model management & supports auto-programming. Nordson Test and Inspection

Renesas Tackles Memory Bottleneck with MRDIMM Update Renesas unveiled its Gen 3 DDR5 MRDIMM chipset, delivering up to 16,000 MT/s and 25% higher memory bandwidth to ease AI, cloud, and HPC memory bottlenecks while improving performance per watt without requiring major server platform redesigns. EE Times

Sponsor Optically Clear, Low Outgassing Epoxy Master Bond EP4CL-80 is an optically clear, low outgassing epoxy for bonding and sealing that possesses excellent dimensional stability and low shrinkage upon curing. Master Bond