February 6, 2026

From Monolithic SoCs To Chiplets: A New Hardware Security Paradigm Chiplet designs boost scalability and flexibility but upend SoC security by spreading trust across multi-vendor dies and links. A new system-level model anchors trust in a main security chiplet and enforces cryptographic protection across chiplets. Semiconductor Engineering

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

VIEWPOINT 2026: Marc Engel, CEO, Agileo Automation The shift toward advanced packaging (AP) is fundamentally reshaping semiconductor manufacturing, blurring the lines between front-end and back-end processes. For equipment manufacturers, this evolution demands a dual transformation in automation strategy. As back-end fabs adopt AP techniques, they are ... Agileo Automation

A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC (Multilayer Ceramic Chip Capacitor) capacitors and presents a comparison to conventional bonding using solder paste and reflow oven. Technical Paper

Sponsor Packaging Solutions for Unique Markets The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets. Amkor Technology, Inc.

ASE increases capital spending to record US$7bn ASE Technology will boost capital spending to a record $7 billion this year, up 27%, to expand advanced packaging for AI demand, expecting LEAP revenue to double as hyperscaler-driven AI servers and recovering automotive markets keep demand ahead of supply. Taipei Times

Amazon cloud unit beats on revenue and profit as parent company ramps up AI spending Amazon's cloud unit posted nearly 24% fourth-quarter revenue growth, beating estimates as AWS delivered $35.6 billion in sales and most profits, expanded margins, rolled out new AI tools, and signaled massive AI-driven capital spending. CNBC

Sponsor 94GHz Elastomer Socket BGA1440 Test a 75 watt BGA device with high performance elastomer using a simple swivel lid mechanism. Elastomer connects each signal with -1dB insertion loss Pic: C24548.jpg Ironwood Electronics

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more. Ontos

TSMC 3nm chip plan in Japan, a win for Takaichi TSMC will upgrade its second Kumamoto fab to produce 3-nanometer chips, investing ¥2.6 trillion, marking a major win for Japan's tech strategy, strengthening supply chains, and expanding overseas capacity amid rising AI demand and constraints in Taiwan. Taipei Times

"Quantum Twins" Simulate What Supercomputers Can’t Silicon Quantum Computing launched Quantum Twins, an analog silicon quantum simulator. With 15,000 quantum dots, it shows a classically intractable metal–insulator transition, proving near-term quantum simulation can tackle materials problems today. IEEE Spectrum

Sponsor How copper sintering could reshape WBG devices From EVs to energy infrastructure, WBG devices demand more. Read this 5-minute article on why copper sintering is gaining momentum. Henkel AG & Co.

Qualcomm stock sinks 8% as company issues dire warning on memory shortage Qualcomm shares slid 8% after weak guidance, as AI data-center demand siphoned DRAM from consumer devices. CEO Cristiano Amon cited memory shortages, topped estimates, but warned revenue and earnings will fall even as handset demand stays strong. CNBC

Altman lashes out at 'clearly dishonest' Anthropic ads as AI spat heats up Anthropic fired a Super Bowl salvo at OpenAI with ads touting Claude's ad-free stance, prompting CEO Sam Altman to call the campaign deceptive as OpenAI prepares limited, clearly labeled ChatGPT ads amid an intensifying rivalry. CNBC

Sponsor Hermetic Package Automation with HDHS® Technology Enables Seam Sealing with industry standard tooling including Auer carriers and custom carriers including non-standard square trays. Rapid switchover from one carrier tooling to the next is a PC program change. MicroCircuit Laboratories, LLC

Securing Hardware For The Quantum Era Quantum computers could break today's encryption as soon as 2027–2030, driving urgent action now. Experts warn of "harvest now, decrypt later" attacks and regulatory pressure, pushing chip designers to adopt updatable, quantum-resistant cryptography for long-lived systems. Semiconductor Engineering

TSMC Japan plan for advanced chips seen as hedge against pressure from US, China TSMC plans to produce 3-nanometre chips at its Kumamoto, Japan, plant, diversifying manufacturing to hedge US tariff risks and potential China-Taiwan disruption while giving Japanese firms such as Sony and Toyota local access to advanced AI chips. South China Morning Post

Sponsor Interested in a demonstration? We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day. Surfx Technologies

Why Now Is the Right Time for Semiconductor Fabs in Germany Europe's chip exodus came from lack of capital scale, not labor costs. With Chips Acts, new wafer and packaging fabs, and AI-driven memory demand, Europe can rebuild a full memory supply chain, led by GlobalFoundries and FMC, targeting advanced node. EE Times

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology