March 11, 2026

Intel Demos Chip to Compute With Encrypted Data Intel unveiled its Heracles accelerator for fully homomorphic encryption at the IEEE International Solid-State Circuits Conference, claiming up to 5,000-fold speed gains over CPUs and signaling a major step toward practical encrypted computing for cloud and AI workloads. IEEE Spectrum

Sponsor Plasma Treatment during FOWLP Optimizes Performance and Costs Fan-out Wafer-Level (FOWLP) & Fan-out Panel-Level (FOPLP) benefit from plasma treatment, which ensures surfaces are contamination-free. Read more Nordson Electronics Solutions

VIEWPOINT 2026: David Heller, CEO, Heller Industries At Heller Industries, innovation drives our position as the leading thermal solution provider for SMT and semiconductor manufacturing. In 2026, we are excited to launch many new features including a revolutionary flux management system delivering unprecedented efficiency with low maintenance, batch reflow ... Heller Industries

Peer viewpoint: semiconductor innovation for telecommunication networks Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure. Technical Paper

Sponsor Elevate Efficiency: MRSI-H1 Die Bonder Transform your assembly with precision and speed. Discover unparalleled quality and efficiency. MRSI

TSMC reports sales hit record high last month Taiwan Semiconductor Manufacturing Co. reported record February sales of NT$317.66 billion, driven by strong demand for advanced 3nm AI chips. The chipmaker expects about 30% revenue growth in 2026, with key customer Nvidia fueling expanding wafer demand and capacity plans. Taipei Times

Memory price hikes 'the new normal' as AI boom fuels storage demand, Seagate says Seagate Technology warned memory price hikes may become the "new normal" as AI-driven demand triggers an industry supercycle. Rising DRAM costs and booming data-centre needs are pushing storage demand and accelerating new high-capacity drive deployments. South China Morning Post

Sponsor Copper Stud & CTE Nano Tech Underfill AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles. AI Technology, Inc.

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Nordson Sight™ Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields. Nordson Test & inspection

Apple makes about 25% of iPhones in India after China pivot Apple Inc increased iPhone production in India by about 53 percent last year to 55 million units, raising the country's share to roughly a quarter of global output as the company shifts manufacturing away from China to mitigate tariffs and diversify its supply chain. Taipei Times

Innolux selling factory in Tainan to ChipMOS Innolux Corp said it would sell a panel module assembly facility to ChipMOS Technologies Inc for NT$880 million, aiming to raise capital and restructure operations, while ChipMOS expands chip testing and packaging capacity to meet booming AI-driven memory and logic chip demand. Taipei Times

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

How the Iran war and rising energy prices are threatening semiconductor demand Analysts warn a prolonged U.S.–Israel–Iran conflict could disrupt semiconductor supply chains by threatening Middle East sources of key materials like helium and bromine. Shipping risks and rising energy costs may also curb AI chip demand and pressure semiconductor stocks. CNBC

Samsung Electronics spends 37.7 tln won in R&D in 2025 Samsung Electronics spent a record 37.7 trillion won (US$25.6 billion) on R&D in 2025, up 7.8 percent year on year, to secure an early lead in AI chips. The company also boosted facility investment while advancing next-generation HBM4 memory development and production. Yonhap News Agency

Sponsor Amkor's System in Package (SiP) Solutions Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more. Amkor Technology, Inc.

SK Innovation to invest US$380 mln in SK hynix's U.S. AI affiliate SK Innovation will invest $380 million in a U.S. affiliate of SK hynix to pursue opportunities in AI energy infrastructure. The move aims to strengthen participation in the AI data center ecosystem and expand business prospects in global AI markets. Yonhap News Agency

Singulated Die Test Ensures Stacked Die Quality As Power Density Rises Rising power density and shrinking geometries are pushing chipmakers toward singulated die testing with active thermal control. The method exposes post-singulation defects, stabilizes heat, and boosts chiplet yields. Semiconductor Engineering

Sponsor Turnkey Electroless Plating Solutions PacTech delivers precision electroless plating with PACLINE® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success. PacTech

China's chip exports surge 73% as AI demand fuels semiconductor growth China's chip exports surged 72.6% year on year to $43.3 billion in the first two months, customs data shows, as Beijin's push for semiconductor self-sufficiency and booming AI demand drive production, global shipments, and rising prices amid a tightening memory supply. South China Morning Post

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.