July 17, 2026

Alternative Materials For Hybrid Bonding Copper-to-copper hybrid bonding advances AI chip packaging with denser interconnects and thinner designs than solder methods. Researchers refine surfaces and dielectrics to strengthen bonds, reduce defects, and improve thermal stability too. Semiconductor Engineering

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

ASML mulling price hike that might hit TSMC, report says ASML plans to raise chipmaking equipment prices as AI-fueled demand strengthens sales, drawing pushback from TSMC. The company also lifted its annual sales forecast, expanded production plans and cited robust demand for advanced lithography systems. Taipei Times

How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing This paper explores how precision motion systems enable key semiconductor manufacturing trends—such as node scaling, advanced packaging, and photonic integration—by delivering the accuracy required for nanoscale production and testing. Technical Paper

Sponsor High-Speed, Reliable Plating with PACLINE® PACLINE® delivers high-throughput, precision electroless plating with full automation—ideal for UBM, RDL, and wafer-level packaging in semiconductor production. View Solution. PacTech

TSMC lifts capex above US$64bn as AI use rises TSMC raised its 2025 capital spending above US$64 billion and expanded its US investment to US$265 billion, driven by surging AI demand. The chipmaker also boosted its revenue outlook, expanded global manufacturing, and reported record quarterly profit. Taipei Times

TSMC Announces Additional $100 Billion Investment In Arizona TSMC will invest an additional $100 billion in Arizona, expanding its total commitment to $265 billion for 10 fabs, advanced packaging plants and an R&D center. The expansion strengthens U.S. chip manufacturing, creates thousands of jobs and advances supply-chain resilience. City of Phoenix

Sponsor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications This paper explores how, with chips becoming smaller and mightier, automated x-ray metrology delivers game-changing quality and efficiency in wafer and panel level applications, while delving into industry trends. Nordson Test & Inspection

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor 1 of 10 Applications: Eutectic Bonding Swiss made Tresky die bonders can be fitted with temperature controlled chucks and protective gas suited to eutectic die bonding of chips with AuSn bumps for opto-electronic components. Dr. Tresky AG

Scientists Overcome a Major Electrical Bottleneck in Next-Generation Semiconductors KAIST researchers developed a seamless platinum diselenide interface that removes metal-semiconductor junction resistance. The advance cuts power loss, improves transistor efficiency, and enables smaller, energy-efficient AI processors and advanced chips. SciTech Daily

What the Quantum Computing Boom Means for CRE JLL says quantum computing is creating a fast-growing real estate market, with more than $4 billion in global projects. As investment rises, specialized facilities are clustering near research hubs, driving infrastructure demand and expanding private-sector opportunities. Commercial Property Executive

Sponsor e-media Advertising Delivers Results! Introduce your products & technology in Semiconductor Packaging News with our daily e-mail newsletter & website and see how a digital advertising campaign can deliver results. Semiconductor Packaging News

AI Data Centers Push Silicon Photonics Toward 300-mm Scale STMicroelectronics is expanding its 300-mm PIC100 silicon photonics platform to meet AI data center demand, combining advanced packaging, BiCMOS integration and high-volume manufacturing to deliver faster, more efficient optical interconnects. EE Times

Can Fine-Pitch Hybrid Bonding Go High Volume? Hybrid bonding has reached production, but scaling fine-pitch die-to-wafer applications remains difficult. Manufacturers must tightly control topography, contamination, alignment and process variation to sustain high-volume yields and reliable bonding. Semiconductor Engineering

Sponsor Full automation bond testers A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more. xyztec

New Nonvolatile Memory Winners Emerge MRAM and RRAM are replacing flash as the leading embedded memory technologies on advanced process nodes, delivering better scalability and performance. FeRAM and Quinas' UltraRAM show strong promise but require further development before widespread adoption. Semiconductor Engineering

Accelerating Sustainability With Smart Manufacturing SEMI unveiled a sustainability roadmap helping semiconductor fabs cut emissions, water use and waste with Industry 4.0/5.0 technologies. The model enables fabs to benchmark gains, prioritize investments and boost productivity, ROI and sustainability. Semiconductor Engineering

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

TSMC to invest additional $100 billion in Arizona after second-quarter profit soars 77% TSMC posted a 77.4% Q2 profit surge, beating expectations as booming AI chip demand drove record earnings. The chipmaker raised its annual investment budget, expanded Arizona plans, and forecast strong third-quarter revenue, reinforcing confidence in sustained AI-led growth. CNBC

Sponsor Safely Remove Underfilled BGAs Without Damaging the Circuit Board Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity. Circuit Technology Center