Aug 27, 2026 Apple Unveils M6, Its First 2nm Chip Built by TSMC Apple debuts M6 and M5 Ultra chips, pairing stronger CPU/GPU performance with major on-device AI gains. Built on TSMC's 2nm process, M6 validates N2 production, while M5 Ultra's quad-die design boosts bandwidth for demanding AI workloads. TrendForce

Sponsor AIT ORMET® TLPS for Thermal Conductivity AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS

India's OSAT-ATMP Build-Out: From Legacy Packages to 2.5D ASIP Technologies has begun building a ₹2,500 crore OSAT facility in Visakhapatnam with South Korea's APACT, targeting production within 18 months. The project will initially offer flip-chip BGA and wire-bond packaging, expanding to 2.5D packaging by 2030. EE Times

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs. Technical Paper

Sponsor Fine-Pitch MEMS Bonding Precision Upgrade MEMS cantilever bonding with LAPLACE®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time. PacTech

Why AI Needs a Different Kind of Data Center AI-native data centers must integrate compute, networking, storage, power and cooling from the start. AI racks can exceed 200kW, driving liquid cooling, high-speed networking and new power architectures as GPU clusters scale rapidly. Data Centre Digest

Samsung Electro-Mechanics, LG Innotek Ramp Up AI Substrate Capacity as 1H Utilization Reportedly Nears 90% South Korean substrate makers are expanding FC-BGA capacity as AI data centers tighten supply. Samsung Electro-Mechanics and LG Innotek target AI chips and servers, while Japan's Ibiden and Taiwan's Unimicron also boost ABF output to meet demand. TrendForce

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Technical Papers ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging ■ Revolutionizing IC Packaging with High-Density RDL Technology ■ EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices MORE TECHNICAL PAPERS

Sponsor Safely Remove Underfilled BGAs Without Damaging the Circuit Board Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity. Circuit Technology Center

AI server boom fuels record supply crunch for the 'rice of electronics' Global MLCC inventories hit record lows as AI infrastructure drives surging demand. Distributor volumes fell 8% in four weeks, while prices rose 10%. Manufacturers struggle to expand capacity fast enough, intensifying supply concerns and attracting investor interest. South China Morning Post

OpenAI's Jalapeño AI chip brings new 'threat' to Nvidia margins as custom silicon gains ground OpenAI unveiled its Jalapeño AI chip, claiming leading inference efficiency and performance. Developed with Broadcom, the chip could reduce reliance on Nvidia, intensify competition in AI silicon, and challenge GPUs as hyperscalers increasingly develop custom processors. CNBC

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

China's Grip on Erbium and Yttrium Could Choke Data-Center Growth China's control of erbium and yttrium supplies threatens critical U.S. industries as November export controls loom. Shortages could disrupt fiber optics, jet engines, turbines and AI data-center power systems, exposing national-security risks. IEEE Spectrum

From Days to Minutes: Accelerating 3D IC Debug with Agentic AI Agentic AI is reshaping semiconductor verification by automating debugging and triage. ChipAgents analyzes waveforms, finds root causes, proposes fixes, and verifies designs, accelerating 3D IC development and improving first-silicon success. EE Times

Sponsor Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more. Ontos

AI boom, profit surge fuel China's ambitious chip assembly buildout China's top chip packaging firms are investing over 15 billion yuan to expand advanced packaging capacity, fueled by AI demand, strong profits and Beijing's self-reliance push. JCET, Tongfu and Huatian are targeting high-end 2.5D, 3D and chiplet technologies. South China Morning Post

Chip Security Moves From Checkbox Compliance To Continuous Defense Semiconductor companies are rethinking security as a continuous discipline spanning hardware, firmware, software, networks, and chiplet architectures. Industry experts from Arteris, Cadence, Keysight EDA, Rambus, Siemens EDA, Synaptics & Synopsys discussed these challenges at DAC. Semiconductor Engineering

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

SEMI and THSRC collaborate for Semicon Taiwan Semicon Taiwan partners with Taiwan High Speed Rail to offer check-in services at five stations, easing travel for over 100,000 attendees. The partnership also boosts train capacity, links semiconductor hubs and highlights Taiwan's logistics advantage. TaipeiTimes

Sponsor Premier Semiconductor Packaging Event 3 days featuring 5 technical tracks, 100 exhibitors, panels, posters, professional development, along with strong industry engagement. Keynotes from Qualcomm, Marvell, and Cerebras. IMAPS 2026 on September 28. IMAPS

Gartner Forecasts Worldwide Semiconductor Revenue to Reach $1.6 Trillion in 2026 AI infrastructure is pushing global semiconductor revenue toward $1.6 trillion in 2026, nearly doubling 2025 levels. Memory leads growth as DRAM and NAND demand accelerates, while investment expands in CPUs, networking, power and optical tech. Gartner