| Sponsor |
|
Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
|
|
|
What Year Was It?
|
Milosevic Goes On Trial For War Crimes
Former Yugoslav president Slobodan Milosevic goes on trial at The Hague, Netherlands, on charges of genocide and war crimes in Bosnia, Croatia and Kosovo.
See the answer below.
|
| Sponsor |
|
Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
|
|
|
What Year Was It Answer
|
Milosevic Goes On Trial For War Crimes Answer: February 12, 2002
|
|
February 12, 2026
|
Resistance In Advanced Packages Is Now A System-Level Problem
Engineers evolve Kelvin measurement for modern chips, tracking tiny, time-dependent resistance shifts across stressed interfaces. Continuous, non-contact monitoring now spots early failure signs, protecting yield and reliability amid advanced packaging challenges.
Semiconductor Engineering
|
|
| Sponsor |
|
High Force and Large area bond tester
The most powerful bond tester to test IGBTs, power modules and large batteries up to 1000 kgf. Sigma HF/L offers flexible positioning and operates with the fastest axis speed. Learn more.
xyztec
|
|
VIEWPOINT 2026: Joe Montano, President and CEO, Delphon
As Delphon enters 2026, the company is at a true inflection point — driven by execution, not ambition alone. Over the past several years, we've deliberately expanded beyond our historical niches to position Delphon deeper in the semiconductor value chain. That strategy is now translating into tangible ...
Delphon
|
|
The Economics of Electronic Component Salvage and Reuse
This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.
Technical Paper
|
|
| Sponsor |
|
3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
|
|
| Sponsor |
|
Hermetic Package Automation with HDHS® Technology
Enables Seam Sealing with industry standard tooling including Auer carriers and custom carriers including non-standard square trays. Rapid switchover from one carrier tooling to the next is a PC program change.
MicroCircuit Laboratories, LLC
|
|
| Sponsor |
|
Thermal Warpage Testing Services
If you have any questions on your Thermal Warpage and Strain Metrology, our applications engineering experts will provide you with accurate and timely information for all your needs.
Akrometrix
|
|
RISC-V Pivots from Academia to Industrial Heavyweight
RISC-V speeds its global rise, with China driving half of shipments as Europe and India push tech sovereignty. Modular AI extensions, ISO standardization, and expanding cloud and automotive use propel the open ISA into mainstream industrial and data center markets.
EE Times
|
|
SMIC says rushed AI chip capacity could end up idle
SMIC warned that surging AI chip investment is pulling forward years of data center demand, risking idle capacity. Zhao Haijun flagged overheating spending and persistent HBM shortages, as the company posted strong quarterly profit growth and maintained heavy capital expenditure.
Taipei Times
|
|
Rising chip prices to curb phone sales
Rising memory chip prices could slash global smartphone shipments by up to 15% this year, TrendForce said, with Chinese brands hit hardest. Vendors face soaring component costs, forcing price hikes, while Huawei, Samsung and Apple are expected to weather the downturn better.
Taipei Times
|
|
Lam Research, CEA-Leti Open Fast Lane for Specialty Technologies
Lam Research and CEA-Leti signed a multi-year pact to speed semiconductor innovation, moving new materials and plasma processes from lab validation to fab readiness. The alliance targets AI, photonics, power & specialty chips while cutting risk & boosting sustainability & performance.
EE Times
|
|
| Sponsor |
|
Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
|
|
SK, Nvidia chiefs discuss AI ties in Silicon Valley: sources
SK Group Chairman Chey Tae-won met Nvidia CEO Jensen Huang in Silicon Valley to discuss AI cooperation spanning chips and biotech. They reportedly reviewed HBM4 supply for Nvidia's Vera Rubin accelerator and explored expanding South Korea's AI ecosystem.
Yonhap News Agency
|
|
Samsung CTO expresses confidence over HBM4 leadership
Samsung Electronics CTO Song Jai-hyuk reaffirmed the company's leadership in sixth-gen HBM4 at Semicon Korea 2026, highlighting strong client feedback & AI-driven synergies across memory, foundry &d packaging, as Samsung prepares its first HBM4 shipments, reportedly to Nvidia.
Yonhap News Agency
|
|
| Sponsor |
|
0.8mm Pitch BGA Socket Adapter
19x19mm body, 22X22 array 484 ball BGA package to be SMT attached to top adapter or placed inside compression mount socket mounted to top adapter.
Ironwood Electronics
|
|
| Today's Sponsor |
|
| Sponsor |
|
New PLP solution improves underfill yields
Underfill yields were greater than 99% and cycle time decreased 30% with the ASYMTEK Vantage system for panel-level packaging (PLP). Learn more.
Nordson Electronics Solutions
|
|
|
Test Your Knowledge
|
Which South American country lost its coastline to Chile in 1879?
See answer below.
|
|
Quote of the Day
|
This is one small step for a man, one giant leap for mankind. Neil Armstrong, In New York Times 31 July 1969
|
| Cartoon of the Day
|
|
"If I flee the country to avoid paying taxes, can I write off the miles as business travel?"
Copyright © Randy Glasbergen
|
|
|
Test Your Knowledge Answer
|
Which South American country lost its coastline to Chile in 1879? Answer: Bolivia (It still keeps its navy - on a lake). The War of the Pacific was the result of Chile's border claims of coastal Bolivian territory of the Atacama Desert.
|
|