May 11, 2026

TSMC to remain top Apple chipmaker despite reported Intel deal: Experts Experts say TSMC will remain Apple’s main chipmaker despite reports of Intel deals. They cite TSMC’s superior packaging, yields, and efficiency, while Intel and Samsung lag. Strong AI chip demand, especially from Nvidia, tightens capacity rather than technology issues. Taipei Times

Sponsor High Temperature Resistant, Die Attach Epoxy Master Bond EP17HTS-DA is an electrically conductive die attach epoxy that meets NASA low outgassing specifications and offers high temperature resistance. Master Bond

Alphabet’s 160% rally in a year reflects value of owning ‘most of the stack’ in AI Alphabet briefly surpassed Nvidia in market value as AI optimism and strong cloud growth lifted shares. Investors praised its full-stack AI position, but analysts questioned a large Anthropic-backed cloud deal that may inflate backlog and future revenue expectations. CNBC

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

Intel to expand investment in Việt Nam Intel will expand investment in Việt Nam, boost workforce training, and support semiconductor ecosystem development after talks with officials in Hà Nội. The company also shifts production lines and transfers advanced packaging technology, reinforcing Vietnam’s role in global supply chains. Vietnam Plus

Intel shares soar on Apple chip deal report. Here’s why it signals a total pivot for chipmaking Apple moves toward a deal with Intel to manufacture some iPhone chips, signaling a major shift away from sole reliance on TSMC as AI-driven demand strains capacity and boosts Intel’s foundry revival and global competition. CNBC

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology, Inc.

Geopolitics Is Rewriting Memory Sourcing Geopolitical fragmentation reshapes DRAM and NAND sourcing, replacing global optimization with regionalized supply chains. Export controls and compliance split advanced memory into a two-speed market, driving allocation, delays, and redesigns, while OEMs prioritize supply continuity over lowest-cost procurement. EE Times

TSMC, Sony Form Image Sensor Joint Venture Sony Semiconductor and TSMC sign a non-binding MOU to form a joint venture for next-generation CMOS image sensors, combining Sony’s design expertise with TSMC’s manufacturing strength, and plan production at Sony’s Kumamoto fab targeting smartphones, automotive, and physical AI applications. Semieco System

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

Vanguard evaluating plan for second Singapore fab Vanguard evaluates expanding its 12-inch Singapore fab as demand surges, with first-phase capacity fully booked. The NXP JV facility may reach full utilization in 2028. It also considers second-phase expansion for mature-node chips and AI packaging interposers. Taipei Times

TSMC inks Sony Semiconductor Solutions deal TSMC signs an MOU with Sony Semiconductor Solutions to form a joint venture developing next-generation image sensors for AI applications in automotive and robotics. Sony holds majority control, with production planned at a new Japan fab. Taipei Times

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

The Need for Speed: How Domestic Manufacturing Accelerates Delivery of Mission-Critical Technology US defense capability depends on accelerating microelectronics development as outdated acquisition cycles and supply chain dependencies slow progress. Digital engineering, hardware digital twins, and domestic semiconductor manufacturing aim to compress timelines, strengthen resilience, and deliver mission-ready technology faster. 3DInCites

How BSC Contributes to Europe’s Hybrid Quantum Strategy Spain accelerates quantum computing under its 2025–2030 strategy, allocating €808 million for sovereign infrastructure. The Barcelona Supercomputing Center integrates digital and analog quantum systems with MareNostrum 5 exascale HPC for hybrid workflows and quantum advantage efforts development goals. EE Times

Sponsor Spring pin socket for DFN2 Designed for up to 500,000 actuation cycles, the socket is able to handle -1db@60GHz performance over a temperature range of -40C to +150C. Ironwood Electronics

Chip Industry Week In Review ASE and WUS build a $1.1B advanced packaging hub in Taiwan by 2029 while SpaceX plans a $55–119B Texas “Terafab.” China targets 70% domestic chips Apple explores U.S. chip production while Applied Materials Lattice Siemens Nvidia and IREN expand deals Semiconductor Engineering

Sponsor Seam Seal Hermetic Packages with Auer Carriers and 3D Trays MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing. MicroCircuit Laboratories, LLC