semiconductor
packaging news
Sponsor
EV-Group

Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
Industry Press
IBM and Lam Research Announce Collaboration to Advance Sub-1nm Logic Scaling
IBM
Research and Innovation Factory for AI & Microelectronics
Fraunhofer IPMS
SCHMID Delivers First Specialized InfinityLine H+ for Panel Level Packaging
SCHMID Group
STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack
STMicroelectronics
MEMS & Sensors Executive Congress 2026 to Explore MEMS and Sensors at the Edge of Perception
SEMI
86GHz Elastomer Socket for QFN3 Device
Ironwood Electronics
Panasonic Connect Unveils Latest in Smart Manufacturing at APEX EXPO 2026
Panasonic Connect North America
STMicroelectronics enters high-volume production of its silicon photonics platform
STMicroelectronics
MORE INDUSTRY PRESS
Sponsor
SEIKA-America

McDry Ultra-Low Humidity Storage Cabinets
McDry dry cabinet for MSL components and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages.
Seika
Plasma-Etch
What Year Was It?
Paul McCartney Knighted
What Year
Paul McCartney, a former member of the most successful rock band in history, the Beatles, was knighted by Queen Elizabeth II for his "services to music."
See the answer below.
Uyemura
Sponsor
SEMI

SEMICON China 2026: Shanghai March 25-27
Sessions and forums on advanced packaging, materials, power, design, supply chain, smart manufacturing, sustainability, and more.
SEMI
ECTC
Sponsor
Master-Bond

Thermally Conductive, Low Outgassing Epoxy
Master Bond EP4UF-80 is a thermally conductive, electrically insulating adhesive that offers high mechanical strength and is used for underfill applications.
Master Bond
What Year Was It Answer
Paul McCartney Knighted
Answer: March 11, 1997
March 11, 2026
image
Intel Demos Chip to Compute With Encrypted Data
Intel unveiled its Heracles accelerator for fully homomorphic encryption at the IEEE International Solid-State Circuits Conference, claiming up to 5,000-fold speed gains over CPUs and signaling a major step toward practical encrypted computing for cloud and AI workloads.
IEEE Spectrum
Sponsor
Nordson-ASYMTEK

Plasma Treatment during FOWLP Optimizes Performance and Costs
Fan-out Wafer-Level (FOWLP) & Fan-out Panel-Level (FOPLP) benefit from plasma treatment, which ensures surfaces are contamination-free. Read more
Nordson Electronics Solutions
VIEWPOINT 2026: David Heller, CEO, Heller Industries
image
At Heller Industries, innovation drives our position as the leading thermal solution provider for SMT and semiconductor manufacturing. In 2026, we are excited to launch many new features including a revolutionary flux management system delivering unprecedented efficiency with low maintenance, batch reflow ...
Heller Industries
Peer viewpoint: semiconductor innovation for telecommunication networks
Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure.
Technical Paper
Sponsor
MRSI

Elevate Efficiency: MRSI-H1 Die Bonder
Transform your assembly with precision and speed. Discover unparalleled quality and efficiency.
MRSI
TSMC reports sales hit record high last month
Taiwan Semiconductor Manufacturing Co. reported record February sales of NT$317.66 billion, driven by strong demand for advanced 3nm AI chips. The chipmaker expects about 30% revenue growth in 2026, with key customer Nvidia fueling expanding wafer demand and capacity plans.
Taipei Times
Memory price hikes 'the new normal' as AI boom fuels storage demand, Seagate says
Seagate Technology warned memory price hikes may become the "new normal" as AI-driven demand triggers an industry supercycle. Rising DRAM costs and booming data-centre needs are pushing storage demand and accelerating new high-capacity drive deployments.
South China Morning Post
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
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CyberOptics

Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
Apple makes about 25% of iPhones in India after China pivot
Apple Inc increased iPhone production in India by about 53 percent last year to 55 million units, raising the country's share to roughly a quarter of global output as the company shifts manufacturing away from China to mitigate tariffs and diversify its supply chain.
Taipei Times
Innolux selling factory in Tainan to ChipMOS
Innolux Corp said it would sell a panel module assembly facility to ChipMOS Technologies Inc for NT$880 million, aiming to raise capital and restructure operations, while ChipMOS expands chip testing and packaging capacity to meet booming AI-driven memory and logic chip demand.
Taipei Times
Sponsor
Ontos-Equipment-Systems

Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
How the Iran war and rising energy prices are threatening semiconductor demand
Analysts warn a prolonged U.S.–Israel–Iran conflict could disrupt semiconductor supply chains by threatening Middle East sources of key materials like helium and bromine. Shipping risks and rising energy costs may also curb AI chip demand and pressure semiconductor stocks.
CNBC
Samsung Electronics spends 37.7 tln won in R&D in 2025
Samsung Electronics spent a record 37.7 trillion won (US$25.6 billion) on R&D in 2025, up 7.8 percent year on year, to secure an early lead in AI chips. The company also boosted facility investment while advancing next-generation HBM4 memory development and production.
Yonhap News Agency
Sponsor
Amkor-Technology

Amkor's System in Package (SiP) Solutions
Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more.
Amkor Technology, Inc.
SK Innovation to invest US$380 mln in SK hynix's U.S. AI affiliate
SK Innovation will invest $380 million in a U.S. affiliate of SK hynix to pursue opportunities in AI energy infrastructure. The move aims to strengthen participation in the AI data center ecosystem and expand business prospects in global AI markets.
Yonhap News Agency
Singulated Die Test Ensures Stacked Die Quality As Power Density Rises
Rising power density and shrinking geometries are pushing chipmakers toward singulated die testing with active thermal control. The method exposes post-singulation defects, stabilizes heat, and boosts chiplet yields.
Semiconductor Engineering
Sponsor
Pac-Tech

Turnkey Electroless Plating Solutions
PacTech delivers precision electroless plating with PACLINE® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success.
PacTech
China's chip exports surge 73% as AI demand fuels semiconductor growth
China's chip exports surged 72.6% year on year to $43.3 billion in the first two months, customs data shows, as Beijin's push for semiconductor self-sufficiency and booming AI demand drive production, global shipments, and rising prices amid a tightening memory supply.
South China Morning Post
Sponsor
Henkel-AG-Co

Is copper sintering the future of WBG semiconductors?
Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology.
Henkel AG & Co.
Today's Sponsor
Ormet-TLPS
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Test Your Knowledge
What percentage of pure gold is in 18-carat gold?
See answer below.
Brewer-Science
Quote of the Day
"It is the mark of an educated mind to be able to entertain a thought without accepting it."
Aristotle
Sponsor
Tresky

DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
Industry Calendar
Mar 16, 2026
EOS, ESD and How to Differentiate | Munich, Germany
Semitracks
Mar 19, 2026
Semiconductor Reliability and Product Qualification | Munich, Germany
Semitracks
Mar 25, 2026
SEMICON China 2026
SEMI
Mar 31, 2026
MEMS & Sensors Executive Congress—MSEC
SEMI
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
FULL INDUSTRY CALENDAR
Circuit-Technology-Center
Cartoon of the Day
Cartoon
"I need help! I was thinking outside of the box and I let my mind wander too far and now I can't find my way back!"
Copyright © Randy Glasbergen
Sponsor
MicroCircuit-Laboratories-LLC

Hermetic Package Automation with HDHS® Technology
Enables Seam Sealing with industry standard tooling including Auer carriers and custom carriers including non-standard square trays. Rapid switchover from one carrier tooling to the next is a PC program change.
MicroCircuit Laboratories, LLC
Surfx-Technologies
Test Your Knowledge Answer
What percentage of pure gold is in 18-carat gold?
Answer: 75%