semiconductor
packaging news
Sponsor
Muhlbauer

Die Sorting with AI-supported AOI and Infrared Inspection
See Muehlbauer's DS Merlin 60K running live at Semicon SEA, Booth #1811. The world's benchmark in die sorting: ultra-high-speed technology with AI-driven vision inspection down to 1 µm resolution.
Muehlbauer
Industry Press
SEMI's ASMC Event Spotlights Practical Strategies for Overcoming Today's Biggest Challenges
SEMI
Siemens collaborates with TSMC to advance AI for semiconductor design
Siemens
Henkel Taps Industry Experts for Webinar to Address Design Developments and Material Needs for Next-Gen AI
Henkel AG & Co.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
Koh Young Technology
Antaira Technologies Achieves SEMI E187 Certification for Semiconductor Cybersecurity
Antaira Technologies
Advantest Announces Strategic Partnership with Applied Materials and Joins EPIC Platform
Advantest
CEZAMAT Boosts Advanced Photonics R&D with UV Nanoimprint System from EV Group
EV Group
SEMICON Southeast Asia 2026 to Convene Leaders in Malaysia
SEMI
MORE INDUSTRY PRESS
Sponsor
Tresky

Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
Circuit-Technology-Center
What Year Was It?
Easter Rebellion Begins
What Year
The Irish Republican Brotherhood, a secret organization of Irish nationalists led by Patrick Pearse, launches the so-called Easter Rebellion, an armed uprising against British rule.
See the answer below.
Advanced-Component-Labs
Sponsor
Indium-Corporation

Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
Master-Bond
Sponsor
MicroCircuit-Laboratories-LLC

FSO Seam Seal Hermetic Packages with AI.
Particle free, purified environment inside the hermetic package with low temperature exposures to all feedthroughs and devices. Precision processing with assembly design assistance and prototyping all provided by MicroCircuit Laboratories.
MicroCircuit Laboratories, LLC
What Year Was It Answer
Easter Rebellion Begins
Answer: April 24, 1916
April 27, 2026
SK hynix Receives 2026 IEEE Corporate Innovation Award
SK hynix won the 2026 IEEE Corporate Innovation Award in New York, marking its first win. It earned recognition for advancing AI computing through High Bandwidth Memory innovation and stable mass production, strengthening its role in global AI memory solutions.
EE Times
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
Where we stand after 60 years of Moore's law
In 1965, Gordon Moore predicted transistor-driven exponential growth in computing power and falling costs, later known as Moore's Law. While chip scaling has slowed since the 2000s, its legacy continues shaping semiconductors and inspiring AI cost reductions today.
MSN
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
Sponsor
CyberOptics

Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
Intel's stock has best day since 1987, soaring 24% as chipmaker shows signs of a turnaround
Intel shares surged 24%, their best day since 1987, as AI-driven demand and strong earnings boosted investor confidence. Under CEO Lip-Bu Tan, revenue rose 7.2% and data center growth hit 22%, signaling a renewed competitive position.
CNBC
Intelligent Cost Optimization is a Competitive Advantage
Companies transform cost optimization into a competitive edge by investing with precision, not cutting blindly. Manufacturers use teardown analysis to dissect products, reveal cost drivers, benchmark rivals, and guide engineers to reduce over-specification and boost efficiency.
EE Times
Sponsor
Ontos-Equipment-Systems

Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
What Hormuz Exposed About Our Semiconductor Supply Chain
Closure of the Strait of Hormuz triggers a semiconductor supply chain crisis, doubling helium prices and disrupting logistics. Chipmakers face delays, rising costs, and AI-driven capacity shifts, exposing deep reliance on concentrated gas supplies and fragile global production chokepoints.
EE Times
Chip Industry Week In Review
Marvell acquired Polariton Technologies, while Onto Innovation partnered with Rigaku and bought a 27% stake. Tesla will use Intel 14A for its Terafab AI chips. Arteris and GF's MIPS collaborate, and TSMC outlined A14 in 2028 and A13 in 2029.
Semiconductor Engineering
Sponsor
Henkel-AG-Co

Is copper sintering the future of WBG semiconductors?
Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology.
Henkel AG & Co.
Why Chip Sovereignty Is No Longer About Chips—But Systems
Governments push chip sovereignty, but AI is shifting value from standalone fabs to integrated systems spanning accelerators, CPUs, packaging, memory, and software. Industry now prioritizes heterogeneous architectures and global supply chains over chip-level control.
EE Times
Intel's stock soars 20% as results top estimates, with chipmaker showing signs of growth
Intel crushed expectations with strong Q1 earnings and revenue, sending shares up 20%. Data center growth and rising CPU demand signal an AI-driven turnaround, though losses widened and challenges in manufacturing and customer adoption remain.
CNBC
Sponsor
ECTC

2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
TSMC plans chip packaging plant in Arizona by 2029
TSMC will build and operate an advanced chip packaging facility in Arizona by 2029, adding CoWoS and 3D-IC capabilities. The move aims to ease supply-chain bottlenecks, reduce shipments to Taiwan, and expand US manufacturing alongside partners like Amkor.
Taiwan News
System-in-Package Challenges
Chipmakers and systems firms overcome reticle limits with chiplet designs, distributing workloads across diverse nodes and teams. Experts warn success hinges on managing data flow, physical interactions, power-performance tradeoffs, and long-term package reliability.
Semiconductor Engineering
Sponsor
XYZTEC

How to Tweezer Pull
Learn how to perform an optimal Pull/Peel test using Tweezers. This guide covers test method settings and failures modes for Tweezer Pull/Peel testing. Download it now.
xyztec
TSMC's Next-generation Chip Coming in 2029
TSMC plans to launch its A13 chip into volume production in 2029, alongside A12, while expanding advanced packaging and photonics technologies to boost AI and HPC performance, improve power efficiency, and scale computing density for next-generation systems.
Taipei Times
Sponsor
Surfx-Technologies

High-volume Manufacturing
The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations.
Surfx Technologies
Today's Sponsor
Pac-Tech
Sponsor
Pac-Tech

Achieve Precision in WLCSP Bumping
Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts.
PacTech
Test Your Knowledge
Which one of these elements does not appear before Oxygen in The Periodic Table: Nitrogen, Carbon, Beryllium, or Silicon
See answer below.
Akrometrix
Quote of the Day
"You never really hear the truth from your subordinates until after 10 in the evening."
Jurgen Schrempp
Sponsor
Intraratio-Corporation

See How Proven Leaders Make Operational Success Happen
4-part series addressing head-on the challenges faced by manufacturing operations in today's highly complex and hyper-competitive environment. No registration required.
Intraratio
Industry Calendar
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
May 12, 2026
iMAPS New England 52nd Symposium
iMAPS
FULL INDUSTRY CALENDAR
Balazs-Nanoanalysis
Cartoon of the Day
Cartoon
"When life give you lemons, make lemonade. When life gives you red ink, make ketchup!"
Copyright © Randy Glasbergen
Sponsor
SEMI

SEMIEXPO Heartland — April 29–30, 2026, Detroit, Michigan
Explore Smart Manufacturing & Mobility in the Midwest, a growing semiconductor hub with $44B+ in investments. Connect, innovate, & lead the future! Click here to register.
SEMI
AI-Technology-Inc
Test Your Knowledge Answer
Which one of these elements does not appear before Oxygen in The Periodic Table: Nitrogen, Carbon, Beryllium, or Silicon
Answer: Silicon (Si). Nitrogen (N), Carbon (C), Beryllium (Be)