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DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
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What Year Was It?
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First Roller Coaster in America Opens
The first roller coaster in America opens at Coney Island, in Brooklyn, New York. It traveled approximately six miles per hour and cost a nickel to ride.
See the answer below.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Temporary Bonding Materials
Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications.
Brewer Science
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What Year Was It Answer
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First Roller Coaster in America Opens Answer: June 16, 1884
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June 16, 2025
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Taiwan Backlists Huawei and SMIC
Taiwan has blacklisted Huawei and SMIC, tightening restrictions on AI chip tech exports. The move blocks access to key semiconductor tools, striking a blow to China's ambitions and escalating cross-strait tech and political tensions.
Taipei Times
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How to Tweezer Pull
Learn how to perform an optimal Pull/Peel test using Tweezers. This guide covers test method settings and failures modes for Tweezer Pull/Peel testing. Download it now.
xyztec
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Chip Industry Week in Review
China unveiled an AI chip design system to speed up semiconductor development, while Micron boosted U.S. investment plans to $200B. AMD launched powerful MI350 GPUs, and Harvard warned the U.S. tech lead is narrowing globally.
Semiconductor Engineering
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The Economics of Electronic Component Salvage and Reuse
This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips.
Technical Paper
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Samsung, TSMC set stage for fierce race in 2nm chip tech
TSMC and Samsung plan to begin mass production of 2nm chips in late 2025, intensifying the semiconductor race. Meanwhile, Intel bets on its 1.8nm process to revive its foundry business and challenge both rivals.
The Korea Herald
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Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
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ASMedia bullish on AMD desktop chip demand
ASMedia expects stronger Q3 revenue, driven by rising USB 4.0 demand and AMD's desktop chip gains over Intel. Its Techpoint acquisition and chipset business will jointly fuel growth, with a record-high NT$30 dividend approved.
Taipei Times
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Almost all India iPhones sent to US
Apple ramped up iPhone exports from India to the U.S., with Foxconn shipping 97% of its $3.2B output there since March—up from 50% last year—as Apple accelerates efforts to bypass rising China tariffs.
Taipei Times
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IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
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EnCharge Picks The PC For Its First Analog AI Chip
EnCharge AI unveiled its EN100 analog AI accelerator, delivering 200 TOPS performance with over 40 TOPS/W efficiency. Using capacitor-based compute-in-memory, it enables large AI models to run locally on laptops and PCs under tight power constraints.
EE Times
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Analytical Solutions
Balazs provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions.
Balazs Nanoanalysis
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RISC-V's Increasing Influence
RISC-V's open architecture is gaining momentum across industries, offering flexibility for evolving workloads and gradual migration from legacy systems. While skeptics remain, its customizability and growing ecosystem are pushing it into mainstream applications.
Semiconductor Engineering
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The Next Step in Surface Prep!
All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated
surfaces without a vacuum chamber.
Ontos Equipment Systems
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Today's Sponsor |
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Sponsor |
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Tech Paper - Keys to Component Lead Tinning Success
This paper explores the challenges and best practices of component tinning, emphasizing temperature control, flux selection, and soldering techniques. Download this free tech paper.
Circuit Technology Center
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Test Your Knowledge
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What is an Integrated Circuit?
See answer below.
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Quote of the Day
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"I am proud of the fact that I never invented weapons to kill." Thomas Edison
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Particle-Free Plasma Oxide Reduction
Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder.
Surfx Technologies
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Cartoon of the Day
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"I'll keep your resume on file, but I don't have much need for an information systems analyst at this time."
Copyright © Randy Glasbergen
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology
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Test Your Knowledge Answer
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What is an Integrated Circuit? Answer: An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon. The integration of large numbers of tiny transistors into a small chip results in circuits that are orders of magnitude smaller, less expensive, and faster than those constructed of discrete electronic components.
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