July 29, 2026

Lens, BOE Advance Glass Substrates as Taiwan's Supply Chain Prepares for TSMC's CoPoS China and Taiwan are accelerating glass substrate advanced packaging as Intel, Lens Technology, BOE, TSMC and others ramp investments. Taiwan aims to leverage its semiconductor ecosystem to lead FOPLP and glass core substrate production for next-gen AI chips. TrendForce

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.

Semiconductor Chip Rout Deepens: Navigating the 2026 Market Correction China's rapid chipmaking gains and growing doubts over AI spending triggered a broad semiconductor selloff, prompting investors to reassess growth expectations. Valuation concerns, geopolitical tensions and prolonged uncertainty continue to weigh on global chip markets. Intellectia

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor Analytical Solutions Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions. Balazs Nanoanalysis

Tackling the Memory Wall at the IMAPS Memory Summit Industry leaders at the IMAPS Memory Summit identified the Memory Wall as AI's biggest scaling challenge, urging advances in memory bandwidth, latency, packaging, high-performance flash, security and standards to power next-generation AI infrastructure and chips. 3DInCites

China Reportedly Mass-Produces Immersion DUV Tools; SMIC, Hua Hong, CXMT Deliveries Expected This Year China reportedly began mass-producing immersion DUV lithography systems, with deliveries to SMIC, CXMT and Hua Hong expected later this year. The move advances chipmaking self-sufficiency, but reliance on Japanese parts and ASML's ecosystem keeps China behind. TrendForce

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

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SK Hynix shares tank as exponential earnings growth fails to satisfy AI-charged expectations SK Hynix posted record Q2 revenue and profit on booming AI memory demand, but its shares fell 9.6% as investors expected even stronger results. The chipmaker plans higher investment, expanded HBM4 production, and advanced NAND manufacturing to sustain AI-driven growth. CNBC

Microchip Acquires Edge AI Chip Startup Hailo Microchip has agreed to acquire Israeli edge AI chip startup Hailo, marking CEO Steve Sanghi's first acquisition since returning. The deal strengthens Microchip's embedded AI portfolio with Hailo's proven hardware, software, and industrial customer base as edge AI demand accelerates. EE Times

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Nvidia employee detained over chip smuggling probe Taiwanese prosecutors detained an Nvidia employee over an alleged scheme to smuggle AI servers containing restricted Nvidia chips to China. The investigation focuses on forged documents and suspected violations of US export controls involving about 50 servers. Taipei Times

China's home-grown DUV progress not the biggest threat to ASML, analysts say Analysts say China's reported DUV lithography breakthrough poses less risk to ASML than possible US service restrictions. They warn tighter export controls could speed China’s chip self-sufficiency by driving adoption and improvement of domestic lithography systems. South China Morning Post

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China's reported chip breakthrough comes with some big caveats Analysts say China's reported DUV lithography breakthrough poses a smaller threat to ASML than possible US service restrictions. They argue tighter export controls could speed China's chip self-sufficiency by driving adoption and improvement of domestic lithography systems. CNBC

Will Purging Chinese Tech Cost Europe Its Digital Future? The EU plans to remove high-risk telecom vendors from critical networks to boost cybersecurity, but industry warns the move could cost €30-40 billion, reduce competition, delay 6G rollout, slow network upgrades and weaken service quality for consumers. EE Times

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

Research Bits: July 28 Researchers at Harvard University and the Max Planck Institute developed silicon nitride photonic components 500 times smaller than conventional designs using inverse design. The breakthrough boosts light routing and enables more compact, efficient on-chip photonic devices. Semiconductor Engineering

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology