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Proven Flip-Chip Flux for AI Packages
WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications.
Indium Corporation
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What Year Was It?
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The day was Aug 19. What year was it?
First Race at Indianapolis Motor Speedway
The first race is held at the Indianapolis Motor Speedway, now the home of the world's most famous motor racing competition, the Indianapolis 500.
See the answer below.
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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What Year Was It Answer
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First Race at Indianapolis Motor Speedway
Answer: August 19, 1909
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August 20, 2026
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Andes Condor Closure Came Amid Broader Cost-Cutting Effort
Andes Technology is restructuring after aggressive expansion, closing its Condor Computing subsidiary and absorbing its RISC-V IP. The company aims to cut costs while focusing on AI, automotive and embedded markets, despite strong 2026 revenue growth.
EE Times
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1 of 10 Applications: Hybrid Bonding
Maximum flexibility is the hallmark of Swiss made die bonders from Tresky. To apply adhesive before bonding, dispensing and stamping systems are available, as are flux systems.
Dr. Tresky AG
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Advanced Packaging. Smarter Test.
Leading OSAT for HPC, AI and automotive, delivering extensive test capabilities and deep expertise in advanced device testing.
Amkor Technology
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
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When Interoperability Becomes Infrastructure
Matter is moving beyond interoperability toward practical smart-home implementation, giving manufacturers greater scope to differentiate products. The next challenge is preserving device visibility, using operational data to guide engineering decisions, improve usability, and continuously optimize connected products throughout their lifecycles.
EE Times
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The Future Of AI Compute Won’t Run On Just One Kind Of Chip
Semiconductor Engineering’s three-part discussion explores how AI data center architectures are evolving, featuring experts from Arm, Axiomise, Cadence, Expedera, Siemens EDA, and Synopsys. The final installment examines emerging infrastructure, silicon, verification, and HPC challenges.
Semiconductor Engineering
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Korea Chip Employment to Grow Over 5% for First Time on Boom
South Korea’s semiconductor employment is projected to rise 5.1% in the second half, adding about 8,000 jobs as AI-driven demand boosts servers, data centers and memory prices. Mega-cluster investments could further accelerate hiring across the broader chip ecosystem.
Seoul Economic Daily
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Marvell Targets AI Bottlenecks with Memory-Disaggregation Portfolio
Marvell Technology has launched memory infrastructure products spanning SSDs, CXL expansion and optical fabrics, helping hyperscalers disaggregate memory, reduce bottlenecks and improve AI inference efficiency by dynamically pooling, scaling and moving memory closer to computation.
EE Times
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Maximize Photonic Coupling Efficiency
Tresky's Active Alignment combines real-time optical feedback, multi-axis positioning and nanometer precision for photonics and advanced packaging.
Tresky
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Chiplets Offer a Scalable Compute Strategy for Software-defined Vehicles
Automakers are shifting toward centralized and zonal computing as AI and software-defined vehicles drive rising performance demands. Chiplet architectures offer scalable, cost-conscious solutions by combining multiple dies while preserving software compatibility, reliability, and long-term vehicle platform stability.
EE Times Asia
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The Physics That Killed the Monolithic Chip
Major chipmakers are shifting from monolithic processors as poor yields and stalled SRAM scaling raise costs. Chiplets boost manufacturing efficiency, while 3D stacking and hybrid bonding pack logic and memory closer for faster, greener computing.
Medium
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Electrically Insulating, Toughened Epoxy
Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened epoxy system that transfers heat effectively and can be used for bonding, sealing, coating, potting and glob topping.
Master Bond
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Does Water Do the Job on Its Own?
Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more.
KYZEN
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| Today's Sponsor |
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Proven Die-Attach Pastes and Films
Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity.
AI Technology, Inc.
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Test Your Knowledge
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Where did the soft Drink Dr. Pepper get its name?
See answer below.
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Quote of the Day
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"Every time we launch a feature, people yell at us."
Angelo Sotira, deviantART co-founder
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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Cartoon of the Day
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"If the brightest minds on Wall Street can't figure out the economy, then what do you expect from me?"
Copyright © Randy Glasbergen
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Test Your Knowledge Answer
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Where did the soft Drink Dr. Pepper get its name? Answer:
Chemist Charles Alderton named his drink after the father of a girl he was dating, Dr. Charles Kenneth Pepper.
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