February 12, 2026

Resistance In Advanced Packages Is Now A System-Level Problem Engineers evolve Kelvin measurement for modern chips, tracking tiny, time-dependent resistance shifts across stressed interfaces. Continuous, non-contact monitoring now spots early failure signs, protecting yield and reliability amid advanced packaging challenges. Semiconductor Engineering

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VIEWPOINT 2026: Joe Montano, President and CEO, Delphon As Delphon enters 2026, the company is at a true inflection point — driven by execution, not ambition alone. Over the past several years, we've deliberately expanded beyond our historical niches to position Delphon deeper in the semiconductor value chain. That strategy is now translating into tangible ... Delphon

The Economics of Electronic Component Salvage and Reuse This paper explores the feasibility and benefits of salvaging and reconditioning the leads and pads of electronic components, focusing on high-value components such as microprocessors, microcontrollers, and artificial intelligence chips. Technical Paper

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ASE focuses on Malaysia expansion, ADI plant acquisition expected to close in 2Q26 ASE Technology Holding will keep Penang as the core of its overseas manufacturing hub despite U.S.-led reshoring efforts. The company is expanding in Malaysia, the Philippines & South Korea, securing long-term deals with Infineon & ADI to strengthen global packaging & testing capacity. Digitimes

Carbon nanotube 'sandpaper' polishes semiconductor surfaces down to a few atoms KAIST researchers created "nano sandpaper" made of vertically aligned carbon nanotubes to polish semiconductor surfaces with atomic precision. The method cuts dishing defects by 67%, eliminates slurry waste, and delivers cleaner planarization for advanced AI chips. Phys.org

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

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RISC-V Pivots from Academia to Industrial Heavyweight RISC-V speeds its global rise, with China driving half of shipments as Europe and India push tech sovereignty. Modular AI extensions, ISO standardization, and expanding cloud and automotive use propel the open ISA into mainstream industrial and data center markets. EE Times

SMIC says rushed AI chip capacity could end up idle SMIC warned that surging AI chip investment is pulling forward years of data center demand, risking idle capacity. Zhao Haijun flagged overheating spending and persistent HBM shortages, as the company posted strong quarterly profit growth and maintained heavy capital expenditure. Taipei Times

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Rising chip prices to curb phone sales Rising memory chip prices could slash global smartphone shipments by up to 15% this year, TrendForce said, with Chinese brands hit hardest. Vendors face soaring component costs, forcing price hikes, while Huawei, Samsung and Apple are expected to weather the downturn better. Taipei Times

Lam Research, CEA-Leti Open Fast Lane for Specialty Technologies Lam Research and CEA-Leti signed a multi-year pact to speed semiconductor innovation, moving new materials and plasma processes from lab validation to fab readiness. The alliance targets AI, photonics, power & specialty chips while cutting risk & boosting sustainability & performance. EE Times

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

Ams Osram Sells Sensor Business to Infineon to Focus on Digital Photonics Infineon will acquire ams Osram's non-optical analog and mixed-signal sensor portfolio for €570 million, expanding its automotive, industrial and medical sensing reach. The deal fuels Infineon's growth strategy and helps ams Osram cut debt and refocus on digital photonics. EE Times

SK, Nvidia chiefs discuss AI ties in Silicon Valley: sources SK Group Chairman Chey Tae-won met Nvidia CEO Jensen Huang in Silicon Valley to discuss AI cooperation spanning chips and biotech. They reportedly reviewed HBM4 supply for Nvidia's Vera Rubin accelerator and explored expanding South Korea's AI ecosystem. Yonhap News Agency

Sponsor Quick Turn I/C Package Substrates USA Fabrication – THIN "Stay Flat" CORES Organic Substrates/High Density Interposers - 20µm Dielectrics /12µm Traces 50um Cores - ITAR Approved. Learn more. Advanced Component Labs, Inc.

Samsung CTO expresses confidence over HBM4 leadership Samsung Electronics CTO Song Jai-hyuk reaffirmed the company's leadership in sixth-gen HBM4 at Semicon Korea 2026, highlighting strong client feedback & AI-driven synergies across memory, foundry &d packaging, as Samsung prepares its first HBM4 shipments, reportedly to Nvidia. Yonhap News Agency

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