Sep 15, 2026 Advanced Packaging Changes The Rules For Semiconductor Health And Performance SiPs advance Agentic and Physical AI by integrating processors, accelerators, memory and connectivity in heterogeneous packages. Advanced packaging boosts performance and power efficiency but complicates electrical, thermal and mechanical design. Semiconductor Engineering

Sponsor Nordson Sight™ Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields. Nordson Test & inspection

Omdia: Global Semiconductor Revenue Surges 31% to Record $425bn in 2Q26 Global semiconductor revenue hit a record $425 billion in 2Q26, driven by AI demand and soaring memory prices. Memory chips generated over half of revenue, while non-memory semiconductors also grew strongly, positioning the market to exceed $500 billion in 3Q26. Business Wire

A Universal AI-Powered Segmentation Model for PCBA & Semiconductor A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection processes. Technical Paper

Sponsor UV DIE Bonding Special Technology Liquid adhesive is cured using ultraviolet (UV) light. In contrast to epoxy, the UV adhesive remains in the liquid state until it is exposed to high-energy UV radiation with UV DIE Bonding technology. Tresky Automation

TSMC Reportedly Targets 22% 2nm, 16%+ 3nm Capacity Boost by Mid-2027; CoWoS to Double by 2028 TSMC plans to raise 2nm capacity 22% and 3nm more than 16% by mid-2027, while doubling CoWoS capacity by 2028. The expansion targets surging AI demand, with Intel's EMIB packaging gaining momentum as an alternative and MediaTek citing better yields. TrendForce

Samsung backs Nvidia AI chip rival in $230 million funding round as GPU alternatives boom Samsung has backed Dutch AI chipmaker Euclyd in a $231 million funding round as investors seek Nvidia alternatives. Euclyd is developing non-GPU inference technology designed to reduce AI data center costs and energy use, targeting commercial rollout from 2028. CNBC

Sponsor ECTC Call for Papers Due October 5 ECTC invites abstracts for its 77th conference. The leading packaging event will showcase 2.5D/3D integration, chiplets, hybrid bonding, panel-level packaging, photonics, glass substrates and advanced materials. ECTC

Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor actnano Materials with Nordson Equipment actnano's PFAS-free, cure-free coatings save energy and boost safety. And they are compatible with Nordson conformal coating systems. Upgrade your system today. Learn more! Nordson Electronic Solutions

Gobal market AI momentum showing signs of vulnerability, BIS says The BIS warned that the AI-driven stock market rally faces growing risks as investors question future profitability, tech-company leverage rises, and debt expands. Geopolitical tensions, fiscal pressures and higher bond yields could further threaten market resilience. Taipei Times

Flash memory prices expected to climb further soon TrendForce expects high-capacity NOR flash prices to rise 90–110% in the second half of 2026 as AI servers, edge-AI devices and aerospace applications boost demand. Limited capacity expansion will sustain shortages, while lower-capacity chips face milder increases. Taipei Times

Sponsor Number 1 in bond testers Sigma is the best bond tester the market has to offer. It comes with game-changing automation capabilities for operator-free loading, testing, and analyzing. Learn more. xyztec

Making chips takes water. Arizona wants to reuse it Arizona State University researchers are developing wastewater reuse methods for semiconductor manufacturing, backed by $2 million in federal funding. Their goal is to help chipmakers recycle over 80% of water, improving sustainability, resilience and efficiency in water-scarce Arizona. Arizona Daily Star

China rejects calls for 'pacing' on AI development, fearing it would entrench US tech lead Chinese researchers and state media reject US tech leaders' calls to slow AI development, arguing they could preserve America's lead. Despite safety concerns, Chinese firms are accelerating advanced AI efforts, while Washington remains divided over pausing progress. South China Morning Post

Sponsor Plasma as a Key Technology Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma® & PlasmaPlus®. Plasmatreat GmbH

China says AI CEOs' call for a slowdown is 'fear mongering' China rejected calls from U.S. AI leaders to slow development, warning that confrontation could disrupt global AI governance. Beijing instead urged stronger AI safety systems, while Washington emphasized maintaining its strategic lead as Chinese models rapidly narrow the gap. CNBC

OpenAI boss Sam Altman spells out how and why the AI industry wants to slow down: 'We could lose control' OpenAI CEO Sam Altman backed stronger frontier AI safety rules, independent evaluators and measured development, warning against losing control. He joined Anthropic's Dario Amodei in urging safeguards while stressing that AI progress should continue, not stop. CNBC

Sponsor What do 81.3 % of automotive chip specialists agree on? That high-performance packaging materials are essential for reliability. The Research Report from Henkel Adhesive Technologies puts a number on what the industry feels. Henkel AG & Co.

Small Indian Manufacturers Hit Data, Legacy-System Barriers to Scaling AI Indian manufacturers are moving AI beyond pilot projects, but scaling remains difficult due to inconsistent data, legacy equipment, and varied processes. Experts stress plant-level data, contextual knowledge, and collaboration to build scalable, autonomous manufacturing systems. EE Times

Sponsor BGA & QFN Sockets Bandwidths to 94 GHz, industry's smallest footprint, ideal for prototype & test, simulation models available, multi level stacked sockets. Ironwood Electronics

Chinese Quartz Maker Passes 300mm DRAM Certification, But US Spruce Pine Monopoly Stands Firm Jiangsu Pacific Quartz won certification for high-purity quartz in 300mm wafer production at a major Chinese DRAM maker, advancing supply-chain localization. However, China still relies on overseas sources for ultra-high-purity quartz crucibles. Xeno Spectrum