July 16, 2026

Intel May Build Up to 90% of Nova Lake Compute Tiles on 18A, Scaling Back TSMC Intel is reportedly shifting 80–90% of Nova Lake compute tile production to Intel Foundry as 18A yields improve, reducing reliance on TSMC. The move could strengthen Intel's foundry ambitions, with reported customer wins and growing demand for its EMIB packaging. TrendForce

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ASML raises outlook, eyes capacity lift ASML raised its annual sales forecast for the second time this year after strong AI-driven demand boosted orders for its chipmaking equipment. The company plans to expand EUV production capacity, reported better-than-expected quarterly results & increased its full-year margin outlook. Taipei Times

A New Optical Ball Grid Array Package Development for Automotive Optical Sensor This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements. Technical Paper

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China's IC Export Value Nearly Doubles to US$177B in 1H26; Memory Price Boom Seen Behind the Surge China's IC exports jumped 96% year over year to US$177.3 billion in the first half of 2026, fueled mainly by soaring memory prices rather than AI chips. Higher DRAM prices boosted exports of mature-node memory and commodity chips, driving overall export growth. TrendForce

TYLsemi De-Risks Chiplets With New Business Model TYLsemi raised $43 million in seed funding to simplify custom AI chiplet development by managing packaging, testing, supply chains and supporting chiplets. The approach cuts design risk and helps AI firms and hyperscalers avoid single-vendor lock-in. EE Times

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Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

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NSTC proposes record technology budget for 2027 Taiwan's NSTC proposed a record NT$176.8 billion technology budget for next year to accelerate AI and advanced technologies. The plan boosts high-performance computing, quantum computing, silicon photonics and co-packaged optics to strengthen semiconductor leadership. Taipei Times

Sam Altman signals OpenAI price war as rivalry with Anthropic, China heats up OpenAI CEO Sam Altman signalled further price cuts for GPT-5.6 as competition intensifies from Anthropic and lower-cost Chinese AI models. Falling prices, stronger open-weight alternatives and improving model performance are making affordability a key factor in enterprise AI adoption. South China Morning Post

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After Magdeburg, Intel Builds on Ireland’s Existing Strength Intel will invest €5 billion to expand its Leixlip, Ireland, campus, boosting Xeon processor production, R&D and manufacturing capacity. By leveraging established infrastructure, skilled talent and a mature semiconductor ecosystem, Intel aims to accelerate growth. EE Times

India approves $13.3 billion for fresh semiconductor push India approved a 1.28 trillion-rupee expansion of its semiconductor programme to accelerate chip design, fabrication and R&D, while allocating 625 billion rupees to boost mobile phone manufacturing, strengthen domestic sourcing and create about 60,000 direct jobs. Reuters

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Probabilistic Computing Is Already Here; Here Is How It Works Probabilistic computing is emerging as a commercial alternative to classical systems, processing uncertain data faster and with greater energy efficiency. By handling probabilities directly in hardware, it speeds AI, engineering and financial workloads. EE Times

AI In Chip Design: Lots Of Promise, Plenty Of Unanswered Questions Industry leaders explored how AI will reshape chip design, verification and engineering workflows, discussing where AI delivers the greatest value, how autonomous AI agents should be managed & the governance frameworks needed to ensure reliable semiconductor development. Semiconductor Engineering

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ASML shares fall after hiking sales forecast for second time this year on strong AI chip demand ASML raised its annual sales and margin forecast after posting stronger-than-expected quarterly results, driven by booming AI chip demand. The company plans to expand EUV & DUV production capacity as chipmakers accelerate investments despite export restrictions & market uncertainty. CNBC

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