Sep 29, 2026 One Substrate No Longer Rules Them All Advanced packaging is shifting substrate challenges from capacity to capability. Larger packages, more layers, finer routing and specialized materials demand tighter tolerances, narrowing suppliers and making process integration and yield critical. Semiconductor Engineering

Sponsor The Next Step in Surface Prep! All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated surfaces without a vacuum chamber. Ontos Equipment Systems

12-inch Wafer Price Hikes Loom for 2027 as AI Demand Tightens Supply, with LTAs Reportedly Up 15–40%+ AI-driven chip expansion is tightening 12-inch wafer supply, pushing 2027 LTA prices up 15%–25% for epi wafers and over 40% for polished wafers. Strong CoWoS, GPU and AI ASIC demand could sustain pricing pressure into 2028, boosting suppliers. TrendForce

A New Optical Ball Grid Array Package Development for Automotive Optical Sensor This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements. Technical Paper

Sponsor Full automation bond testers A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more. xyztec

Why U.S.-Europe Cooperation Matters for Quantum Leadership U.S. and European quantum leaders must turn research, capital, talent, and startups into coordinated industrial strength. Supply-chain ties, shared infrastructure, standards, and trusted markets can strengthen allied competition with China. EE Times

Rare Earths in Focus Ahead of Trump-Xi Talks as U.S. Dependence on China Could Last Into 2030s Rare earths will dominate Trump-Xi talks as U.S. efforts to expand domestic mining and processing struggle to match demand. Falling Chinese magnet shipments and gaps in heavy rare earths keep supply dependence a key trade and security challenge. TrendForce

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

Technical Papers ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications MORE TECHNICAL PAPERS

Sponsor IC Socket - Carrier A socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal... Ironwood Electronics

Intuition and AI The article questions whether AI can develop intuition and genuine creativity beyond historical data. It explores unconscious pattern recognition, challenges knowledge-based thinking, and argues that AI may eventually match human intuitive innovation while using less energy. Semiconductor Engineering

India's Chip Ambition: Building a Global Semiconductor Hub India is expanding its semiconductor ambitions beyond chip manufacturing, targeting a larger role in global supply chains by 2032. Building this ecosystem will require advanced packaging, suppliers, equipment, infrastructure, design capabilities and specialised talent. The Indian Eye

Sponsor ECTC Call for Papers Due October 5 ECTC invites abstracts for its 77th conference. The leading packaging event will showcase 2.5D/3D integration, chiplets, hybrid bonding, panel-level packaging, photonics, glass substrates and advanced materials. ECTC

TSMC affiliate already eyes expansion as first Singapore plant 'sells out' TSMC affiliate Vanguard International Semiconductor (VIS) inaugurated its first advanced chipmaking plant in Singapore, driven by surging AI infrastructure demand. With capacity already sold out, VIS is considering a second facility to expand production and meet growing demand. Nikkei Asia

India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent India is expanding its technology ecosystem across electronics, semiconductors, cloud infrastructure and talent, attracting deeper investment, increasing scrutiny and strengthening connections with global technology supply chains. Digitimes

Sponsor A study about 3D stacking of passive SMD elements This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven. PacTech

California Will Continue to Be Leader in Semiconductor Manufacturing As Senator Cortese's SB 1306 is Signed into Law California signed SB 1306, aligning rules for semiconductor chemicals containing up to 70% GBL with federal standards. The law cuts compliance burdens and supports semiconductor research, manufacturing, supply-chain resilience and job growth. Dave Cortese

Full-Stack Semiconductor Solutions for Smart, Secure Industry and Digital Energy NSING Technologies delivers full-stack semiconductor solutions for industrial automation, AI data centers & digital energy. Its MCUs, security chips & BMS technologies enable high-performance control, secure connectivity, efficient power management & sustainable energy systems. EE Times

Sponsor The Gallery of Progress From desktop to laptop to data center, every leap in performance begins with a packaging decision most people will never see. Explore the rooms of the exhibition and see our range of innovative applications. Henkel AG & Co.

Nvidia debuts system designed to control AI agents Nvidia introduced its Open Agent Safety Platform, combining OpenShell and Nvidia Sentry to control AI agents and isolate suspicious activity. The company says the tools could have prevented recent breaches involving OpenAI models and other autonomous AI systems. Taipei Times

Sponsor Advanced Packaging: Flexible Die Bonder The MRSI-705 die bonder's versatile work area handles many input and output types. Scan the QR code for an augmented reality experience! MRSI Mycronic

Bill Gates joins calls for AI safeguards, legislation Bill Gates called for US legislation requiring AI safeguards and monitoring, rejecting self-regulation as insufficient. His stance contrasts with President Donald Trump's opposition to stricter rules, as industry leaders debate safety risks and maintaining America's edge over China. Taipei Times