April 22, 2026

Apple’s elevation of silicon head Johny Srouji signals sprint to build in-house chips for all devices Apple named John Ternus CEO and promoted Johny Srouji to chief hardware engineer, strengthening its in-house silicon strategy. The move advances custom chip development for iPhones and Macs, boosting integration, AI capabilities, and reduced reliance on external suppliers. CNBC

Sponsor Corner fill inspection A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly. Nordson Test & Inspection

Trends in Semiconductor Manufacturing: Wafer-Level and Panel-Level Packaging Semiconductor manufacturing shifts toward heterogeneous integration and chiplet designs, relying on advanced process technologies like wet processing, electrochemical plating, PECVD, and panel-level packaging. These enable precision, scalability, and sustainability while meeting AI, 5G, and HPC-driven demand and replacing legacy tools. 3DInCites

Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP) This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance. Technical Paper

Sponsor Turnkey Electroless Plating Solutions PacTech delivers precision electroless plating with PACLINE® and turnkey process transfers, trusted by IDMs worldwide for advanced semiconductor manufacturing success. PacTech

Apple Eyes Product Engineering Revival with CEO Transition Apple replaces Tim Cook with hardware chief John Ternus as CEO on Sept 1, shifting leadership toward product innovation. Cook becomes executive chairman. Ternus must advance Apple silicon success and revive AI efforts including Siri amid rising competition. EE Times

The OSAT Explosion: Why CG Semi and Kaynes are the Real Architects of India’s Chip Independence India’s semiconductor industry shifts in 2026 as firms expand beyond design into manufacturing. In Gujarat’s Sanand region, companies like CG Semi and Kaynes Semicon build OSAT and ATMP facilities, strengthening infrastructure for ‘Made in India’ chips powering global electronics. BIS Infotech

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

The Changing ASICs Landscape: the Shift Toward Chip Disaggregation AI is reshaping ASIC design toward system-specific, modular, disaggregated architectures. Advanced packaging, multi-die integration, and cross-domain collaboration across architecture, manufacturing, and EDA enable optimization, while increasing verification complexity and driving reusable IP, system-level co-design, and ecosystem partnerships. EE Times

Research Bits: Apr. 21 Researchers developed energy-efficient edge AI hardware by mapping state space models onto compute-in-memory memristor crossbars and demonstrating neuromorphic architectures, while parallel advances in ultra-thin memory devices and brain-inspired nickelate systems enabled low-power computing and improved signal processing capabilities. Semiconductor Engineering

Sponsor Amkor's System in Package (SiP) Solutions Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more. Amkor Technology, Inc.

Apple incoming CEO John Ternus faces a defining challenge: Fixing the company’s AI strategy Apple names hardware chief John Ternus CEO as Tim Cook steps down, pushing investors to demand a clearer AI strategy. The company lags rivals in generative AI, relying on partners while betting on integrated devices and future AI hardware. CNBC

Hong Kong can advance AI beyond the confines of geopolitical rivalry Analysts argue global AI is not just US–China rivalry but a multipolar system where middle powers shape outcomes. Hong Kong can position itself as a responsible governance hub, leveraging its legal system, education links, and regional partnerships. South China Morning Post

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

The Global Semiconductor Talent Shortage Semiconductor shortages drive major US and EU investments like the CHIPS Act to expand production and talent pipelines. As the industry heads toward $1 trillion by 2030, companies and governments race to address a growing global skills shortage. Deloitte

Intel Foundry Said to Boost Equipment Orders by 50%+ YoY; 14A May Draw Major Customers by Year-End Intel's foundry push gains momentum as 2026 equipment orders jump over 50%, boosting suppliers like E&R Engineering and KINIK. Rising shipments, 14A progress, EMIB packaging, and AI's shift toward CPU-led systems could attract major customers by year-end. TrendForce

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India's first 3D semiconductor packaging unit signals a deeper shift in the chip supply chain India advances its semiconductor ambitions as Odisha hosts its first advanced 3D chip packaging facility by 3D Glass Solutions. The project shifts focus from assembly to IP-heavy glass-based packaging for AI and computing, strengthening domestic ecosystem and supply chains. CRN Asia

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation