semiconductor
packaging news
Sponsor
Surfx-Technologies

How heterogenous packaging benefits from atmospheric argon plasma
Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications.
Surfx Technologies
Industry Press
Seika Machinery Introduces the Laboratory Roll-to-Roll Coater (LR2RC) by infinityPV
Seika Machinery
405 nm OEM Laser for High-Accuracy Raman Spectroscopy
TOPTICA Photonics SE
PEMTRON Brings Next-Gen X-ray and Wafer Inspection Technologies to SEMICON Southeast Asia 2026
PEMTRON
Indium Presents Collaborative Research on Solder Alloy Reliability for HI at ICEP-HBS
Indium Corporation
Brewer Science Earns 2026 USA TODAY Top Workplaces Award
Brewer Science, Inc.
Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer
Aehr Test Systems
Silicon Carbide Heating Elements Help Optimize Electronics Manufacturing Processes
M-Kube Enterprise LLC
PacTech Launches Scalable Modular Wet-Bench System for Advanced Semiconductor Packaging
Pactech
MORE INDUSTRY PRESS
Sponsor
MicroCircuit-Laboratories-LLC

Seam Seal Hermetic Packages with Auer Carriers and 3D Trays
MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing.
MicroCircuit Laboratories, LLC
Brewer-Science
What Year Was It?
Castro Announces Mariel Boatlift
What Year
The Castro regime announces that all Cubans wishing to emigrate to the U.S. are free to board boats at the port of Mariel west of Havana, launching the Mariel Boatlift.
See the answer below.
Balazs-Nanoanalysis
Sponsor
CyberOptics

Award Winning Acquisition Mode Dynamic Planar CT
Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure.
Nordson Test & Inspection
Master-Bond
Sponsor
Ontos-Equipment-Systems

Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
What Year Was It Answer
Castro Announces Mariel Boatlift
Answer: April 20, 1980
April 20, 2026
image
TSMC Chases Soaring AI Demand
TSMC increases spending to nearly $56 billion to expand chip capacity for surging AI demand from Nvidia, AMD, and Apple, building new 3nm fabs in Japan, Taiwan, and the US, while acknowledging supply may still lag demand through 2027.
EE Times
Sponsor
Indium-Corporation

Proven SiPaste® for Ultrafine-Pitch Printing
Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life.
Indium Corporation
Chip Industry Week In Review
Cadence expands ChipStack AI with a head agent orchestrating semiconductor and system design, plus specialized agents for analog, custom, and digital implementation and signoff. Partnerships with Nvidia and Google accelerate AI-driven engineering platforms.
Semiconductor Engineering
Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
Technical Paper
Sponsor
Circuit-Technology-Center

Remove Underfilled BGAs Without the Risk
Heat-based removal methods can lead to cratering, substrate delamination, and more. Cold precision milling offers a safer solution for BGA removal.
Circuit Technology Center
The Latest News In IC Packaging & Test
RifSol launches a $1.7B semiconductor project in Morocco with a 200mm fab, design and packaging facilities for automotive chips. Kaynes Semicon begins OSAT production in India, while Arizona's West-MEC opens a K–12 semiconductor cleanroom for workforce training.
Semiecosystem
TSMC still safe from Musk's fab ambitions
Reports of Elon Musk's planned "Terafab" highlight ambitions for in-house chip production, though details remain unproven. TSMC faces minimal near-term impact, possible mid-term pricing pressure, and longer-term risk if vertical integration expands.
Taipei Times
Sponsor
Muhlbauer

Die Sorting with AI-supported AOI and Infrared Inspection
See Muehlbauer's DS Merlin 60K running live at Semicon SEA, Booth #1811. The world's benchmark in die sorting: ultra-high-speed technology with AI-driven vision inspection down to 1 µm resolution.
Muehlbauer
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
Nordson-ASYMTEK

Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
Perspective: AI demand is inflated, and only Anthropic is being realistic
AI token demand appears explosive but may be overstated as companies optimize flawed usage metrics and struggle to prove ROI. Anthropic shifts to per-token pricing and tighter controls, aiming to reflect real usage and position itself for potential market correction.
CNBC
AI chipmaker Cerebras files to go public after scrapping IPO plans last year
Cerebras filed for a Nasdaq IPO under ticker CBRS, reporting $87.9 million net income on $510 million revenue in 2025, driven by strong growth. The AI chipmaker relies heavily on UAE customers and an OpenAI deal exceeding $20 billion.
CNBC
Sponsor
Intraratio-Corporation

Discover Real Operational Strategies from Proven Global Leaders
In this 4-part series we asked three experienced global leaders for their insights on the biggest challenges faced by manufacturing operations today. No Registration required.
Intraratio
FII expects strong year amid booming AI demand
Foxconn Industrial Internet expects strong growth this year as AI and high-end interconnect demand surges. Last year, it boosted profit 52% and revenue 48%, with AI servers tripling and cloud computing dominating sales, while expanding advanced optics and liquid-cooled systems.
Taipei Times
Nvidia AI chip rivals attract record funding as competition heats up
Nvidia dominates AI chips, but startups are challenging its lead as investors pour $8.3 billion into AI chip firms in 2026. They target efficient inference, arguing GPU designs lack optimization, while Nvidia continues heavy R&D and acquisitions.
CNBC
Sponsor
Henkel-AG-Co

Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
Nvidia's Jensen Huang warns Huawei chips for DeepSeek AI models would be 'horrible' for US
Nvidia CEO Jensen Huang warned on a podcast that if DeepSeek optimizes new AI models on Huawei chips, China could surpass the US in AI. He highlighted competition over compute, algorithms, and energy advantages ahead of DeepSeek's V4 launch.
South China Morning Post
ASE to buy Innolux Tainan plant to boost semiconductor packaging capacity
ASE will spend US$460 million to acquire Innolux's fab at Southern Taiwan Science Park, expanding advanced semiconductor packaging capacity for AI and high-performance computing. The company also boosts investment in new plants and technologies to meet rising demand.
Taiwan News
Sponsor
EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
Nvidia's once-tight bond with gamers is cracking over AI
Nvidia shifts from gaming roots to AI dominance, becoming world's most valuable company as data center GPUs drive profits. Gamers feel sidelined as the company prioritizes AI chips and may skip a 2026 GeForce release.
CNBC
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Today's Sponsor
XYZTEC
Sponsor
XYZTEC

Xyztec's virtual reality showroom
Feel free to move around in the interactive xyztec showroom and discover all bondtesters and services with a mouse click. Watch product videos, brochures, and manuals. Explore xyztec!
xyztec
Test Your Knowledge
During its earliest days in development, Windows was known by what name?
See answer below.
Plasmatreat-GmbH
Quote of the Day
Problems are only opportunities in work clothes.
Henry Kaiser
Sponsor
AI-Technology-Inc

Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
Industry Calendar
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
May 12, 2026
iMAPS New England 52nd Symposium
iMAPS
FULL INDUSTRY CALENDAR
SEMI
Cartoon of the Day
Cartoon
"How come you never bring me any of your stupid ideas anymore?"
Copyright © Randy Glasbergen
Sponsor
ECTC

2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
Plasma-Etch
Test Your Knowledge Answer
During its earliest days in development, Windows was known by what name?
Answer: "Interface Manager," which was First developed in 1981 by computer scientist Chase Bishop who named the software project. Marketers at Microsoft later decided that the name "Windows" was more consumer-friendly.