April 27, 2026

SK hynix Receives 2026 IEEE Corporate Innovation Award SK hynix won the 2026 IEEE Corporate Innovation Award in New York, marking its first win. It earned recognition for advancing AI computing through High Bandwidth Memory innovation and stable mass production, strengthening its role in global AI memory solutions. EE Times

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Where we stand after 60 years of Moore's law In 1965, Gordon Moore predicted transistor-driven exponential growth in computing power and falling costs, later known as Moore's Law. While chip scaling has slowed since the 2000s, its legacy continues shaping semiconductors and inspiring AI cost reductions today. MSN

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

Sponsor Nordson Sight™ Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields. Nordson Test & inspection

Intel's stock has best day since 1987, soaring 24% as chipmaker shows signs of a turnaround Intel shares surged 24%, their best day since 1987, as AI-driven demand and strong earnings boosted investor confidence. Under CEO Lip-Bu Tan, revenue rose 7.2% and data center growth hit 22%, signaling a renewed competitive position. CNBC

Intelligent Cost Optimization is a Competitive Advantage Companies transform cost optimization into a competitive edge by investing with precision, not cutting blindly. Manufacturers use teardown analysis to dissect products, reveal cost drivers, benchmark rivals, and guide engineers to reduce over-specification and boost efficiency. EE Times

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor AIT ORMET® TLPS for Component Attach AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC Ormet® TLPS

What Hormuz Exposed About Our Semiconductor Supply Chain Closure of the Strait of Hormuz triggers a semiconductor supply chain crisis, doubling helium prices and disrupting logistics. Chipmakers face delays, rising costs, and AI-driven capacity shifts, exposing deep reliance on concentrated gas supplies and fragile global production chokepoints. EE Times

Chip Industry Week In Review Marvell acquired Polariton Technologies, while Onto Innovation partnered with Rigaku and bought a 27% stake. Tesla will use Intel 14A for its Terafab AI chips. Arteris and GF's MIPS collaborate, and TSMC outlined A14 in 2028 and A13 in 2029. Semiconductor Engineering

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

Why Chip Sovereignty Is No Longer About Chips—But Systems Governments push chip sovereignty, but AI is shifting value from standalone fabs to integrated systems spanning accelerators, CPUs, packaging, memory, and software. Industry now prioritizes heterogeneous architectures and global supply chains over chip-level control. EE Times

Intel's stock soars 20% as results top estimates, with chipmaker showing signs of growth Intel crushed expectations with strong Q1 earnings and revenue, sending shares up 20%. Data center growth and rising CPU demand signal an AI-driven turnaround, though losses widened and challenges in manufacturing and customer adoption remain. CNBC

Sponsor 2026 IEEE ECTC – May 26-29 in Orlando The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. ECTC

TSMC plans chip packaging plant in Arizona by 2029 TSMC will build and operate an advanced chip packaging facility in Arizona by 2029, adding CoWoS and 3D-IC capabilities. The move aims to ease supply-chain bottlenecks, reduce shipments to Taiwan, and expand US manufacturing alongside partners like Amkor. Taiwan News

System-in-Package Challenges Chipmakers and systems firms overcome reticle limits with chiplet designs, distributing workloads across diverse nodes and teams. Experts warn success hinges on managing data flow, physical interactions, power-performance tradeoffs, and long-term package reliability. Semiconductor Engineering

Sponsor How to Tweezer Pull Learn how to perform an optimal Pull/Peel test using Tweezers. This guide covers test method settings and failures modes for Tweezer Pull/Peel testing. Download it now. xyztec

TSMC's Next-generation Chip Coming in 2029 TSMC plans to launch its A13 chip into volume production in 2029, alongside A12, while expanding advanced packaging and photonics technologies to boost AI and HPC performance, improve power efficiency, and scale computing density for next-generation systems. Taipei Times

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies