semiconductor
packaging news
Sponsor
QPT

Pre-molded, Air Cavity QFN Packages
Do you need fast, high-quality solutions for IC packaging or assembly? Use our Open-molded Plastic Packages (OmPPs) to meet your market requirements.
QP Technologies
Industry Press
ZEISS supports the transition of spatial biology to clinical research
ZEISS Research Microscopy Solutions
Siemens and TSMC extend collaboration to drive semiconductor design innovation
Siemens Digital Industries Software
OMNIVISION Launches 1.5-Megapixel Global Shutter Sensor
OMNIVISION
Toughened, UV Curable Adhesive Features Optical Clarity
Master Bond
Openair-Plasma® technology for high-performance and long-lasting batteries - efficient, sustainable, reliable
Plasmatreat GmbH
Indium Corporation Experts to Present on Power Electronics at PCIM Europe 2025
Indium Corporation
Littelfuse Introduces IXD2012NTR High-Side and Low-Side Gate Driver
Littelfuse
Meyer Burger reacts to material shortages and introduces short-time work at the solar cell plant
Meyer Burger Technology AG
MORE INDUSTRY PRESS
Sponsor
ZEISS

See WLCSP Defects with Advanced 3D X-ray Microscopy
Two case studies show the effectiveness of high-res 3D XRM for detecting various defects in WLCSP containing RDL & Cu-pillar microbumps. Read more.
ZEISS Microscopy
ECTC
What Year Was It?
Andropov Writes to U.S. Student
What Year
The Soviet Union releases a letter that Russian leader Yuri Andropov wrote to Samantha Smith, an American fifth-grader from Manchester, Maine, inviting her to visit his country.
See the answer below.
Pac-Tech
Sponsor
CyberOptics

SQ3000+ All-in-One Solution
With all-in-one functionality for AOI, SPI plus CMM applications to attain in-line coordinate measurements much faster than a traditional CMM – in seconds, not hours.
Nordson TEST & INSPECTION
Balazs-Nanoanalysis
Sponsor
XYZTEC

Full automation bond testers
A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more.
xyztec
What Year Was It Answer
Andropov Writes to U.S. Student
Answer: April 25, 1983
April 25, 2025
image
TSMC Announces World-Leading A14 Node to Power AI
TSMC unveiled its A14 chip process, promising 15% speed boosts or 30% power cuts over N2, plus 20% higher logic density. Set for 2028 AI deployments, A14 integrates silicon photonics and aims to cut data center energy consumption.
EE Times
Sponsor
Circuit-Technology-Center

Touch Free BGA Solder Ball Removal
Watch a video that shows touch-free BGA component deballing. This precision process is highly reliable when preparing BGA components prior to reballing.
Circuit Technology Center
Tape-Out Failures Are The Tip Of The Iceberg
The latest Wilson Research/Siemens survey exposes a steep fall in manufacturable chip designs—from 24% to 14%—and growing delays, as AI pressure, lagging EDA productivity, and inflated expectations fuel systemic inefficiency and industry-wide recklessness.
Semiconductor Engineering
Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance changes, and current-carrying capacity estimations crucial for advanced electronics design.
Technical Paper
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
Intel AI Trick Spots Hidden Flaws in Data-Center Chips
Intel engineers are using reinforcement learning to boost detection of silent data errors in Xeon chips, which often evade traditional tests in hyperscale data centers. Their method improves detection fivefold by optimizing matrix-based Eigen test selection.
IEEE Spectrum
SK Hynix warns of increased volatility in second half of year from US tariffs
SK Hynix posted a 158% jump in Q1 operating income, driven by AI chip demand and stockpiling ahead of U.S. tariffs. Despite market volatility, it reaffirmed strong HBM growth, ongoing Nvidia collaboration, and a major DRAM plant expansion.
Taipei Times
Sponsor
Indium-Corporation

Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
Technical Papers
A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding
Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components
In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
Multi-Sensor Metrology for the most challenging Advanced Packaging Applications
Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling
Package Integrated Vapor Chamber Heat Spreaders
Ultrasonic Bonding in semiconductor industry – The fast and clean process
MORE TECHNICAL PAPERS
Sponsor
Ontos-Equipment-Systems

Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma
Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more.
Ontos
TSMC's cutting-edge A14 tech to hit fabs in 2028
TSMC unveiled its A14 chip process, set for 2028 production, promising faster AI computing and improved power efficiency. The company also announced an A16 intermediary process for 2025, underscoring its push to lead in next-gen semiconductor innovation.
Taipei Times
Data Movement Is the Energy Bottleneck of Today's SoCs
As AI accelerates SoC complexity, efficient data movement now rivals compute power in importance. Packet-based network-on-chip (NoC) architectures lead the way, enabling low-latency communication, cache coherence & chiplet integration across modular, high-performance semiconductor designs.
Semiconductor Engineering
Sponsor
Surfx-Technologies

High-volume Manufacturing
The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations.
Surfx Technologies
AI-Driven Verification Regression Management
Synopsys VC ExecMan is revolutionizing chip verification by integrating AI, machine learning, and advanced regression automation to streamline planning, execution, analysis, and debugging—boosting efficiency, coverage, and quality while slashing time to tape-out.
Semiconductor Engineering
Asia/Pacific AI Spending to Reach $175 Billion by 2028, Driven by GenAI Boom, Says IDC
AI and generative AI spending in Asia/Pacific is surging, expected to hit $175 billion by 2028. Driven by digital transformation and demand for intelligent automation, the region is embedding AI across sectors, reshaping business operations and public services.
IDC
Sponsor
Master-Bond

Two Part, Room Temperature Curing Epoxy
Master Bond EP39MAOHT is a thermally conductive, electrically insulative adhesive with low exotherm, suitable for large castings and potting applications.
Master Bond
Nvidia supplier SK Hynix warns of demand volatility after quarterly profit soars 158% on AI boom
SK Hynix beat Q1 estimates as AI-driven demand for high-bandwidth memory boosted revenue 42% and profit 158% year-over-year. It overtook Samsung in DRAM market share and plans a new $15B+ fab to expand next-gen HBM production.
CNBC
TSMC Unveils Advanced A14 Process Amid AI Boom
At its North America Technology Symposium, TSMC unveiled its A14 process, promising major gains in AI chip performance and efficiency. Set for 2028 production, A14 strengthens TSMC’s edge amid fierce Intel rivalry and rising geopolitical pressures.
EE Times
Sponsor
Tresky

Flip Chip Bonding / C4 technology
High pression process of assembly and connection technology (AVT) for contacting unhoused semiconductor chips by means of balls - so-called "bumps".
Tresky Automation
Intel Poised to Cut More Than 20% of Staff
Intel plans to cut over 20% of its workforce this week under new CEO Lip-Bu Tan, aiming to slash bureaucracy and revive its engineering focus. The move follows past layoffs and asset sales as part of a broader turnaround strategy.
Taipei Times
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Today's Sponsor
DL-Technology
Sponsor
DL-Technology

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
Test Your Knowledge
What puts the fizz in soda water?
See answer below.
Plasma-Etch
Quote of the Day
"How wonderful it is that nobody need wait a single moment before starting to improve the world."
Anne Frank
Sponsor
TJ-Green-LLC

28th Annual CMSE
The premier event focuses on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military. April 29 - May 1, 2025
TJ Green Associates
Industry Calendar
Apr 25, 2025
Gases and Facilities Japan Joint TC Chapter Meeting
SEMI
Apr 28, 2025
Understanding semiconductor technology and business/Austin, TX
PTI International
Apr 29, 2025
Overview of semiconductor manufacturing/Austin, TX
PTI International
Apr 29, 2025
28th Annual Components for Military & Space Electronics Conference & Exhibition (CSME 2025)
TJ Green Associates, LLC
Apr 30, 2025
SEMI Arizona Chapter Breakfast Forum
SEMI
FULL INDUSTRY CALENDAR
MRSI
Cartoon of the Day
Cartoon
"It's your attitude, not your aptitude that determines your altitude. That's the philosophy that got me kicked out of pilot school."
Copyright © Randy Glasbergen
Sponsor
Dr.-Tresky-AG

High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
Amkor-Technology
Test Your Knowledge Answer
What puts the fizz in soda water?
Answer: Carbon dioxide