Sep 25, 2026 3D Chips Push EDA Into New Territory AI and HPC chip designs push EDA toward system-level, multiphysics workflows. 3D stacking, chiplets and heterogeneous integration require interoperable tools, faster exploration and continuous physics analysis, while manual processes and data gaps slow development. Semiconductor Engineering

Sponsor Epoxy & Adhesive DIE Bonding One of the most common methods of creating a connection between chip and substrate is the gluing process. Extreme precise epoxy & adhesive bonding processes for sustainable bonds. Tresky Automation

12-inch Wafer Price Hikes Loom for 2027 as AI Demand Tightens Supply, with LTAs Reportedly Up 15–40%+ AI-driven chip and CoWoS expansion is tightening 12-inch wafer supply, pushing 2027 LTA prices up 15%-25% for epi wafers and more than 40% for polished wafers. Spot prices could exceed contracts by Q4, extending pressure into 2028 as demand grows. Trendforce

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. Technical Paper

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GlobalFoundries accelerating global capacity expansion, official says GlobalFoundries plans to accelerate global capacity expansion as AI drives surging demand for RF and other chips. Singapore will play a key role, while the company expands GaN technology, strengthens Taiwan engagement, and grows its local R&D team. Taipei Times

Outlook for US market robust, Advantech says Advantech expects strong US demand through the second half, driven by healthcare, semiconductor equipment and robotics. US design wins have already exceeded last year’s total, while revenue could reach $1 billion as Tustin production expands. Taipei Times

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Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

SoftBank's growing bets on AI and semiconductor assets SoftBank raised a record $11.1 billion high-yield bond to fund investments in OpenAI and AI infrastructure. Masayoshi Son is expanding across semiconductors, data centers, robotics and AI development, while OpenAI's rising valuation has generated $45 billion in unrealized gains. Reuters

Inside TSMC's Evolving Design Ecosystem: Shaping the Future of AI, with AI TSMC is expanding its OIP ecosystem with the AI Design Kit, enabling agentic AI workflows that could boost digital design productivity by 3–5x and analog/RF productivity by up to 6x while advancing energy-efficient compute, integration, connectivity, and system-level innovation. EE Times

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After IonQ Buyout, SkyWater Reiterates Role as Quantum Foundry SkyWater will treat IonQ and other quantum customers equally, protecting IP despite IonQ's acquisition. The foundry supports major quantum modalities and develops custom processes while expanding capacity for scalable quantum chip production. EE Times

China's semiconductor industry surges as domestic champions expand amid sanctions China's semiconductor industry is booming, with profits at nearly 190 listed firms surging 620% year over year. Memory leaders CXMT and YMTC, along with equipment suppliers, are benefiting from AI demand, domestic expansion, and Beijing's push for self-reliance. Global Sources

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When AI Agents Cross Chip Design Silos AI is shifting chip design toward smaller, specialized language models and coordinated agents. These systems can optimize, verify and debug designs while integrating fab data, but require orchestration, guardrails, trusted data and human oversight. Semiconductor Engineering

EDA's Future Is Evidence-Driven Automation AI is reshaping EDA by automating complex workflows, connecting specialized tools, and preserving design intent across handoffs. As chip complexity grows, vendors are deploying agentic AI, machine learning, and faster engines to reduce design cycles and costs. Semiconductor Engineering

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AI-Driven Device Modeling For Next Generation Quantum Applications Quantum computing boosts demand for cryogenic models as shifting parameters and low-temperature physics slow extraction. Keysight's ML optimizer accelerates BSIM-BULK extraction, speeding accurate simulation of quantum control and readout circuits. Semiconductor Engineering

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Silicon Wafer Prices to Surge 40% in 2027 as AI Demand Squeezes the Chip Supply Chain AI demand is expected to drive silicon wafer prices higher through 2027, with polished wafers potentially rising 40% and epitaxial wafers 15%–25%. Strong GPU, ASIC and CoWoS growth could further boost wafer demand and encourage long-term supply agreements. wccftech