Nov 10, 2026 The Optical Superhighway for AI The semiconductor industry expects optical interconnects to replace copper within five years, extending into server racks. Major chipmakers and tech firms back OCI-MSA to establish interoperable, energy-efficient optical standards. Semiconductor Engineering

Sponsor Fusion and Hybrid Bonding Experts EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology. EV Group

Europe's Chip Industry: Perfect Storm or Perfect Timing? Europe's semiconductor industry faces geopolitical risks, high costs and overseas dependence. Chips Act 2.0 aims to boost competitiveness through increased investment, innovation and collaboration while building a more resilient regional supply chain. EE Times

How AI Could Cut Semiconductor Package Design Cycles from Months to Days This paper explores how AI-powered semiconductor package design tools can accelerate development, reduce errors, optimize performance and sustainability, and enhance engineer productivity, transforming package design cycles from months to days. Technical Paper

Sponsor Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more. Ontos

Nvidia's Huang spy scandal signals tighter US chip controls Jensen Huang's alleged ties to a China-linked businesswoman could intensify US scrutiny of Nvidia and accelerate stricter chip export controls. Analysts warn Washington may fast-track legislation blocking Chinese firms from remotely renting advanced AI chips overseas. Asia Times

Jensen Huang affair puts Nvidia's future at risk, with no clear successor to the renowned CEO Nvidia CEO Jensen Huang faces mounting scrutiny following his admission of an affair with an alleged Chinese spy, raising succession concerns, triggering a 4% stock decline, and prompting political investigations despite the board expressing confidence in his leadership. CNBC

Sponsor Electrically Insulating, Toughened Epoxy Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened epoxy system that transfers heat effectively and can be used for bonding, sealing, coating, potting and glob topping. Master Bond

Technical Papers ■ Beneath the Surface: The Rise of Intelligent X-Ray Inspection ■ The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates MORE TECHNICAL PAPERS

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

Goldman CEO Solomon says AI financing remains strong despite market jitters Goldman Sachs CEO David Solomon says AI infrastructure financing remains strong despite market volatility and political concerns. He expects sustained investment, citing AI's long-term productivity gains and the need to build U.S. data centers. CNBC

Can Jensen Keep His Job? Nvidia CEO Jensen Huang admitted an affair with a woman U.S. intelligence suspects is a Chinese asset, prompting a congressional briefing and board investigation. The scandal raises security, export-control and reputational concerns. EE Times

Sponsor Die-Module Attach for High Power Devices High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding. AI Technology, Inc.

Global Semiconductor Equipment Sales to China Plummet Under U.S. Export Controls U.S. export controls and AI investment in South Korea and Taiwan are shrinking China's share of global chip equipment sales, while Chinese suppliers expand domestic and overseas markets and strengthen technological competitiveness. The Chosun Daily

Powering AI Data Centers: Rethinking Energy Infrastructure for the Next Wave of AI Growth AI-driven data centers face growing power demands as utility grids struggle to keep pace. Delta Electronics highlights how microgrids, on-site generation, energy storage, and intelligent controls can improve reliability, scalability, efficiency, and accelerate AI infrastructure deployment. EE Times

Sponsor Oxide Reduction for Reliable Power Electronics Manufacturing As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in power electronics production. Download here. Plasmatreat GmbH

Still Looking for Diamonds Europe's silicon carbide ambitions face Chinese price competition, fragmented investment and limited fab capacity. Meeting EV, renewable energy and AI demand will require phased funding, committed customers and stronger regional supply chains. EE Times

The Race to Build a "Find My" for AI Chips The U.S. is exploring geolocation, cryptographic certificates and chip fingerprinting to stop AI chip smuggling into China. However, security flaws, high costs and inspection challenges could undermine enforcement efforts. IEEE Spectrum

Sponsor Proven SiPaste® for Ultrafine-Pitch Printing Boost SPI yields with SiPaste® C312HF. Formulated for fine feature printing, it combines best-in-class stencil print transfer efficiency and excellent stencil life. Indium Corporation

Memory In Physical AI Humanoid robots, autonomous vehicles, and drones face battery-life limitations that restrict their operating time. Cadence's Frank Ferro highlights how efficient processing, denser memory, faster data transfers, and optimized data hierarchies can improve performance while controlling costs. Semiconductor Engineering

Sponsor 3 Ways to Increase Plasma Uniformity Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more. Plasma Etch

DeepX Tapes Out Second-Gen Chip, Projects 6.7× Performance Gain With LPDDR5x-PIM DeepX has developed its second-generation DX-M2 AI accelerator with Samsung’s PIM technology, delivering up to 80 TOPS within 5 W. The chip targets robotics, drones, automotive and edge devices, enabling powerful local AI inference with reduced data-center dependence. EE Times