July 30, 2026

Worldwide Silicon Wafer Shipments Increase 7.4% Year-on-Year in Q2 2026 SEMI reported global silicon wafer shipments rose 7.4% year over year and 9.1% sequentially in Q2 2026, driven by expanding AI demand across logic, memory, power and photonics. Recovering automotive and industrial markets are expected to sustain growth. SEMI

Sponsor Automatic Grading Without Assistance Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images. xyztec

Wafer fab equipment: a market on track to explode Global wafer fab equipment spending is entering a strong growth cycle despite profitability and overcapacity risks. Yole Group forecasts WFE revenue rising from US$129 billion in 2025 to nearly US$220 billion by 2031, driven by advanced logic, memory, packaging and fab automation. Yole Group

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Mass Production and Capacity Expansion Accelerate, Reshaping the Foundry Landscape in Silicon Photonics AI bandwidth demand is driving foundries to accelerate silicon photonics for faster, more efficient chip interconnects. TSMC, UMC, GlobalFoundries and Tower are expanding production, aiming to commercialize optical chip packaging despite integration and standards challenges. TrendForce

7.1 Kumamoto Earthquake: TSMC Confirms JASM Safe; TEL Halts Plants as Chip Supply Chain Assesses Impact A powerful earthquake in Japan's Kumamoto Prefecture prompted semiconductor manufacturers to inspect facilities. TSMC confirmed no structural damage at its JASM fab and is resuming operations, while suppliers assess impacts as transport and logistics risks persist. TrendForce

Sponsor Corner fill inspection A memory manufacturer adopted Nordson's AOI system with deep learning to inspect IC corner fill, ensuring accurate detection, measurement, and improved reliability in semiconductor assembly. Nordson Test & Inspection

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT) AI Technology pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding. We now have extended our adhesive line. See more AI Technology, Inc.

Qualcomm to raise prices during memory crunch as chipmaker issues light earnings guidance Qualcomm met third-quarter earnings expectations but forecast weaker profits as semiconductor and memory costs rise. It will increase chip prices in September while expanding into automotive and AI markets to reduce reliance on slowing smartphone demand. CNBC

Dynamic AI Demands Drive Memory Diversity AI data centres are adopting layered memory architectures beyond HBM, with LPDDR, SOCAMM, CXL, NOR flash and MRAM improving power efficiency, capacity and inference performance while balancing cost, latency and growing AI workload demands across cloud and edge systems. EE Times

Sponsor IC Device & Micro-Electronic Cleaning Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge. Kyzen Corporation

UMC planning major expansions UMC will invest US$5 billion over the next three years to expand silicon photonics and advanced packaging, targeting booming AI demand. The chipmaker also raised capital spending, forecast stronger profitability, and expects AI revenue to exceed US$1 billion within three years. Taipei Times

Intel's U.S. Advanced Packaging Enables Next-Generation AI Semiconductors Intel boosts AI chip performance by combining chiplets with Foveros and EMIB into powerful multi-chip systems. Its expanding New Mexico facility supports larger packages, improves efficiency, cuts costs and strengthens U.S. chip manufacturing. Intel Newsroom

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

AI Is Hyper-Scaling Digital Inequality AI is widening global inequality as advanced economies dominate computing power and AI innovation. Nations including South Africa and Indonesia are advancing local AI strategies, while stronger digital skills, regional partnerships and inclusive innovation remain vital. IEEE Spectrum

From Co-Packaged Optics to Nanolasers, Photonics Moves Inward CEA-Leti, Scintil Photonics and NcodiN are advancing silicon photonics into AI chip packaging with integrated lasers and optical chiplet links. They aim to replace copper, boosting bandwidth, power efficiency and scalable chip integration fast. EE Times

Sponsor SB²®-Jet: Your Soldering Game-Changer SB²®-Jet offers high-precision solder ball jetting technology, handling ball diameters from 40µ-760µm. Perfect for flip chip, PCB, reballing, BGA, CSP applications. PacTech

Flat Enough? Warpage Management Gets Harder In Advanced Packaging Advanced packaging demands smarter warpage management as AI, chiplets, and hybrid bonding tighten manufacturing tolerances. Manufacturers are adopting high-density shape metrology, improved materials, and process-aware simulations to control stress & improve reliability across Semiconductor Engineering

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies