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1 of 10 Applications: UV Curing
Swiss made die bonders from Tresky handle bonding processes with fast curing UV adhesives easily. A high-power UV source attached to the dispenser takes care of the curing step.
Dr. Tresky AG
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IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
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What Year Was It?
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First Academy Awards Ceremony
The Academy of Motion Picture Arts and Sciences hands out its first awards, at a dinner party in the Roosevelt Hotel in Hollywood, California.
See the answer below.
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What Year Was It Answer
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First Academy Awards Ceremony Answer: May 16, 1929
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May 16, 2025
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Die-to-die Interconnect Standards In Flux
UCIe 2.0 raised concerns for being overly complex, but many of its new features are optional and tailored for future chiplet marketplaces. While most current designs are captive and don't need full interoperability, flexibility remains a key strength.
Semiconductor Engineering
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Achieve Precision in WLCSP Bumping
Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts.
PacTech
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Canada's Chip Industry Charts Best Path to Growth
At the CHIPS NORTH Summit, industry leaders urged Canada to define a long-term semiconductor strategy. While large-scale fabs seem unlikely, experts see opportunity in design, talent retention & targeted investment to boost homegrown innovation & global competitiveness.
EE Times
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What to Look Out for When Acquiring AI Systems
The IEEE has finalized draft standard IEEE 3119-2025 to guide government procurement of high-risk AI systems. It offers a risk-based, operational framework to ensure responsible purchasing, adding a key step—solicitation preparation—based on EU feedback.
IEEE Spectrum
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TSMC outlines work on nine new advanced factories
TSMC plans to build nine new fabs in 2025—including eight wafer plants and one advanced packaging facility—to meet surging AI and HPC chip demand. The company is expanding in Taiwan, the U.S., and Japan while ramping CoWoS capacity.
Taipei Times
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OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
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Development Flows For Chiplets
Chiplets promise a revolution in semiconductor design, but fragmented standards and ecosystem immaturity stall progress. Experts stress the need for unified models, cross-vendor collaboration & trusted frameworks to truly unlock scalable, interoperable 3D-IC & chiplet-based architectures.
Semiconductor Engineering
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AI Accelerators Moving Out From Data Centers
AI's data surge is pushing chipmakers to move beyond traditional planar SoCs. In a recent panel, industry leaders emphasized the growing need for advanced compute architectures and highlighted chiplets as a key solution to meet AI demands.
Semiconductor Engineering
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Explore Reliable Solutions for WLP & PLP
For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions.
Nordson Electronics Solutions
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Today's Sponsor |
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Sponsor |
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Proven Die-Attach Pastes and Films
Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity.
AI Technology, Inc.
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Test Your Knowledge
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Which one of the following animals is not found exclusively in Africa: Lion, Orangutan, Gorilla, or Gazelle?
See answer below.
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Quote of the Day
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"The advantage of a classical education is that it enables you to despise the wealth which it prevents you from achieving." Russell Green
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Cartoon of the Day
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"Information security is becoming a big problem here. Do you still have my Captain Crunch decoder ring?"
Copyright © Randy Glasbergen
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Sponsor |
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Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science
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Test Your Knowledge Answer
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Which one of the following animals is not found exclusively in Africa: Lion, Orangutan, Gorilla, or Gazelle? Answer: Orangutan (found only in Asia)
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