Sep 18, 2026 AI's Storage Problem Is a Packaging Problem AI-driven demand is reshaping memory markets as NAND storage supports expanding data needs across cloud, mobile and automotive systems. Advanced 3D NAND, hybrid bonding and denser packaging enable higher capacities while manufacturers balance performance, supply & reliability. Semiconductor Engineering

Sponsor Highly Thermally & Electrically Conductive TLPS via Filing Paste New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles. Ormet TLPS

From Silicon To Systems: Heterogeneous Integration As The Engine Of AI Performance Intel engineers showcased advanced packaging, chiplets and system co-optimization at DAC 2026, addressing AI's rising computing demands. Innovations in design, thermal management, power delivery and interoperability enable scalable systems. Semiconductor Engineering

Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs. Technical Paper

Sponsor How LAPLACE® Laser Assisted Bonding Saves Energy LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo. PacTech

U.S. Awards Anderon $1B for Quantum Wafer Manufacturing Anderon will receive a $1 billion CHIPS Act award to expand U.S. quantum wafer production. The IBM-owned foundry aims to scale manufacturing, serve diverse quantum architectures, and strengthen domestic supply chains as quantum computing advances toward commercialization. EE Times

Jensen Huang says Nvidia will sell twice as many chips next year Nvidia CEO Jensen Huang expects chip sales to double next year, driven by surging global AI investments. The forecast signals continued growth across Nvidia's semiconductor portfolio as Huang emphasizes safety and responsible engineering in advanced AI development. CNBC

Sponsor Advanced Packaging: Flexible Die Bonder The MRSI-705 die bonder's versatile work area handles many input and output types. Scan the QR code for an augmented reality experience! MRSI Mycronic

Technical Papers ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days ■ 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing ■ A New Optical Ball Grid Array Package Development for Automotive Optical Sensor ■ Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications ■ Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging MORE TECHNICAL PAPERS

Sponsor Effect of Package Warpage and Composite CT on Failure Modes Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data. Akrometrix

How Huawei plans to bypass US chip curbs with its new UnifiedBus technology Huawei unveiled Peerium, a computing architecture using UnifiedBus to connect up to one million processors as one computer. Its Atlas 950 SuperCluster deployment advances large-scale AI computing. Huawei promotes open interconnect technology amid US semiconductor restrictions. South China Morning Post

America's AI chip talent crisis — why The U.S. needs 157,000 more workers The U.S. faces a shortage of up to 157,000 semiconductor workers by 2030 as AI-driven chip manufacturing expands. Companies and universities are developing talent pipelines, while rising salaries and competition complicate efforts to staff new fabrication facilities. CNBC

Sponsor Epoxy for Dam-and-Fill Applications Master Bond EP17HTDM-2 Black is a high temperature resistant, non-drip adhesive for bonding, sealing, encapsulating and dam-and-fill applications. Master Bond

SK Hynix's Intel Liaisons: What You Need to Know SK Hynix is exploring leasing Intel's delayed Ohio fab or forming a joint venture to expand advanced memory production in the U.S. Tariff negotiations, AI-driven demand, and geopolitical pressures are shaping the potential partnership, which remains undecided. EE Times

No Summer Lull for Semiconductors AI demand drove a relentless semiconductor summer, spurring investments, acquisitions, fundraising and IPOs. Companies expanded capacity, advanced AI hardware and strengthened supply chains as surging memory demand lifted 2026 revenue forecasts. EE Times

Sponsor AIT ORMET® TLPS for Thermal Conductivity AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C Ormet TLPS

Why Package Digital Twins Are So Hard To Build Package digital twins combine electrical, thermal, mechanical, and manufacturing data to predict chiplet behavior. Engineers must overcome process variability, incompatible formats, missing data, and IP limits that hinder system-level models. Semiconductor Engineering

Beyond Scaling: The Growing Role Of Materials Innovation In Semiconductor Manufacturing AI-era semiconductor advances rely on innovative materials. Computational screening, materials AI and industry collaboration speed discovery, cut delays and solve scaling challenges in photonics, power electronics and advanced manufacturing. Semiconductor Engineering

Sponsor 1 of 10 Applications: Die Sorting Die sorting with Swiss made Tresky die bonders is just one of many powerful applications. Switching between them is a matter of minutes, and training could not be simpler. Dr. Tresky AG

Driving Power Delivery Innovations For The AI Data Center Intel Foundry tackles AI and HPC power delivery with 18A backside power, silicon capacitors and integrated voltage regulators. These technologies improve power integrity, manage current density and support accelerators, racks and data centers. Semiconductor Engineering

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

Predicting Silicon Behavior Years Before Test Wafers Synopsys' S-Litho predicted high-NA EUV defects and line-edge roughness years before silicon validation. IBM's 2025–2026 measurements confirmed the results, showing simulation can cut wafer runs, speed optimization, and reduce manufacturing risk. Semiconductor Engineering