August 17, 2026

Intel at a Memory Crossroads, Again Intel is exploring new memory architectures as AI reshapes demand and shortages persist. CEO Lip-Bu Tan has highlighted stacked DRAM and advanced packaging, while initiatives such as XBM and ZAM could revive Intel’s memory ambitions. EE Times

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Chip Industry Week In Review AI infrastructure is evolving as smaller models cut compute needs, while optical interconnects, chiplets and advanced cooling enable larger systems. Companies are pouring billions into chips, packaging, quantum computing and workforce development. Semiconductor Engineering

Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Technical Paper

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Semiconductor Equipment Shifts To Build-to-Print Manufacturing Semiconductor fabs are pushing equipment demand beyond OEM capacity, making build-to-print partners vital. Contract manufacturers help OEMs scale, preserve capital and design control, and support global fab expansion without costly new facilities. EE Times

China's Top Two Foundries Hit Capacity Crunch: What's Next for SMIC and Hua Hong's Expansion Plans? SMIC and Hua Hong are running near capacity as AI-driven demand boosts orders for mature-node chips. SMIC targets 95% utilization and may add equipment, while Hua Hong expands capacity through new projects and an acquisition. TrendForce

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

Common Earth Project Aims to End Chip Supply Chain Bottlenecks University of Michigan researchers and Imec are launching "Common Earth" to strengthen semiconductor supply chains. The project targets alternatives to scarce materials and PFAS chemicals, reducing geopolitical, environmental and social risks to chip production. IEEE Spectrum

SMIC lifts prices due to AI demand SMIC raised prices for high-demand wafer capacity as AI demand boosted orders, lifting second-quarter revenue above $3 billion and profit to $479.2 million. The Chinese foundry expects continued AI-driven growth, higher shipments, and expanded capacity in the second half. Taipei Times

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Amkor Technology Joins Arizona Economic Delegation to the Republic of Korea Amkor is joining an Arizona delegation to Korea to strengthen semiconductor partnerships and investment. Its Arizona campus, set to become the first high-volume advanced packaging and test OSAT facility in the U.S., will create up to 3,000 jobs and bolster supply-chain resilience. 3DInCites

Arm co-founder Hermann Hauser's AI warning: The revolution is real, but so is the bubble risk Tech veteran Hermann Hauser sees AI driving value despite market turbulence and inflated valuations. He warns of soaring compute costs and urges Europe to invest in photonics and in-memory computing to build tech sovereignty and compete globally. CNBC

Sponsor S-SWIFT™: Fan-Out. Substrate. Unified. Amkor's new S-SWIFT™ enables high-performance, cost-effective integration of multiple chiplets and memory. Amkor Technology

SMIC weighs more capacity as AI-related chip demand exceeds forecasts China's SMIC plans to add equipment as AI-driven demand pushes mature-node chip orders beyond forecasts. Capacity utilization reached 93.7%, while second-quarter revenue jumped 36.1% year over year to $3.01 billion, prompting further expansion and potential price increases. South China Morning Post

Half-trillion Nvidia chip financing threatens China AI ambitions Nvidia's $500 billion financing push could cement its AI dominance while pressuring Chinese chipmakers. Critics warn debt-fueled growth could spur overcapacity, financial risks and scrutiny as US-China tensions reshape data center supply chains. Asia Times

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Rochester region sees semiconductor growth from CHIPS Act investments Four years after the CHIPS Act, Upstate New York has drawn billions in semiconductor investment, created jobs and strengthened supply chains. Edwards Vacuum, NY SMART I-Corridor and STELLAR Engine are boosting manufacturing, research and workforce. Rochester Business Journal

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology