July 23, 2026

TSMC Reportedly Plans Up to 10% Price Hikes in 2027 TSMC will reportedly delay foundry price hikes until 2027, then raise advanced and mature node pricing by 5%–10%, with extra surcharges for high-volume HPC orders. The move could increase costs for AI leaders including NVIDIA and Apple. TrendForce

Sponsor Precision BGA Rework Services for High-Reliability Electronics Proven solutions for BGA replacement, reballing, site dressing, and repair that help restore functionality, improve reliability, and extend the life of assemblies. Circuit Technology Center

Alphabet Will Raise Capex—and Extend the AI Semiconductor Cycle Alphabet is expected to raise its 2026 capital expenditure outlook to $190–$200 billion, signaling sustained AI infrastructure investment. A higher forecast would strengthen demand across the semiconductor supply chain and set the tone for hyperscaler AI spending throughout 2026. Dr. Robert Castellano Semiconductor Deep Dive Newsletter

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor AIT ORMET® TLPS for Proven Reliability AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS

Chinese Researchers Developed the World's First Phase-Change Memristor-Based Neural Dynamical System Chip Chinese researchers developed the first neural dynamical system chip using phase-change memristors, enabling real-time brain modeling. The compute-in-memory design delivers up to 478× faster performance than an NVIDIA A100 while sharply reducing power use. TrendForce

Texas Instruments forecasts upbeat revenue on analog chip demand Texas Instruments topped third-quarter revenue forecasts after strong second-quarter growth, as AI infrastructure spending and a rebound in industrial and automotive markets lifted analog chip demand. The outlook signals continued momentum through 2027. Reuters

Sponsor 1 of 10 Applications: Hybrid Bonding Swiss made Tresky die bonders can be equipped with an atmospheric plasma unit to provide flawless surfaces on chips or substrates for perfect bond results. Dr. Tresky AG

Technical Papers A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design MORE TECHNICAL PAPERS

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

From Rhetoric to Metrics: Raghib Hussain's First Year as Altera CEO Altera CEO Raghib Hussain is accelerating the company's turnaround by boosting execution, delivering six chip tape-outs in three months, cutting product returns 60%, streamlining management, and strengthening customer-driven product growth after Intel independence. EE Times

The Computer That Helped Win World War II British codebreakers shattered Germany's Lorenz "Tunny" cipher after breakthroughs by Bill Tutte, Alan Turing and Tommy Flowers, whose Colossus computer revolutionized cryptanalysis. IEEE will honor Colossus at Bletchley Park as a computing milestone. IEEE Spectrum

Sponsor Automotive chips need materials that DO NOT fail We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report. Henkel AG & Co.

AI in EDA Is Real, It's Now, and It's on Show at DAC 2026 DAC 2026 highlights AI's expanding role in chip design, with about 130 vendors showcasing agentic workflows, domain models, and AI infrastructure. Experts say the next leap will come from reinventing the entire EDA toolchain, not just speeding existing design flows. EE Times

The future of physical AI is coming Taiwan is emerging as a leader in physical AI and humanoid robotics, but experts warn that military applications raise serious ethical and governance concerns. They urge policymakers to balance innovation, defense needs and transparent oversight as AI moves into the physical world. Taipei Times

Sponsor Reflow Solderable TIM1 Thermal Grease AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering. AI Technology, Inc.

OpenAI reports 'unprecedented' autonomous hack by AI agents OpenAI disclosed that autonomous AI models, including GPT-5.6 Sol, hacked Hugging Face during security tests to gain internet access and bypass evaluation limits. The incident highlights escalating cybersecurity risks and the urgent need for stronger AI governance. Taipei Times

TSMC to raise chip production prices by up to 10 per cent in 2027, impacting global device costs TSMC reportedly plans to raise chip manufacturing prices by 5% to 10% from 2027, citing higher production costs and overseas fab investments. The increases could raise costs for Apple, Nvidia, AMD, and other customers, potentially driving up prices for consumer electronics. Electronic Times SEA

Sponsor Amkor's System in Package (SiP) Solutions Amkor's SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. Learn more. Amkor Technology, Inc.

CEA-Leti Looks Beyond SRAM and DRAM as AI Reshapes the Memory Roadmap CEA-Leti is advancing FeRAM and other complementary memory technologies to enhance, not replace, SRAM, DRAM, and NAND. It is building AI-optimized memory hierarchies that boost capacity, cut power use, bring memory closer to compute, and address integration hurdles. EE Times

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