March 5, 2026

Tool And Methodology Changes Coming In Fab And Package Automation Industry experts say semiconductor fabs and packaging plants are moving into a data-driven era. Advanced analytics, process control and stronger supply-chain collaboration are improving yields, efficiency and next-gen chip packaging. Semiconductor Engineering

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VIEWPOINT 2026: Dr. Nokibul Islam, Sr. Director, STATS ChipPAC The semiconductor industry is undergoing rapid transformation, driven by strong growth in computing-intensive applications such as artificial intelligence (AI), high-performance computing (HPC), and advanced consumer electronics. Increasing demands from data processing, video streaming, gaming, and other data-heavy ... STATS ChipPAC

Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging As advanced packaging density increases, alpha particle emissions present a growing reliability risk. This article examines soft error mechanisms and solutions to mitigate failures in AI, HPC, and high-density packages. Technical Paper

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TSMC aims to complete new Tainan fab in 2028 amid AI-driven expansion Taiwan Semiconductor Manufacturing Co. is advancing plans to build a new fabrication plant at the Southern Taiwan Science Park in Tainan, targeting completion in 2028, as surging global demand for artificial intelligence chips drives aggressive capacity expansion. Taipei Times

DRAM shortage to last through 2028: Nanya Nanya Technology Corp warned the global DRAM shortage could last until 2028 as AI demand pushes memory makers to shift capacity toward HBM chips, limiting new supply worldwide and driving continued DRAM price increases through the decade. Taipei Times

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor 2026 IEEE ECTC – May 26-29 in Orlando The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. ECTC

SK hynix showcases advanced AI memory solutions at MWC 2026 SK hynix showcased next-generation AI memory at Mobile World Congress 2026, unveiling HBM4 and LPDDR6 for data centers, on-device AI, autonomous driving and connected cars while deepening partnerships across the global mobile ecosystem. Yonhap News Agency

The US is unlikely to curtail China's critical minerals dominance The United States convened a critical minerals summit with allies to curb China's dominance in battery and tech supply chains. However, China's control of over 80% of battery production and deep global investment ties make reducing its influence difficult. Asia Times

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Taiwan Builds the Future Taiwan's semiconductor sector is set to shatter production records as AI demand fuels activity from chip design to advanced packaging. Backed by government R&D funding, talent development and global partnerships, Taiwan navigates constraints. EE Times

Nvidia CEO Huang says $30 billion OpenAI investment 'might be the last' Nvidia CEO Jensen Huang said the chipmaker's $30 billion investment in OpenAI may be its final stake before the startup's expected IPO, while Nvidia also plans no further funding for Anthropic despite booming AI infrastructure partnerships. CNBC

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Broadcom beats on earnings and guidance as AI revenue doubles Broadcom beat earnings and revenue estimates and issued strong guidance, driven by surging AI chip demand. CEO Hock Tan said AI chip revenue could exceed $100 billion by 2027, sending the company's shares up 5% in extended trading. CNBC

Intel names Barratt as next chairman, replacing Frank Yeary Intel named Craig H. Barratt chairman, replacing Frank Yeary after the May 13 annual meeting, as CEO Lip-Bu Tan pushes a turnaround. The veteran chip executive is expected to help restore product leadership and strengthen Intel's foundry ambitions. Taipei Times

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At MWC, Qualcomm Outlines AI-Native 6G Vision Qualcomm announced new partnerships at MWC 2026 to accelerate 6G development and target a 2029 rollout. The company promotes an AI-native network combining distributed computing, sensing and energy-efficient design to power edge AI and new telecom services. EE Times

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