February 10, 2026

Taiwan Not Moving 40% of Chip Production to US Taiwan told Washington it will not move 40 percent of its semiconductor production or advanced technologies to the US, Vice Premier Cheng Li-chiun said, while backing a tariff-cut deal and expanded US investment under the "Taiwan model." Taipei Times

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

VIEWPOINT 2026: Thomas Rodgers, Senior Director of Market Strategy, ZEISS Microscopy The semiconductor industry is entering a new era where performance gains are increasingly delivered through advanced packaging, not just transistor scaling. Chiplets, 2.5D/3D integration, high bandwidth memory (HBM), hybrid bonding, and co-packaged optics (CPO) are enabling unprecedented bandwidth, power ... ZEISS Microscopy

Reducing CTE Mismatch Defects in Flip Chip Reflow TrueFlat technology uses negative pressure reflow and Advanced Thermal Control (ATC) to reduce warpage, micro spikes, and CTE mismatch defects in ultra-miniaturized electronic assemblies with fragile ELK materials. Technical Paper

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TSMC 3-nm Upgrade in Japan to Catch up With Demand TSMC will upgrade its Japan fab to 3-nm production to rapidly expand global AI chip capacity, investing up to $20 billion. The Kumamoto facility supports rising demand, positions Japan in advanced semiconductors, and targets volume shipments around 2028. EE Times

A quick stretch switches this polymer's capacity to transport heat MIT engineers discovered a common polymer that reversibly switches thermal conductivity when stretched, doubling heat flow in 0.22 seconds. The fast, elastic material could enable adaptive cooling in clothing, electronics, and buildings without permanent manufacturing changes. MIT News

Sponsor RDL Interposers – USA Fabrication Organic Substrates/High Density Interposers - 20µm Dielectrics - 12µm Traces - 50µm "Stay Flat" Cores - Quick Turns. Learn more. Advanced Component Labs, Inc.

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation

New Devices Might Scale the Memory Wall UC San Diego researchers unveiled redesigned "bulk" RRAM that computes directly in memory, bypassing AI’s memory wall. Their nanoscale, multi-layer devices enable stable analog learning, achieve 90% edge accuracy, and integrate without high voltages or selector transistors. IEEE Spectrum

NOR Flash Next in AI-Driven Memory Crunch AI demand is triggering a looming NOR flash supply crunch as servers use over 30 devices per rack. Rising content per Nvidia systems is intensifying capacity competition, pushing prices higher and forcing shifts toward denser 3D NOR technology. EE Times

Sponsor Temporary Bonding Materials Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications. Brewer Science

SK chief meets Nvidia CEO in U.S. to discuss HBM, AI cooperation SK Group Chairman Chey Tae-won met Nvidia CEO Jensen Huang in the U.S. to discuss HBM4 supply plans and broader AI collaboration, as SK hynix aims to retain about 70% share of Nvidia's next-generation memory market. Yonhap News Agency

Silicon Photonics In The Data Center: What A CMOS Exec Needs To Know Pluggable optics dominate scale-out data centers, but explosive growth looms as dense GPU scale-up networks shift from copper to fiber. Forecasts see optical components surging toward $25–31 billion by 2029–2030, driven largely by AI networking demand. Semiconductor Engineering

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Research Bits: Feb. 9 Researchers unveiled heat-powered silicon that computes using waste heat, real-time views into 2D semiconductor growth, and fiber-integrated circuits with 10,000 transistors, pushing energy-efficient computing and flexible electronics for wearables and medical devices. Semiconductor Engineering

Imec to Open R&D Center in Qatar Imec will open a new R&D hub in Qatar to attract global semiconductor talent constrained by Western visa rules. Backed by Invest Qatar and QRDI, the center will train researchers, advance AI-driven chip design, and support regional startups. EE Times

Sponsor Near Zero Footprint BGA264 Ironwood Electronics introduces near device size footprint test socket incorporating high performance GT elastomer. Ironwood Electronics

Chinese chip designer Montage Technology soars over 60% in Hong Kong debut Montage Technology shares jumped over 60% in their Hong Kong debut after a $902 million IPO, highlighting strong investor appetite for Chinese AI chips as Beijing pushes semiconductor self-sufficiency amid intensifying domestic and global competition. CNBC

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