May 16, 2025

Die-to-die Interconnect Standards In Flux UCIe 2.0 raised concerns for being overly complex, but many of its new features are optional and tailored for future chiplet marketplaces. While most current designs are captive and don't need full interoperability, flexibility remains a key strength. Semiconductor Engineering

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

TSMC to Build 9 Facilities in 2025, Sub-2nm Production Set for Taichung by 2028 TSMC is aggressively expanding with plans to build nine new sites in 2025, including eight fabs and an advanced packaging plant. The company is ramping 2nm production, growing 3nm output, and scaling packaging for AI and HPC demand. Trend Force

Large Area Sintering (Half-Bridge Modules) in Power Electronics Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics where efficiency and reliability are essential. Technical Paper

Sponsor TrueFlat by BTU: Ensuring Consistent Flatness in Every Reflow Cycle. BTU presents the Pyramax TrueFlat reflow oven. Say goodbye to substrate warpage and hello to reliable, repeatable flatness. Discover the TrueFlat advantage now! BTU International

Vietnam's Semiconductor Packaging & Testing Industry Picks up Steam Vietnam aims to build 100 chip design firms and one semiconductor plant by 2030, scaling to 300 firms and three plants by 2050. Major investments from CT Semiconductor, Amkor, Samsung, and Intel are fueling this ambitious growth. Trend Force

Cerebras CEO says chipmaker's 'aspiration' is to hold IPO in 2025 Cerebras CEO Andrew Feldman aims to take the AI chipmaker public in 2025, following U.S. approval to sell shares to UAE-based Group 42. With strong sales and new tech announcements, Cerebras positions itself against Nvidia in a rebounding IPO market. CNBC

Sponsor Achieve Precision in WLCSP Bumping Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts. PacTech

Technical Papers How Precision Motion Systems are Shaping the Future of Semiconductor Manufacturing Reducing CTE Mismatch Defects in Flip Chip Reflow Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components In situ hydrogen plasmas — A New Paradigm for Advanced Packaging Multi-Sensor Metrology for the most challenging Advanced Packaging Applications MORE TECHNICAL PAPERS

Sponsor The Global Leader in Warpage Metrology Solutions We manufacture, sell, & provide Thermal and Room Temperature Warpage System Solutions, and Testing Services for Warpage and Strain. Akrometrix

Canada's Chip Industry Charts Best Path to Growth At the CHIPS NORTH Summit, industry leaders urged Canada to define a long-term semiconductor strategy. While large-scale fabs seem unlikely, experts see opportunity in design, talent retention & targeted investment to boost homegrown innovation & global competitiveness. EE Times

What to Look Out for When Acquiring AI Systems The IEEE has finalized draft standard IEEE 3119-2025 to guide government procurement of high-risk AI systems. It offers a risk-based, operational framework to ensure responsible purchasing, adding a key step—solicitation preparation—based on EU feedback. IEEE Spectrum

Sponsor The Role of Solder in Advanced Semiconductor Packaging See how solder products drive innovation in packaging technologies, highlighting the growing integration of ASP and SMT processes. AIM Solder

TSMC outlines work on nine new advanced factories TSMC plans to build nine new fabs in 2025—including eight wafer plants and one advanced packaging facility—to meet surging AI and HPC chip demand. The company is expanding in Taiwan, the U.S., and Japan while ramping CoWoS capacity. Taipei Times

Apple's China shift begins with Foxconn's $433M chip deal in India Foxconn and HCL received Indian government approval to build a ₹37.06 billion ($433M) semiconductor plant in Uttar Pradesh. Operational by 2027, the facility will produce display driver chips, as Apple shifts manufacturing from China to India. CNBC

Sponsor OntosIS Atmospheric Plasma System The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices. Ontos Equipment Systems

Development Flows For Chiplets Chiplets promise a revolution in semiconductor design, but fragmented standards and ecosystem immaturity stall progress. Experts stress the need for unified models, cross-vendor collaboration & trusted frameworks to truly unlock scalable, interoperable 3D-IC & chiplet-based architectures. Semiconductor Engineering

AI Accelerators Moving Out From Data Centers AI's data surge is pushing chipmakers to move beyond traditional planar SoCs. In a recent panel, industry leaders emphasized the growing need for advanced compute architectures and highlighted chiplets as a key solution to meet AI demands. Semiconductor Engineering

Sponsor Explore Reliable Solutions for WLP & PLP For wafer- and panel-level packaging, you can rely on Nordson Electronics Solutions: fluid dispensing, plasma cleaning & more. Discover your solutions. Nordson Electronics Solutions

US smartphone shipments jumped 30% in March on tariff anticipation, analysts say Smartphone shipments to the U.S. surged 30% in March as Apple, Samsung, and Motorola rushed to beat looming tariffs. Apple airlifted $2 billion in iPhones from India, highlighting a sharp supply chain pivot away from China. South China Morning Post

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology