June 4, 2026

Photonics: A Foundational Scaling Layer for AI-Era Computing Photonics is becoming a foundational scaling layer for AI-era computing, moving data across chips, racks, and data centers with lower latency and power. It enables memory pooling, faster interconnects, and optical computing to overcome limits of traditional electronic infrastructure. EE Times

Sponsor SQ7000+TM Multi-Function for 3D AOI, SPI & CMM The SQ7000+ with MRS® sensor technology delivers high-resolution, high-speed inspection and metrology, uniquely combining AOI, SPI, and CMM in one in-line system. Nordson Test & Inspection

How Intel Foundry Packaging Technologies Redefine AI and HPC Scalability Limits Intel Foundry is pushing AI and HPC scaling with EMIB-T chiplet packaging, co-packaged optics, and future glass substrates. The technologies boost bandwidth, power efficiency, and system size while delivering near-monolithic performance for data centers. 3DInCites

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Cleaning Silicone and Hydrocarbon Residue Using Atmospheric Plasma Residue from dicing tape and silicone trays can hinder chip bonding. ONTOS effectively cleans surfaces before bonding. Read more. Ontos

Nvidia's big laptop bet hinges on frugal chips Nvidia unveils RTX Spark superchip for Windows PCs, combining CPU and GPU on Arm-based design. It partners with Lenovo, HP and Dell to target AI-ready laptops, diversifying beyond data centers while raising questions over performance and battery life. Taipei Times

Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs Samsung Foundry advances talks with BYD and other Chinese automakers to produce autonomous driving SoCs on 2nm and 4nm nodes, as SMIC capacity and technology gaps push firms toward advanced foreign fabs for next-gen AI chips. production shifts. TrendForce

Sponsor Amkor's Double Sided Molded BGA Solutions To improve the integration of RFFE solutions, Amkor offers a DSMBGA package that allows molded assembly of components on both sides of the substrate. Amkor Technology, Inc.

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor 1 of 10 Applications: RFID Swiss made Tresky die bonders provide hassle-free bonding of flip chip circuits to flexible antenna substrates with highest flexibility and operator training within minutes. Dr. Tresky AG

InchFab Sells $10M Mini Fabs to Democratize Chipmaking InchFab sells $10 million mini fabs to companies like Roche and universities, enabling production of 10,000 4-inch wafers monthly within six months. The startup offers low-cost, high-mix manufacturing and rapid prototyping, challenging billion-dollar chip fabs for niche applications. EE Times

Hidden beneath AI chips, Chinese-made circuit boards raise national security concerns in U.S. U.S. officials warn China-dominated printed circuit boards, vital for AI hardware, pose security risks and supply shortages. Defense agencies push domestic sourcing as prices surge, while firms like TTM expand capacity to meet booming AI and military demand. CNBC

Sponsor Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT) AI Technology pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding. We now have extended our adhesive line. See more AI Technology, Inc.

Nvidia ships TSMC-backed CPO switches to tackle AI data center bottlenecks Nvidia has begun shipping next-generation copackaged optics (CPO) Spectrum-X switches developed with TSMC to select partners, boosting AI data center bandwidth and energy efficiency. The system delivers up to 400 Tbps and aims to expand production later this year. Taipei Times

ASE ranks No. 1 in pay to employees ASE Technology led Taiwan Stock Exchange-listed firms in average employee pay last year at NT$6.28 million, while TSMC ranked seventh at NT$4.09 million. Semiconductor companies raised wages strongly, driven by AI demand, according to TWSE data. Taipei Times

Sponsor A study about 3D stacking of passive SMD elements This study demonstrates laser assisted bonding (LAB) of SMD Tantal Elko and MLCC capacitors and presents a comparison to conventional bonding using solder paste and reflow oven. PacTech

Delta outlines HVDC shipment plans Delta Electronics will start small-volume shipments of its 800V HVDC architecture to Nvidia next quarter as verification progresses, targeting AI data centers first. The firm also advances 400V systems and expands liquid-cooling capacity amid surging AI infrastructure demand. Taipei Times

LPDDR6 Roadmap Leads to the Data Center JEDEC advances LPDDR6 to meet AI data center demand, adding x6 interfaces, higher-density up to 512GB, SOCAMM2 modules, and processing-in-memory features. The update boosts capacity and efficiency while cutting power use and data movement bottlenecks. EE Times

Sponsor Die Bonding Made Easy The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO. DL Technology

1 Megawatt Racks In Data Centers The rising performance demands of AI data centers are driving sharp increases in power consumption as racks integrate SoCs with advanced packaging, high-speed interfaces and optical links, while new 3D-IC, 3.5D and tiered memory architectures enable faster training & inference. Semiconductor Engineering

Sponsor A Safer Approach to Underfilled BGA Removal Traditional heat-based removal methods can damage circuit boards and compromise reliability. Learn how cold precision milling helps eliminate risks. Circuit Technology Center