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Interested in a demonstration?
We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day.
Surfx Technologies
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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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What Year Was It?
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Wimbledon Tournament Begins
The All England Croquet and Lawn Tennis Club begins its first lawn tennis tournament at Wimbledon, then an outer-suburb of London.
See the answer below.
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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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What Year Was It Answer
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Wimbledon Tournament Begins Answer: July 9, 1877
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July 10, 2026
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SK hynix to raise 40 tln won through Nasdaq ADR listing
SK hynix will raise US$26.5 billion through a Nasdaq ADR listing, creating the largest U.S. equity debut by a foreign company. The chipmaker will invest the proceeds in new semiconductor manufacturing, advanced packaging and EUV equipment while strengthening its global valuation.
Yonhap News Agency
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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Soaring server DRAM prices to moderate: report
TrendForce expects server DRAM price increases to slow to 13–18 percent this quarter as major US cloud providers secure long-term supply deals. Persistent supply shortages, rising server demand and tighter RDIMM availability will continue supporting memory prices through next year.
Taipei Times
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Why China is finally letting AI firms buy the Nvidia H200
China plans to let selected firms, including Alibaba, buy limited Nvidia H200 AI chips, while preserving its self-sufficiency strategy. The controlled approvals balance immediate computing needs with long-term domestic chip development and strict government oversight.
South China Morning Post
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How to Tweezer Pull
Learn how to perform an optimal Pull/Peel test using Tweezers. This guide covers test method settings and failures modes for Tweezer Pull/Peel testing. Download it now.
xyztec
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Cu Pillar Flip Chip Cleaning
Evaluating appropriate chemistries to remove WS Flux residues and refining cleaning processes can meet challenges associated with producing Cu Pillar flip chips to improve reliability.
KYZEN
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As AI Moves from Training to Inference, Optics Moves Closer to the Chip
As AI inference workloads grow, connectivity—not compute—emerges as a key bottleneck. Imec advocates moving optics closer to processors through 2.5D and eventually 3D optical I/O, cutting power, reducing latency, and enabling scalable, high-bandwidth AI systems for future demands.
EE Times
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The Expansion Of LPDDR Into Edge AI Platforms
As AI shifts from cloud data centers to edge devices and vehicles, LPDDR memory is becoming essential by delivering efficient bandwidth, low power consumption, and compact integration. Its performance-per-watt enables real-time AI inference while meeting reliability requirements.
Semiconductor Engineering
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AI Is Rewriting The IP Playbook
AI is reshaping semiconductor IP development by speeding design, verification, customization, and lifecycle management. While it automates coding, testing, and debugging, engineers remain vital to ensure quality, reliability, and AI-ready IP.
Semiconductor Engineering
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Where Does Quantum Computing Stand?
Quantum computing is advancing as researchers and startups improve hardware, algorithms and error correction. Early commercial systems will complement classical computers as specialized accelerators, driving breakthroughs in defense, networking and sensing.
Semiconductor Engineering
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Automotive chips need materials that DO NOT fail
We asked semiconductor specialists what defines the future of automotive packaging. Reliability, thermal management, and sustainability topped the list. Free Research Report.
Henkel AG & Co.
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An AI Model Fit For Purpose
AI is reshaping semiconductor design by accelerating model creation & verification, but engineers must validate AI-generated models with trusted data, clear metadata, and human oversight to ensure accuracy, reliability, and safe deployment in increasingly complex chip design workflows.
Semiconductor Engineering
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Wall Street Is Misreading the AI Chip Selloff
Wall Street wiped more than $1 trillion from semiconductor valuations over AI spending concerns, but industry indicators tell a different story. Rapid HBM shipment growth and expanding AI infrastructure investments suggest demand remains strong, challenging the market's narrative.
Dr. Robert Castellano Semiconductor Deep Dive Newsletter
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Worker shortage endangers US chip production plans
A nationwide shortage of skilled workers could delay US semiconductor projects and limit future chip production, with a projected deficit of up to 157,000 workers by 2030. Industry leaders urge continued government funding, workforce training and stronger education pipelines to meet growing demand.
Taipei Times
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Wafer Processing Adhesives & Solution
Thin semiconductor chips are common. Backgrinding & thinning process is considered separate, the ability to com-bine wafer backgrinding-thinning & back-side active buildup improves throughput.
AI Technology, Inc.
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| Today's Sponsor |
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High power atmospheric plasma system
Our 1000 Atmospheric Plasma System is available with PC or PLC control for lab or high speed production use with the same high powered systems. Remove contaminants and increase bond strength!
Plasma Etch
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Test Your Knowledge
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What type of steel did Englishman Harry Brearley invent in 1913?
See answer below.
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Quote of the Day
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Everyone wants to ride with you in the limo, but what you want is someone who will take the bus with you when the limo breaks down." Oprah Winfrey
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Temporary Bonding Materials
Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications.
Brewer Science
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| Cartoon of the Day
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"I am a traveler from the future. I came back to tell you how happy you'll be that you decided to hire me today!"
Copyright © Randy Glasbergen
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Contamination Control
Balazs provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
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Test Your Knowledge Answer
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What type of steel did Englishman Harry Brearley invent in 1913? Answer: Stainless
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