semiconductor
packaging news
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Press
Non-Frozen, Silver Filled Epoxy Features High Thermal and Electrical Conductivity
Master Bond
New ZEISS Crossbeam 750 FIB-SEM for high-accuracy sample preparation workflows
ZEISS
Smoltek's CNF-MIM capacitors show stable performance in extended life test
Smoltek
Power management optimized ICs for STM32 microprocessors in industrial applications
STMicroelectronics
ZEISS launches new microscopy training program featuring VR technology
ZEISS
IC-Link now also offers silicon nitride (SiN) manufacturing services through imec's mature platform
imec
Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption
Agileo Automation
Advanced SEMI Inspection and Metrology Solutions at SEMICON SEA 2026
Test Research, Inc.
MORE INDUSTRY PRESS
Sponsor
Ontos-Equipment-Systems

OntosIS Atmospheric Plasma System
The ONTOS Plasma Head is available for integration into third party equipment. The Plasma Curtain is available in several widths to enable optimization of the gas consumption on smaller devices.
Ontos Equipment Systems
Advanced-Component-Labs
What Year Was It?
April Fools Tradition Popularized
What Year
English pranksters begin popularizing the annual tradition of April Fools' Day by playing practical jokes on each other.
See the answer below.
Brewer-Science
Sponsor
Master-Bond

Chemically Resistant, UV Curable Epoxy
Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating.
Master Bond
Pac-Tech
Sponsor
Circuit-Technology-Center

Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center
What Year Was It Answer
April Fools Tradition Popularized
Answer: April 1, 1563
March 31, 2026
image
The Global Semiconductor Talent Shortage
The semiconductor industry will need over one million skilled workers by 2030, forcing companies to rethink talent strategies. Firms must build new talent pipelines, partner with institutions, and adopt innovative recruitment and development approaches to meet evolving workforce demands.
Deloitte
Sponsor
XYZTEC

Number 1 in bond testers
Sigma is the best bond tester the market has to offer. It comes with game-changing automation capabilities for operator-free loading, testing, and analyzing. Learn more.
xyztec
Chipmakers race to secure helium as tensions disrupt supply, prices reportedly up 50%
Semiconductor manufacturers race to secure critical materials as Middle East tensions disrupt supply chains, prioritizing uninterrupted production despite rising costs. Swift moves to prevent shutdowns expose fragility in global chipmaking and intensify competition for scarce resources.
Digitimes
Peer viewpoint: semiconductor innovation for telecommunication networks
Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure.
Technical Paper
Sponsor
Nordson-ASYMTEK

Large Capacity Plasma Treatment System - FlexTRAK-SHS
9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging.
Nordson Electronics Solutions
TeraFab: What If It Is Done Differently?
Elon Musk unveiled TeraFab, an AI-driven semiconductor complex designed to overhaul chipmaking with deep automation and vertical integration. Experts question feasibility, but success could upend fab economics and scaling, while failure would affirm industry limits.
EE Times
MIT researchers use AI to uncover atomic defects in materials
MIT researchers developed an AI model that uses neutron-scattering data to noninvasively detect and quantify up to six types of atomic defects in materials simultaneously, enabling more precise control of properties in semiconductors, electronics, and energy technologies.
MIT News
Sponsor
Amkor-Technology

LAB Flip Chip Reflow Process Robustness Prediction
Predicting laser-assisted bonding (LAB) parameters and ideal solder temperature range for a black box substrate. Read more.
Amkor Technology, Inc.
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
MicroCircuit-Laboratories-LLC

Seam Seal Hermetic Packages with Auer Carriers and 3D Trays
MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing.
MicroCircuit Laboratories, LLC
Samsung-backed AI chip firm Rebellions raises $400 million ahead of IPO
Rebellions raised $400 million at a $2.34 billion valuation to expand into the U.S. and pursue an IPO. The startup targets major AI labs with energy-efficient inference chips, while navigating tight memory supply amid rising competition in AI semiconductor markets.
CNBC
NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
NIST researchers introduced a durable packaging method for photonic chips using hydroxide catalysis bonding, eliminating adhesive weaknesses. The advance enables high-speed, energy-efficient photonics to perform reliably in space, quantum, and harsh industrial settings.
NIST
Sponsor
MRSI

Elevate Efficiency: MRSI-H1 Die Bonder
Transform your assembly with precision and speed. Discover unparalleled quality and efficiency.
MRSI
Quantum technology firms race to market as the industry sees 'inflection point'
Quantum firms push ahead with public listings despite market volatility, using SPAC deals to fund commercialization. Players like Xanadu and Horizon ride rising investor interest as advances in qubits and error correction accelerate progress toward practical quantum advantage.
CNBC
Europe's Semiconductor Strategy Meets Market Reality
Europe reframes semiconductors as strategic assets, pairing subsidies with global integration. Yet China's mature-node surge and soft demand threaten price pressure, challenging whether Europe can sustain its chip ambitions commercially.
EE Times
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Challenges In Scaling Chips To 2nm And Below
Designing 2nm chips forces tough tradeoffs as nanoscale variability, rising complexity, and heat strain performance and reliability. Firms deploy custom architectures, chiplets, and advanced packaging, but high costs and integration hurdles demand tight optimization.
Semiconductor Engineering
All Software Is Hardware-Dependent
The author credits mentors and hands-on work for lessons in portability, data alignment, and memory performance. By standardizing routines and optimizing memory, teams cut bugs, boosted speed, and reinforced the need for hardware-aware software design.
Semiconductor Engineering
Sponsor
CyberOptics

New Quadra Pro Manual X-Ray System
Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more.
Nordson TEST & INSPECTION
Chip prices set to rise again amid supply shortage and higher oil costs
DRAM contract prices are set to surge up to 95%, led by AI-driven DDR5 demand and tight supply. Rising oil prices add cost pressures, strengthening suppliers' pricing power and signaling sustained memory price increases into the second half.
Digital Today
Sponsor
Surfx-Technologies

Interested in a demonstration?
We want to prove to you that surface preparation with Surfx argon plasmas results in a superior bond. Submit a request and our staff will respond within the next business day.
Surfx Technologies
Today's Sponsor
StratEdge-Corporation
Sponsor
StratEdge-Corporation

Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
Test Your Knowledge
What science fiction writer played a part in the development of radar?
See answer below.
Balazs-Nanoanalysis
Quote of the Day
"Give your dreams all you've got and you'll be amazed at the energy that comes out of you."
William James
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Industry Calendar
Mar 31, 2026
MEMS & Sensors Executive Congress—MSEC
SEMI
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
FULL INDUSTRY CALENDAR
Henkel-AG-Co
Cartoon of the Day
Cartoon
"So what makes you think a bubbly personality would be an asset to this company?"
Copyright © Randy Glasbergen
Sponsor
Tresky

Sintering Bonding Process
During the sintering process, the chip is bonded very well to the substrate by means of silver paste. The silver particles are connected to one another by diffusion processes.
Tresky Automation
SEMI
Test Your Knowledge Answer
What science fiction writer played a part in the development of radar?
Answer: Arthur C. Clarke who during the Second World War from 1941 to 1946 served in the Royal Air Force as a radar specialist and was involved in the early-warning radar defence system. He is famous for being co-writer of the screenplay for the 1968 film 2001: A Space Odyssey.