June 24, 2026

The EU Wants Its Own Tech Supply Chain EU launches Tech Sovereignty Package to cut reliance on US tech, boosting semiconductor production and cloud capacity. It pushes Chips Act 2.0 and AI cloud law, aims to expand data centers and encourage buying European amid data security concerns. IEEE Spectrum

Sponsor Dicing Die-Attach Film (DDAF) or Dicing Die-Attach Tape (DDAT) AI Technology pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding. We now have extended our adhesive line. See more AI Technology, Inc.

CEA-Leti CEO: AI's Real Bottleneck Is Architecture CEA-Leti CEO Sébastien Dauvé says AI's next phase is limited less by compute and more by architectural integration of memory and communications. He urges system-level co-design to address energy constraints and enable edge "physical AI" & European semiconductor ecosystems. EE Times

Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially. Technical Paper

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

TSMC and Intel Race to Replace Organic Substrates With Glass & Panel-Level Packaging, as a $650M Market Expected To Balloon Past $8 Billion by 2030 Fan-out panel-level packaging and glass substrates will drive next-generation semiconductor packaging, with the market surpassing $8 billion by 2030. Strong AI and HPC demand pushes TSMC, Intel & others to adopt higher-density, lower-cost, high-performance packaging solutions. wccftech

SK hynix Reported Design Hiring Surge Tightens Chip Talent Market, Raises Samsung Concerns SK hynix is ramping up its AI-era talent push, launching a rare triple-digit hiring drive for design engineers and dropping degree requirements. The move strengthens HBM and advanced memory development but risks intensifying Korea's chip talent shortage and pressure on rivals. TrendForce

Sponsor 1 of 10 Applications: Hybrid Bonding Maximum flexibility is the hallmark of Swiss made die bonders from Tresky. To apply adhesive before bonding, dispensing and stamping systems are available, as are flux systems. Dr. Tresky AG

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Non-Contact Solder Jetting for Precision SB²® eliminates mechanical placement force, enabling stable solder balling for MEMS, fine-pitch, and advanced packaging applications. Explore the process. PacTech

Memory Giants Split on HBM4 Strategy: Samsung HBM4 Sales Reportedly Tops $1B, SK hynix Slows Ramp Samsung's HBM4 surpassed $1 billion in revenue just four months after mass production began, with sales projected above $1.2 billion by June. As Samsung boosts HBM4 shipments, SK hynix is slowing its ramp, shifting focus to higher-margin DRAM markets and delaying volume growth. TrendForce

SNUG India 2026: Synopsys Unveils First Multiphysics Fusion Tools Since Ansys Deal Synopsys unveiled its first Multiphysics Fusion tools following the Ansys acquisition, combining EDA and physics analysis to unify timing signoff, design closure, and multi-die workflows while reducing iterations, margins & development complexity in advanced semiconductor systems. EE Times

Sponsor Advanced Packaging: Flexible Die Bonder Featuring a large, versatile working area, the MRSI-705 die bonder handles many input and output types, including 300mm wafers. MRSI

PCB industry posts record Q1 production value with rosy outlook Taiwan's PCB industry surged 19.6% year-on-year to a record NT$245.6 billion in Q1, driven by AI server demand and high-end boards, and it forecasts continued growth, though supply constraints, rising costs and geopolitical risks threaten momentum. Taipei Times

The brothers of Himax: from obscurity to billions Wu Biing-seng and Jordan Wu built Himax Technologies into a global leader in display driver chips, powering cars and devices. Their early bet on automotive screens drove growth, billion-dollar wealth, and expansion into AI and advanced chip technologies. Taipei Times

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

How Spain Built a Quantum Ecosystem Without Calling It One Spain has rapidly built a leading quantum ecosystem in Europe through coordinated public investment research and industry. It now operates diverse quantum systems across multiple regions and launches a €808 million strategy to advance computing communications and sensing. EE Times

How Top Semiconductor Firms Are Transforming The Future Of 3D IC Technology 3D IC market grows rapidly as semiconductor firms adopt advanced packaging to boost AI, HPC, and 5G performance. Technologies like TSVs, chiplets, and hybrid bonding overcome planar limits, driving expansion toward $66.06B by 2035 at strong double-digit CAGR. S&S Insider

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

New USB Standards: Benefits And Incompatibilities Cadence Design Systems' David Shin explains how conflicting USB standards create compatibility issues. He highlights where mismatches occur, why multiple versions are hard to control, and how ongoing fragmentation continues to drive confusion across devices and system integration. Semiconductor Engineering

Sponsor EZ-FLO High Precision Dispense Tips Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more. DL Technology