February 3, 2026

Chiplet Fundamentals For Engineers: eBook Leading-edge chipmakers are advancing Moore's Law with multi-die assemblies, boosting performance and flexibility by breaking SoCs into chiplets. While yields improve and reticle limits vanish, integrating proprietary parts poses complex design and interoperability challenges. Semiconductor Engineering

Sponsor Hermetic Package Automation with HDHS® Technology Enables Seam Sealing with industry standard tooling including Auer carriers and custom carriers including non-standard square trays. Rapid switchover from one carrier tooling to the next is a PC program change. MicroCircuit Laboratories, LLC

VIEWPOINT 2026: Doug Dixon, CEO, 360 BC Group Inc. For 2026, we see semiconductor packaging entering its most transformative phase yet, driven by unprecedented demands from AI, high-density power electronics, heterogeneous integration, and the shift toward ultra-high-performance system architectures. As a technical marketing and content development ... 360 BC Group Inc.

Revolutionizing IC Packaging with High-Density RDL Technology Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability. Technical Paper

Sponsor Die-Module Attach for High Power Devices High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding. AI Technology, Inc.

Thermal Advances Driving Next-Gen AI Chip Design Rising AI power demands and 3D chip stacking are pushing thermal limits, creating extreme hotspots. As GPUs near kilowatt-class loads, designers turn to microfluidic, two-phase cooling and hierarchical thermal modeling to enable reliable next-generation wafer-scale systems. EE Times

TSMC 2nm Reportedly Tight Amid Mobile, HPC Demand; NVIDIA May Be First to Adopt 1.6nm in 2028 NVIDIA CEO Jensen Huang told suppliers TSMC must run flat out as 2nm capacity sells out. Apple leads bookings, with AMD, Google and AWS lining up. AI, GPUs and advanced packaging strain supply as N2 ramps toward 2026 amid AI and mobile demand. TrendForce

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Technical Papers Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG MORE TECHNICAL PAPERS

Sponsor BGA Component Rework Simplified When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs. Circuit Technology Center

India Budget 2026-2027: Semiconductors, Manufacturing, and Tax Reforms India's FY2026–27 budget shifts semiconductor policy from fab subsidies to ecosystem building under ISM 2.0. Electronics incentives rise as support expands to equipment, materials and IP, while tax and infrastructure reforms target global players, though details remain unclear. EE Times

Don't Regulate AI Models. Regulate AI Use Global AI regulation is evolving rapidly. Experts argue the U.S. should focus on regulating AI use, not models, enforcing rules at deployment points, monetization channels, and high-risk applications to ensure safety, accountability, and constitutional durability. IEEE Spectrum

Sponsor High-volume Manufacturing The STA-10iL automated plasma system enhances substrate bonding. It features in-line conveyance for high-speed production, with an optional drawer for flexible, high mix operations. Surfx Technologies

Nvidia shares are down after a report that its OpenAI investment stalled. Here's what's happening Nvidia shares dropped 1.1% after reports suggested uncertainty around its planned $100 billion investment in OpenAI. CEO Jensen Huang clarified the deal isn't finalized but reaffirmed a massive investment, stressing confidence in OpenAI's work and leadership. CNBC

HiPEAC 2026: Bridging AI Speed and Silicon Reality At HiPEAC 2026, Professor Deming Chen urged co-design of AI algorithms and hardware, showing how SkyNet, Medusa, and SnapKV optimize speed, energy, and memory. This approach tackles inefficiencies in current large model development and accelerates sustainable AI computing. EE Times

Sponsor Is copper sintering the future of WBG semiconductors? Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology. Henkel AG & Co.

The Verification Conundrum The verification industry overcomplicates coverage by obsessing over cross-checks, ignoring the concept of unique hardware. Focusing on path coverage instead can identify truly unique code, reduce redundant tests & streamline design verification without exhaustive, impractical checks. Semiconductor Engineering

Solving Real-World AI Bottlenecks AI chip designers hit data bottlenecks as SoCs juggle massive workloads across autonomous vehicles, edge devices, and hyperscale data centers. Arteris' CodaCache optimizes on-chip memory and caches to curb data starvation and boost performance. Semiconductor Engineering

Sponsor UV DIE Bonding Special Technology Liquid adhesive is cured using ultraviolet (UV) light. In contrast to epoxy, the UV adhesive remains in the liquid state until it is exposed to high-energy UV radiation with UV DIE Bonding technology. Tresky Automation

Intel's Foundry Ambitions: A Potential Lifeline from Apple and Nvidia Apple's chip shortages are pushing the industry toward Intel. The company may produce Mac M-series components by 2027 and Nvidia I/O dies by 2028, though iPhones face thermal limits. Intel's PowerVia tech and new lithography systems aim to expand its foundry role. AD HOC News

Sponsor Die-on-Tab for Compound Semiconductors This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now. StratEdge Corporation