August 18, 2026

Cheap Chinese AI tokens collide with deepening Sino-US bloc split Chinese AI firms appear cheaper on token prices, but analysts say enterprises often pay more because their models require additional tokens to complete tasks. Meanwhile, US-led and China-led AI alliances are deepening geopolitical divisions, pressuring countries to choose sides. Asia Times

Sponsor High Force and Large area bond tester The most powerful bond tester to test IGBTs, power modules and large batteries up to 1000 kgf. Sigma HF/L offers flexible positioning and operates with the fastest axis speed. Learn more. xyztec

Nvidia Bets on the Classical Side of Quantum Computing Nvidia is advancing hybrid quantum computing by supplying the classical infrastructure surrounding quantum processors. Its GPUs, software, interconnects, and control systems help simulate circuits, process data, correct errors, and integrate quantum systems with AI supercomputers. EE Times

Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Technical Paper

Sponsor Non-Contact Solder Jetting for Precision SB²® eliminates mechanical placement force, enabling stable solder balling for MEMS, fine-pitch, and advanced packaging applications. Explore the process. PacTech

Fluid-Side Observability Expands AI Hardware Reliability AI infrastructure reliability increasingly depends on liquid-cooling observability, not temperature alone. Engineers must correlate thermal, hydraulic, fluid-condition, and workload data to detect declining cooling margins early and compare performance against established commissioning baselines. EE Times

800VDC Pushes AI Power Design From Grid To Gate AI data centers are driving a shift toward 800VDC architectures as rising power demands make traditional 48V systems inefficient. Engineers are reducing conversion stages, heat and losses while upgrading safety systems and components to support megawatt-scale computing. Semiconductor Engineering

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

Technical Papers 5X Faster Die Sorting Accelerates U.S. Semiconductor Manufacturing A New Optical Ball Grid Array Package Development for Automotive Optical Sensor Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems MORE TECHNICAL PAPERS

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

Precision Under Pressure: Rethinking Bond Reliability In High-Density Semiconductor Test As semiconductor devices shrink and packaging grows more complex, interconnect integrity has become critical to performance and longevity. Advanced bond testing measures bond strength, detects weaknesses early, and helps manufacturers improve reliability for demanding automotive, aerospace, industrial, and consumer applications. Semiconductor Engineering

AI chipmaker Biren projects up to 22-fold revenue surge amid China’s hi-tech boom Chinese AI chipmaker Biren Technology expects first-half 2026 revenue to soar up to 2,107% year over year, driven by strong GPU demand and accelerating commercialisation. Its forecast reflects broader growth among domestic chipmakers, though intensifying competition could pressure margins. South China Morning Post

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Intel at a Memory Crossroads, Again Intel is exploring new memory architectures as AI reshapes demand and shortages persist. CEO Lip-Bu Tan has highlighted stacked DRAM and advanced packaging, while initiatives such as XBM and ZAM could revive Intel’s memory ambitions. EE Times

Chip Industry Week In Review AI infrastructure is evolving as smaller models cut compute needs, while optical interconnects, chiplets and advanced cooling enable larger systems. Companies are pouring billions into chips, packaging, quantum computing and workforce development. Semiconductor Engineering

Sponsor S-SWIFT™: Fan-Out. Substrate. Unified. Amkor's new S-SWIFT™ enables high-performance, cost-effective integration of multiple chiplets and memory. Amkor Technology

Semiconductor Equipment Shifts To Build-to-Print Manufacturing Semiconductor fabs are pushing equipment demand beyond OEM capacity, making build-to-print partners vital. Contract manufacturers help OEMs scale, preserve capital and design control, and support global fab expansion without costly new facilities. EE Times

China's Top Two Foundries Hit Capacity Crunch: What's Next for SMIC and Hua Hong's Expansion Plans? SMIC and Hua Hong are running near capacity as AI-driven demand boosts orders for mature-node chips. SMIC targets 95% utilization and may add equipment, while Hua Hong expands capacity through new projects and an acquisition. TrendForce

Sponsor Two Component, Thermally Conductive Epoxy Master Bond EP21AOLV-1 is a thermally conductive, electrically isolating adhesive featuring a low CTE, excellent dimensional stability, and high compressive strength. Master Bond

Common Earth Project Aims to End Chip Supply Chain Bottlenecks University of Michigan researchers and Imec are launching "Common Earth" to strengthen semiconductor supply chains. The project targets alternatives to scarce materials and PFAS chemicals, reducing geopolitical, environmental and social risks to chip production. IEEE Spectrum

Sponsor Micro Dispensing Technology White Paper The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. DL Technology