semiconductor
packaging news
Sponsor
Tresky

Ultrasonic Bonding: Cohesive connection between a chip & substrate
Electrically conductive and mechanical bonds for temp-sensitive components or components that are difficult to heat with Ultrasonic Bonding.
Tresky Automation
Industry Press
Smoltek's CNF-MIM capacitors show stable performance in extended life test
Smoltek
Power management optimized ICs for STM32 microprocessors in industrial applications
STMicroelectronics
ZEISS launches new microscopy training program featuring VR technology
ZEISS
IC-Link now also offers silicon nitride (SiN) manufacturing services through imec's mature platform
imec
Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption
Agileo Automation
Advanced SEMI Inspection and Metrology Solutions at SEMICON SEA 2026
Test Research, Inc.
BTU International to Highlight Advanced Reflow Solutions at SEMICON China 2026
BTU International
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
Fraunhofer IPMS
MORE INDUSTRY PRESS
Sponsor
SEMI

MEMS & Sensors Executive Conference—MSEC 2026
Register now for MSEC 2026, March 31-April 2, in Cambridge, MA offering insights into bio-medical, generative AI, navigation, sustainability, and more.
SEMI
CyberOptics
What Year Was It?
President Reagan Shot
What Year
President Ronald Reagan is shot in the chest outside a Washington, D.C., hotel by a deranged drifter named John Hinckley Jr.
See the answer below.
Ontos-Equipment-Systems
Sponsor
EV-Group

Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
Circuit-Technology-Center
Sponsor
Pac-Tech

High-Speed Mass Ball Transfer With Ultra-SB²®
Ultra-SB²® enables ultra-fast, precise mass solder ball transfer—ideal for advanced packaging and high-throughput semiconductor assembly. Explore Now.
PacTech
What Year Was It Answer
President Reagan Shot
Answer: March 30, 1981
March 31, 2026
TeraFab: What If It Is Done Differently?
Elon Musk unveiled TeraFab, an ambitious AI-driven semiconductor complex aiming to transform chip manufacturing through automation and vertical integration. While experts doubt its feasibility, success could radically reshape fab economics, compress yields, and redefine industry scaling; failure would reinforce current limits.
EE Times
Sponsor
MicroCircuit-Laboratories-LLC

Seam Seal Hermetic Packages with Auer Carriers and 3D Trays
MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing.
MicroCircuit Laboratories, LLC
MIT researchers use AI to uncover atomic defects in materials
MIT researchers developed an AI model that uses neutron-scattering data to noninvasively detect and quantify up to six types of atomic defects in materials simultaneously, enabling more precise control of properties in semiconductors, electronics, and energy technologies.
MIT News
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Technical Paper
Sponsor
Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
Samsung-backed AI chip firm Rebellions raises $400 million ahead of IPO
Rebellions raised $400 million at a $2.34 billion valuation to expand into the U.S. and pursue an IPO. The startup targets major AI labs with energy-efficient inference chips, while navigating tight memory supply amid rising competition in AI semiconductor markets.
CNBC
NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
NIST researchers developed a robust packaging method for photonic chips using hydroxide catalysis bonding, enabling reliable performance in extreme conditions. The breakthrough overcomes adhesive limitations, allowing high-speed, energy-efficient photonics to operate in space, quantum systems, and harsh industrial environments.
NIST
Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
AI-Technology-Inc

Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.
Quantum technology firms race to market as the industry sees ‘inflection point’
Quantum firms are going public despite volatile markets, leveraging SPAC deals to fund commercialization after recent breakthroughs. Companies like Xanadu and Horizon aim to capitalize on growing investor interest, as advances in qubits and error correction push the industry toward practical quantum advantage.
CNBC
Europe’s Semiconductor Strategy Meets Market Reality
Europe is repositioning semiconductors as strategic assets, balancing de-risking with global integration. While subsidies boost supply, analysts warn that China’s mature-node expansion and weak local demand could pressure prices, testing whether Europe’s chip ambitions remain commercially sustainable.
EE Times
Sponsor
Balazs-Nanoanalysis

Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
Challenges In Scaling Chips To 2nm And Below
Designing 2nm chips forces new tradeoffs as extreme nanoscale variability, rising complexity, and thermal challenges impact performance and reliability. Companies adopt customized architectures, chiplets, and advanced packaging, while soaring costs and integration hurdles demand cross-disciplinary optimization to achieve efficient, scalable computing.
Semiconductor Engineering
All Software Is Hardware-Dependent
The author credits early mentors and hands-on experience for shaping key lessons in portability, data alignment, and memory performance. By standardizing core routines and optimizing memory use, teams reduced bugs and improved speed, underscoring the growing need for hardware-aware software design.
Semiconductor Engineering
Sponsor
kyzen

Does Water Do the Job on Its Own?
Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more.
KYZEN
Chipmakers race to secure helium as tensions disrupt supply, prices reportedly up 50%
Semiconductor manufacturers scramble to secure critical materials as Middle East tensions disrupt supply chains, prioritizing production continuity over rising costs. Companies act quickly to avoid shutdowns, highlighting growing vulnerability in global chip manufacturing and intensifying competition for scarce resources.
Digitimes
Chip prices set to rise again amid supply shortage and higher oil costs
DRAM contract prices are set to surge up to 95%, led by AI-driven DDR5 demand and tight supply. Rising oil prices add cost pressures, strengthening suppliers’ pricing power and signaling sustained memory price increases into the second half.
Digital Today
Sponsor
DL-Technology

Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology
The global semiconductor talent shortage
The semiconductor industry will need over one million skilled workers by 2030, forcing companies to rethink talent strategies. Firms must build new talent pipelines, partner with institutions, and adopt innovative recruitment and development approaches to meet evolving workforce demands.
Deloitte
Sponsor
Plasma-Etch

Plasma Etch PE-Avenger
The PE-Avenger is an ultra low-cost entry level plasma cleaning system allowing more labs to utilize plasma. It's a low frequency plasma cleaner designed for surface activation and organics removal.
Plasma Etch
Today's Sponsor
Akrometrix
Sponsor
Akrometrix

Real-Time Metrology Solutions
Our systems uses unique Shadow Moiré vision measurement technology for flat surfaces and uses add-on Digital Fringe Projection and Digital Image Correlation technologies.
Akrometrix
Test Your Knowledge
Name the chemical elements in The Periodic Table beginning with the letter "S".
See answer below.
Surfx-Technologies
Quote of the Day
"Problems worthy of attack prove their worth by fighting back."
Paul Erdos
Sponsor
Henkel-AG-Co

You can't spell brain without AI
Custom silicon is changing how AI works. But why, and how? Get a first-hand perspective from Vishal Kirti, Senior ASIC Leader at Cisco Systems. A new read on Uniquely Wired.
Henkel AG & Co.
Industry Calendar
Mar 31, 2026
MEMS & Sensors Executive Congress—MSEC
SEMI
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
FULL INDUSTRY CALENDAR
SEIKA-America
Cartoon of the Day
Cartoon
"If you pay your invoice on time, it will mess up our accounting system, so it's better if you keep paying late."
Copyright © Randy Glasbergen
Sponsor
ECTC

2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
Ormet-TLPS
Test Your Knowledge Answer
Name the chemical elements in The Periodic Table beginning with the letter "S".
Answer: Silver (Ag), sodium (Na), sulphur (S), silicon (Si), selenium (Se), scandium (Sc), samarium (Sm), strontium (Sr), Seaborgium (Sg)