March 18, 2026

Intel Ramps Up Advanced Packaging: Malaysia Complex Operational in 2026 Intel accelerates advanced packaging as EMIB gains traction for next-gen GPUs, with Malaysia operations nearing launch. The firm expands capacity, targets larger 2.5D packages with more HBM, and partners with Amkor, while tackling yield and scaling challenges. TrendForce

Sponsor IR Layer Release Technology for 3D Packaging and Logic Scaling Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling. EV Group

Memory chip crunch to persist until 2030, SK Group chairman says Chey Tae-won warned a global memory chip shortage may last up to five years, as SK Hynix, Samsung Electronics, and Micron Technology struggle to meet rising AI-driven demand and wafer supply constraints. Taipei Times

Package Assembly Design Kits: The Future of Advanced Package Design This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity. Technical Paper

Sponsor Packaging Solutions for Unique Markets The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets. Amkor Technology, Inc.

NVIDIA Rubin Ultra and Feynman Reportedly to Boost TSMC SoIC; Besi, Applied Materials, TEL to Benefit NVIDIA outlines Rubin Ultra for 2027 and Feynman for 2028, leaning on TSMC's SoIC stacking to boost density, bandwidth, and efficiency. The approach overcomes Moore's Law limits, drives major capex, and scales capacity as AI chip demand surges. TrendForce

World's First 6-Inch InP Photonic Chip Industrial Wafer Fab Broke Ground Indium phosphide gains momentum as Europe launches the first 6-inch photonic chip fab in Eindhoven, backed by major partners and funding. Rising 6G ambitions, especially in China, boost demand, intensifying global competition in high-speed optoelectronic semiconductor technologies. TrendForce

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor Die-to-Wafer Bonding Simplified Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications. Ontos Equipment Systems

Nvidia CEO Jensen Huang says OpenClaw is 'definitely the next ChatGPT' Jensen Huang highlighted OpenClaw as a transformative open-source AI agent platform that autonomously performs tasks beyond chatbots. Nvidia is advancing its adoption with NemoClaw, adding security, scalability & oversight to enable safe, real-world deployment. CNBC

Nvidia is restarting production of China AI chip variant, says CEO Jensen Huang Nvidia is restarting production of its H200 chip after securing US export licences and new orders, CEO Jensen Huang said. The move revives China sales but remains excluded from projected trillion-dollar revenues for Blackwell and Rubin AI chips. South China Morning Post

Sponsor BGA Component Rework Simplified When you're confronted with tough BGA rework, who do you turn to? Discover the #1 resource used by military contractors. We have solutions for all your BGA rework and repair needs. Circuit Technology Center

Jensen Huang says Nvidia has received orders from China and is 'restarting our manufacturing' Nvidia is restarting H200 chip production for China after securing approvals and receiving orders, CEO Jensen Huang said. Despite past export restrictions and delays, the company is reviving its supply chain while navigating ongoing U.S. licensing hurdles and limited revenue expectations. CNBC

How AI Will Automate Chip Design Cadence executive Ziyad Hanna explains how advancing generative & agentic AI is transforming chip design, outlining five autonomy levels, expanding engineers' capabilities for complex tasks, while introducing new challenges around traceability, explainability & trust in automated systems. Semiconductor Engineering

Sponsor Next-Generation Epoxy Dispenser Introducing our latest ultra-high-speed, flexible solution capable of multiple dispensing methods & materials. 10µm accuracy available with 175Ag+ model. MRSI

Research Bits: Mar. 17 Researchers from Massachusetts Institute of Technology, MITRE, and global partners developed advanced photonic chips that precisely emit light into free space, while separate breakthroughs in nanolasers and photonic AI promise faster, energy-efficient computing and sensing technologies. Semiconductor Engineering

SK Group chief seeks closer ties with Nvidia during GTC 2026 Chey Tae-won attended Nvidia GTC 2026 to strengthen SK hynix's AI partnerships, highlighting HBM4 memory advancements and deepening collaboration with Nvidia and CEO Jensen Huang within the global AI ecosystem. Yonhap News Agency

Sponsor Award Winning Acquisition Mode Dynamic Planar CT Nordson's Dynamic Planar CT™ earned a 2025 EM Innovation Award for its advanced 3D AXI software, delivering faster, ultra-high-resolution defect detection with improved throughput and reduced radiation exposure. Nordson Test & Inspection

AMD chief to visit Samsung's chip plant this week: sources Lisa Su will visit Samsung Electronics' Pyeongtaek chip complex to meet executives, exploring expanded foundry cooperation for next-gen AI chips. The move could strengthen Samsung's position against TSMC and boost profitability. Yonhap News Agency

Sponsor How heterogenous packaging benefits from atmospheric argon plasma Semiconductor packaging plasma processing improves reliability and yield. Chip manufacturers can rely on plasma processes to enhance applications. Surfx Technologies