June 25, 2026

Creating A Moore's Law For AI Scaling AI scaling strains data centers as compute demand and power rise sharply. Industry leaders push co-optimization across hardware, software, and architecture to improve efficiency, enabling agentic and physical AI, from cloud models to real-time robotics and edge devices. Semiconductor Engineering

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ASE Targets FOPLP Mass Production by End-2026, Launches 15 Expansion Projects This Year Amid AI Boom ASE is advancing FOPLP, with its first fully automated high-volume production line set for mass production by late 2026. Backed by rising AI demand, ASE is expanding capacity, boosting capex, accelerating U.S. growth & targeting a doubling of advanced packaging revenue from 2025 levels. TrendForce

Peer viewpoint: AI data centers are driving a semiconductor revolution AI adoption is tripling data center demand by 2030. Henkel surveyed 120 semiconductor leaders to uncover how innovation in materials and packaging is powering future-ready, high-performance infrastructure. Technical Paper

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

Micron Profit Surges 15-Fold as Margin Nears 85%; HBM4 Revenue Exceeds $1B Micron posted a blockbuster 3QFY2026 as AI-driven memory demand fueled a 74% sequential revenue jump and record margins. The company topped forecasts, surpassed $1 billion in HBM4 sales, and projected strong growth ahead as memory shortages persist. TrendForce

China's JCET to build new plant in Shanghai to expand advanced chip packaging JCET will invest 7.8 billion yuan to build an advanced chip packaging and testing plant in Shanghai's Lin-gang area, expanding capacity to meet surging AI-driven demand and strengthen China's semiconductor self-reliance. The first phase completes in 2028. South China Morning Post

Sponsor No-Clean, Flip-Chip and Ball-Attach Flux Improve yields with NC-809, the industry leading, true no-clean, ultra-low residue, flip-chip and ball-attach flux suitable for many semiconductor applications. Indium Corporation

Technical Papers Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications MORE TECHNICAL PAPERS

Sponsor Proven Die-Attach Pastes and Films Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity. AI Technology, Inc.

Netherlands lobbies US to drop chip curbs targeting ASML sales Netherlands lobbies US to avoid expanded semiconductor export controls that could restrict ASML sales to China. Minister Sjoerdsma met Commerce Secretary Lutnick and lawmakers to oppose MATCH Act, warning of economic stakes, sovereignty concerns, and ongoing talks. Taipei Times

Softbank's Son calls AI bubble talk an 'insult,' delays retiring Masayoshi Son dismisses AI bubble concerns, insists the revolution is just beginning, and pledges to lead SoftBank for another 10–15 years. He accelerates investments in AI and robotics, including OpenAI, Arm, and 'physical AI' systems targeting artificial superintelligence. Taipei Times

Sponsor Eliminate Voids for High-Reliability Applications Voids compromise reliability. Achieve near zero-voiding with our vacuum reflow for automotive, micro-bumping, and advanced electronics. Send your boards to see the results. Heller Industries

SK Hynix seeks US$29bn with new US listing SK Hynix plans a US$29.38 billion NASDAQ listing to expand high-bandwidth memory capacity as AI-driven chip demand surges. The firm, dominant in HBM, aims to boost supply and valuation, with trading expected to begin on July 10. Taipei Times

Deep UV Lithography Processing, the Best Kept Secret of EUV Lithography Chipmakers sustain Moore's Law through a hybrid lithography strategy, where EUV enables cutting-edge patterning but DUV handles most layers. Advanced nodes depend on technologies & evolving materials, challenging the notion that EUV alone drives semiconductor scaling. EE Times

Sponsor Analytical Solutions Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions. Balazs Nanoanalysis

Silicon Saxony Shows Promise, Limits of Europe's Chips Act Silicon Saxony leaders say Europe's Chips Act is fueling growth in Dresden's semiconductor hub as global companies expand manufacturing, international engagement rises, and competitors collaborate to strengthen supply chains, talent pipelines, and Europe's chip sovereignty. EE Times

How Far Left Can You Shift? As chip design shifts left, development grows more complex with early software prototyping, workload mapping, verification, multi-physics integration & IP qualification. Synopsys says reuse, chiplets & optimized workflows help engineers keep advanced chip projects on schedule. Semiconductor Engineering

Sponsor Does Water Do the Job on Its Own? Matching a cleaning agent to the soil it cleans is key because cleaning only with deionized water may not always be effective when cleaning electronics. Download to learn more. KYZEN

Automate the Pain Away: HW/SW Interface Design Methodology Connected, automated design flows help SoC teams coordinate hardware and software development as chip complexity rises. The approach streamlines interfaces, reduces integration issues, boosts productivity & speeds delivery while preserving consistency across the entire SoC. Semiconductor Engineering

Sponsor 1 of 10 Applications: Hybrid Bonding Swiss made Tresky die bonders can be equipped with an atmospheric plasma unit to provide flawless surfaces on chips or substrates for perfect bond results. Dr. Tresky AG