February 4, 2026

The Hidden Physics of Running Data Centers in Orbit Megawatt-scale orbital data centers are moving from concept to boardroom pitches, but thermal management poses the biggest hurdle. Without air for convection, space systems must radiate heat inefficiently, requiring vast radiator structures and making cooling a core design constraint. EE Times

Sponsor Large Capacity Plasma Treatment System - FlexTRAK-SHS 9.6-liter plasma process chamber handles larger, or more, strips increasing throughput and productivity for electronics/semiconductor packaging. Nordson Electronics Solutions

VIEWPOINT 2026: Guido Ueberreiter, VP Semiconductor Strategy, VON ARDENNE Talking about semiconductors in 2025 inevitably means discussing artificial intelligence (AI)—and the geopolitical challenges shaping the industry. However, we are seeing technological progress across many aspects of the industry. Single-digit nanometer logic technology is a fascinating segment ... VON ARDENNE

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide removal before thermocompression bonding. Technical Paper

Sponsor FSO Hermetic Package HDHS® Technology Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination. MicroCircuit Laboratories, LLC

Why Arizona's chip making boom may just be starting Arizona is rapidly emerging as a U.S. semiconductor hub as TSMC expands fabs near Phoenix, universities build talent pipelines with Taiwan, and chipmakers like Amkor and Intel invest billions, creating a full end-to-end manufacturing ecosystem. Electronics 360

New "Intelligent" Chip Emerges, Expected to Break Computing Energy Bottleneck Researchers led by Politecnico di Milano unveiled an intelligent in-memory computing chip that slashes energy use and boosts speed by processing data directly in memory. Built with standard CMOS, the analog design targets AI, data centers, and 5G/6G. TrendForce

Sponsor LAPLACE® LAR 600A Saves Energy Fast 4-8s reflow, massive energy savings, and 90 × 90 mm² precision scanning make LAPLACE® LAR 600A the ultimate choice for sustainable reflow processes. PacTech

Technical Papers Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG MORE TECHNICAL PAPERS

Sponsor The Leader of Advanced Packaging Thermal Solutions From 3D & CoWoS to SiP, PoP & Hybrid Bonding—we support every advanced process. Perfect reflow & curing for micro-bumping, underfill & TIM attach. Upgrade your yield. Heller Industries

AMD shares drop as forecast comes up short of some expectations AMD topped Q4 earnings estimates but delivered softer-than-expected Q1 guidance, knocking shares down 8%. Revenue surged 34% on AI-fueled data-center & PC demand, but investors wanted a stronger outlook amid heavy AI spending, fierce Nvidia competition & margin concerns. CNBC

Intel is moving into GPUs and has hired a chief architect, CEO Lip-Bu Tan says Intel has hired a new chief architect to accelerate GPU development as AI data center demand surges, CEO Lip-Bu Tan said. He warned memory shortages will persist until 2028, even as investors grow cautiously optimistic about Intel's recovery. CNBC

Sponsor Convenient Desktop Plasma System The PE-100 utilizes a capacitive parallel plate design for the most effective plasma generation available. Our systems offer uniform plasma with a low environmental impact at a great value. Plasma Etch

Nvidia's Jensen Huang denies OpenAI deal rumors: 'There's no drama' Nvidia CEO Jensen Huang dismissed reports of tension with OpenAI, confirming plans to invest in its next massive funding round. Despite deal delays and market jitters, Huang said Nvidia remains committed to backing OpenAI's infrastructure and future IPO ambitions. CNBC

Rush for AI chips a boon for Vanguard Vanguard Int'l Semiconductor says the AI infrastructure boom is squeezing supply of mature chips, limiting capacity for other products. Cautious pricing, new fabs and utilization should lift margins and drive double-digit chip shipment growth. Taipei Times

Sponsor Ultra-Thin Wafer Handling Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them. Brewer Science

Mainland memory firms eye Hong Kong for funds to fuel 'global ambitions' Mainland memory-chip suppliers are turning to Hong Kong listings to fund global expansion, led by Montage Technology's dual IPO. Analysts say the move reflects strong AI-driven demand, investor appetite, and a strategic shift from domestic self-sufficiency toward exports. South China Morning Post

Research Bits: Feb. 3 Researchers unveiled biodegradable, ultra-efficient artificial synapses and compostable electronic circuits that mimic brain functions and perform reliably, while other studies caution that some "transient" materials persist & may harm soil, underscoring the need for careful material choices. Semiconductor Engineering

Sponsor New Quadra Pro Manual X-Ray System Sets a new standard for high-resolution 3D/2D manual inspection with exceptional image clarity and reduced noise levels Learn more. Nordson TEST & INSPECTION

SoftBank subsidiary to work with Intel on next-gen memory for AI Saimemory, SoftBank's memory arm, teamed with Intel to commercialize Z-Angle Memory, an energy-efficient DRAM built for AI workloads. The partners plan prototypes by fiscal 2028 and target a 2029 launch as AI-driven memory demand surges. CNBC

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