February 24, 2026

Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers Backside power delivery networks route power beneath chips, slashing IR drop by up to 30%, raising frequencies, shrinking core area and cutting costs. Intel, Samsung, TSMC, IBM Research and imec push the tech forward despite tough manufacturing, thinning and thermal hurdles. Semiconductor Engineering

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VIEWPOINT 2026: John Kibarian, CEO, PDF Solutions In 2026, the semiconductor industry will continue to see the growth of new AI cloud, edge and data center applications. Complex 3D packages and systems are the technology enablers of the growth of AI. It is creating manufacturing and R&D challenges that can only be addressed via an AI-based unified ... PDF Solutions

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Technical Paper

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China Reportedly Ramps Up Chip Tool Push, Sets 70% Target by 2027; SMEE, NAURA at Forefront China is accelerating chip equipment self-reliance as U.S. sanctions tighten, pushing firms like SMIC and HiSilicon to localize lithography, etching, and EDA tools. Beijing targets 70% domestic equipment use by 2027 and advances 14nm and prototype EUV systems. TrendForce

India Summit Champions Global South AI Inclusion The India AI Impact Summit showcased low-cost, inclusive AI for the Global South and human-centric ethics. Despite access and management issues, experts hailed India's digital infrastructure and engineering talent as a catalyst to transform healthcare, agriculture, and industry. EE Times

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

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TSMC Speeds up Expansion in Taiwan: up to 10 Fabs Reportedly under Construction or Starting in 2026 Ahead of NVIDIA's Q1 earnings and GTC, TSMC accelerates expansion across Taiwan, scaling 2nm and 1.4nm fabs in Hsinchu, Taichung and Kaohsiung. With up to 10 fabs planned and capex set at $52–56B in 2026, the foundry deepens advanced node and packaging capacity. TrendForce

SK Hynix pledges to boost output of AI memory chips SK Group chairman Chey Tae-won vowed to expand AI memory chip production as global data center spending soars. He hailed high-bandwidth memory as a profit-driving "monster chip" for SK Hynix, while warning that rapid tech shifts and energy constraints could threaten future gains. Taipei Times

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Low-Cost Computers Nearly Double in Price as RAM Shortage Hits Surging AI hardware demand drives memory contract prices up to 95% in early 2026, squeezing low-cost makers like Raspberry Pi. With little negotiating power, they raise prices, redesign boards, or cut RAM, while analysts expect elevated memory costs to persist for years. IEEE Spectrum

AI Supercycle Reshapes Memory Landscape, Squeezing NOR Flash Supply The AI-driven memory supercycle is reshaping supply chains beyond data centers. As Samsung and SK Hynix shift capacity to high-margin HBM, DDR5 and NAND, Tier-2 suppliers shoulder legacy demand, sidelining NOR flash and tightening supply across markets. EE Times

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NASA Return to Venus Depends on New Class of Ceramic Sensor Venus's 460°C heat, crushing pressure and corrosive air quickly destroy silicon electronics. To extend missions, NASA is adopting wide-bandgap chips like silicon carbide and rugged ceramic sensors that survive extreme heat and chemical attack without bulky shielding. EE Times

Samsung Electronics Foundry Shines Resurrection Samsung Electronics boosted foundry utilization above 80% in the first quarter as its new Galaxy S26 adopts the Exynos 2600 chip. Rising orders from Nvidia, Tesla, Qualcomm, and AMD lift prospects for non-memory operations to return to profit by year-end. Maeil Business Newspaper

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New Performance Requirements For Audio Edge devices are powering richer human-machine interactions, driving demand for higher audio performance and more processors. Cadence's Prakash Madhvapathy says coherent design boosts efficiency and security, while next-gen DSP architectures meet rising consumer expectations. Semiconductor Engineering

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