Nov 2, 2026 Google: Agentic AI Will Drive New Demands on Data Center CPUs Google Cloud expects agentic AI to drive demand for CPUs, memory, storage and high-speed networking as autonomous agents tackle complex workloads. It is developing microVMs, orchestration and security tools to boost scalability, performance and cost efficiency. EE Times

Sponsor Ultrasonic Bonding in semiconductor industry - The fast and clean process Ultrasonic die bonding enhances semiconductor assembly with strong bonds, reduced thermal stress, and advancements in 3D packaging technology. Tresky

Chip Industry Week In Review AI-driven demand is intensifying global memory shortages expected to persist through 2030. Chipmakers are expanding DRAM, HBM and NAND production, advanced packaging and AI infrastructure while equipment suppliers and foundries accelerate next-generation technologies. Semiconductor Engineering

EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Debugging D2D I/O failures in heterogeneous packages is increasingly difficult due to limited access and test granularity. This paper shows how EOTPR accurately isolates chiplet interconnect defects with minimal prep, validated by a case study. Technical Paper

Sponsor Contamination Control Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields. Balazs Nanoanalysis

'Silicon shield,' 'Made with Taiwan' Taiwan must strengthen its "silicon shield" through global research partnerships, technological innovation and supply chain cooperation. As chip production expands overseas, Taiwan must secure political support while protecting its democracy, workforce and economic resilience. Taipei Times

China's new export curbs draw a line around its AI crown jewels China's proposed AI export controls seek to keep valuable models, IP and research at home while enabling overseas cloud access. The rules could reshape global partnerships, investment and Chinese developers' operations amid US-China tech rivalry. Taipei Times

Sponsor Dedicated Tool for Process Development Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis. Uyemura

Technical Papers ■ The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days MORE TECHNICAL PAPERS

Sponsor Enabling A Chiplet Supply Chain Chiplet-based architectures are gaining popularity for their smaller die sizes and better yields, but challenges in power management, security, and supply chain complexity remain. Download now. Amkor Technology, Inc.

Hon Hai expects revenue growth in double digits Hon Hai expects double-digit revenue growth next year as surging AI data center demand drives expansion. Chairman Young Liu highlighted new Texas manufacturing investments, potential OpenAI collaboration, Nvidia partnerships & continued development of electric vehicle platforms. Taipei Times

MediaTek gains new AI customer MediaTek secured a second non-Chinese customer for its AI accelerators and expects second-generation chip production to begin in early 2028. Its first AI chip program is gaining momentum, with revenue projected to reach $16 billion next year. Taipei Times

Sponsor Particle-Free Plasma Cleaning Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more. Surfx Technologies

Intel's Q3 Results Show Supply Chain Disruptions and PC Plunge Intel reported third-quarter revenue of $16.5 billion, up 21% year over year, as AI server demand boosted sales. However, manufacturing bottlenecks, rising memory costs, and declining PC demand constrained growth, prompting increased investment to expand production capacity. EE Times

AI, fuelled by advanced chips, set to power semiconductor manufacturing AI is reshaping chip design and manufacturing, with experts predicting autonomous development through self-improving systems. Chinese firms are deploying industrial AI to boost fab efficiency, wafer yields, scientific computing and advanced sensors. South China Morning Post

Sponsor Openair-Plasma for Semiconductor Manufacturing Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH

Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods PCB miniaturization and denser layouts complicate BGA rework by increasing thermal risks to nearby components. Engineers need precise heating, controlled airflow, effective heat shielding, and accurate temperature profiling to prevent warpage, solder defects, and joint failures. EE Times

Foxconn hopes to own 50% of the global AI server market within a couple years Foxconn aims to increase its global AI server market share from 40% to 50% while expanding US manufacturing. Chairman Young Liu expects AI infrastructure to generate 60–65% of revenue within five years, while emphasizing disciplined investment. CNBC

Sponsor Accurate Corner Fill Inspection SQ3000™ Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications. Nordson Test & Inspection

Nvidia to make US$1 billion investment in Naver Nvidia will complete its $1 billion investment in South Korea's Naver on Friday, becoming its third-largest shareholder. The strategic partnership also secures $9 billion in computing infrastructure to support plans for a massive global AI factory. Yonhap News Agency

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN

Why Physics Needs to Move at the Pace of Design Vinci raised $250 million in Series B funding at a $1.5 billion valuation to advance AI-powered physics simulations. Its technology delivers manufacturing-scale engineering analysis in minutes, helping engineers evaluate designs faster, reduce costly rework & accelerate hardware innovation. Semiconductor Engineering