Oct 28, 2026 The imec Report: Scaling Optical Interconnects For The AI Era Surging AI and cloud computing demand is pushing copper interconnects beyond their limits, accelerating adoption of silicon photonics. Industry leaders are advancing 1.6T and future 3.2T optical transceivers to deliver faster, more energy-efficient data center connectivity. Semiconductor Engineering

Sponsor Epoxy & Adhesive DIE Bonding One of the most common methods of creating a connection between chip and substrate is the gluing process. Extreme precise epoxy & adhesive bonding processes for sustainable bonds. Tresky Automation

AI cycle to last over 20 years: ex-Intel CEO Former Intel CEO Pat Gelsinger expects AI investment to grow for over two decades despite market corrections. Playground Global is partnering with Taiwan's tech ecosystem to advance AI infrastructure, memory, power management, optics and advanced packaging. Taipei Times

Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation This study demonstrates an alkaline wet etching solution for aluminum and its alloys, delivering controlled anisotropic etching, improved metal selectivity, photoresist compatibility, and an environmentally sustainable alternative to PAN-based chemistries. Technical Paper

Sponsor Proven Flip-Chip Flux for AI Packages WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications. Indium Corporation

Former Intel CEO Pat Gelsinger Backs Memory Startup Eyeing EUV-Free Z2RAM, Targets Samples Within 4 Years Former Intel CEO Pat Gelsinger backs Nagare Labs' $5 million seed round to develop Z2RAM, a memory technology combining SRAM-like speed with DRAM-like density. Hybrid bonding could boost AI chip memory capacity, but reliability and integration challenges remain. TrendForce

Applied Materials to Double BESI Stake to 20% on Hybrid Bonding Demand, Pending U.S. Antitrust Review Applied Materials plans to raise its BESI stake from 9% to 20%, deepening their partnership on hybrid bonding for AI chips. The move comes as demand surges, with BESI's hybrid bonding orders more than doubling in 2026. TrendForce

Sponsor 1 of 10 Applications: UV Curing Swiss made die bonders from Tresky handle bonding processes with fast curing UV adhesives easily. A high-power UV source attached to the dispenser takes care of the curing step. Dr. Tresky AG

Technical Papers ■ The Future of Flip Chip Bonding: How R-LAB and R-LTC Enable Next-Generation AI and HPC Packaging ■ Selective Alkaline Wet Etching of Al and AlCu Using a Phosphoric and Nitric Acid Free Formulation ■ Hybrid & Fusion Bonding: from Heterogeneous Integration to 3D Front-End of Line Technologies ■ Why Metal TIM Warpage Simulations Fail—and How to Fix Them ■ Oxide Reduction for Reliable Power Electronics Manufacturing ■ Bond front velocity in lubrication-mediated bonding of flexible substrates ■ How AI Could Cut Semiconductor Package Design Cycles from Months to Days MORE TECHNICAL PAPERS

Sponsor Die Attach Material Comparisons Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability. StratEdge Corporation

SK hynix logs record profit in Q3 on AI chip supercycle SK hynix reported record third-quarter revenue of 104.61 trillion won and operating profit of 83.33 trillion won, fueled by AI-driven memory demand. The company also announced shareholder returns exceeding 100 trillion won for 2026. Yonhap News Agency

Intel to buy quantum firm Classiq for about $2.3 billion, Bloomberg News reports Intel has reportedly agreed to acquire Israeli quantum computing software company Classiq for approximately $2.3 billion, Bloomberg News reported, citing sources familiar with the matter. Both companies declined to comment, and Reuters could not independently verify the report. Reuters

Sponsor Buy Ceramic Dispensing Needles Online Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online. DL Technology

Bacteria grow their own semiconductors to boost chemical production with light Researchers engineered Bacillus subtilis bacteria to grow cadmium sulfide semiconductors on their surfaces, using sunlight to boost chemical production. The approach nearly tripled 2'-fucosyllactose output, though cadmium toxicity and industrial-scale lighting remain challenges. Nanowerk

Apple's new iPhone Duo receives early complaints Apple faces a setback as customers report cracked iPhone Duo foldable displays within days of purchase. The company acknowledged the defect affecting a small number of devices and advised customers to contact AppleCare for replacements. Taipei Times

Sponsor Achieve Precision in WLCSP Bumping Ultra-SB²® offers high-accuracy ball placement, automated handling, and 2D inspection for solder bumping with fine-pitch layouts. PacTech

Anthropic points to AI dangers, soaring sales in IPO filing Anthropic has unveiled plans for a potential $100 billion IPO, highlighting surging sales, first-quarter operating profits, and significant AI safety concerns. The company also warned investors about political conflicts, slowing growth, and massive computing commitments. Taipei Times

TSMC Reportedly Plans Up to 20% Increase in Advanced Chip Packaging Prices Amid AI Demand TSMC plans to raise advanced semiconductor packaging prices by up to 20% as AI demand strains capacity. Growing orders for AI processors, server CPUs and custom chips, alongside longer testing times, intensify supply constraints through 2027. Yahoo! Finance

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Quantum Computing's Energy Bill Is Coming, and We Haven't Priced It In Quantum computing experts urge the industry to prioritize compute-per-watt and compute-per-dollar over qubit counts. Scaling large processors before networking them could boost performance exponentially while reducing energy use and operating costs. EE Times

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Samsung aims to cut chip material development time using AI Samsung aims to use AI to reduce semiconductor material development time from five years to two, identify over five times more promising candidates, and cut experiments by 80%. The company also expects lower costs and broader industrial applications. Yonhap News Agency