March 16, 2026

IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes IBM and Lam Research announced a five-year collaboration to push chip technology beyond the 1-nm node. They aim to advance High-NA EUV lithography, new materials, and atomic-scale processes, enabling higher-performance, lower-power transistors for AI-era logic devices. EE Times

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TSMC nets nearly 70% of 2025 foundry market Taiwan Semiconductor Manufacturing Co. (TSMC) captured nearly 70% of the global foundry market in 2025, earning US$122.54 billion as AI demand surged. Its lead widened over Samsung, while top competitors like SMIC, UMC, and GlobalFoundries trailed far behind. Taipei Times

Eliminating Interfacial Delamination in High-Power Automotive Devices This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology. Technical Paper

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Future AI chips could be built on glass South Korean company Absolics is set to mass-produce glass substrates for AI chips, aiming to boost performance and energy efficiency in data centers. Intel and others are exploring the material, which handles heat better, allows denser connections, and could transform computing. MIT Technology Review

Iran Conflict Threatens Helium for Chip: China's Domestic Supply Push in Focus Iran conflict threatens semiconductor supply chains as drone strikes shut down Qatar's Ras Laffan helium hub, removing about 30% of global supply. Chipmakers monitor risks while China accelerates domestic helium production and recovery to boost supply. TrendForce

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Technical Papers Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging Revolutionizing IC Packaging with High-Density RDL Technology EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems Package Assembly Design Kits: The Future of Advanced Package Design Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications Eliminating Interfacial Delamination in High-Power Automotive Devices MORE TECHNICAL PAPERS

Sponsor TIM1 for EV Battery Thermal Management AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs. AI Technology, Inc.

Companies ramp up AI spending even as most pilots fail to deploy: Lenovo executive Global firms are pouring billions into AI to avoid being left behind, yet over 90% of pilots fail, Lenovo reports. Despite optimism, readiness lags, with hybrid deployments and sectors like manufacturing leading adoption, boosting Lenovo's profitable AI infrastructure business. South China Morning Post

Nvidia's GTC will mark an AI chip pivot. Here's why the CPU is taking center stage Nvidia is shifting focus from its famed GPUs to CPUs as agentic AI adoption surges. At its GTC conference, the company will showcase Vera CPUs, addressing AI bottlenecks and driving data center growth, with markets projected to double by 2030. CNBC

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Nvidia may soon unveil a brand-new AI chip. A closer look at the $20 billion bet to make it happen On Christmas Eve, Nvidia shook the AI chip market, agreeing to a $20 billion deal to license technology from startup Groq and recruit top talent, including its CEO, who helped Google build a leading rival to Nvidia's processors. CNBC

TSMC Extends Market Share Lead Over Samsung Electronics Taiwan Semiconductor Manufacturing Co. (TSMC) reinforced its foundry dominance in 2025, capturing a 69.9% market share with $122.9 billion in sales, while Samsung's share fell to 7.2% amid 3nm yield issues, widening the gap to 62.7 points. The Chosun

Sponsor Amkor's Double Sided Molded BGA Solutions To improve the integration of RFFE solutions, Amkor offers a DSMBGA package that allows molded assembly of components on both sides of the substrate. Amkor Technology, Inc.

Embedded World 2026 Wrap: Key Highlights The 2026 Embedded World show in Nuremberg drew 36,000 attendees from nearly 90 countries, highlighting innovations in physical AI, edge computing, and robotics. Experts Nitin Dahad and Jim McGregor shared key industry insights and emerging technology trends. EE Times

MWC 2026 Concludes as Telcos Pivot to AI The 2026 Mobile World Congress highlighted telecom's shift from hardware to AI-driven networks. Industry leaders debated GPU versus CPU architectures for edge AI, showcased robotics and 6G visions & emphasized energy-efficient, software-defined networks shaping the next decade. EE Times

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Chip Industry Week In Review Global helium shortages from the Iran conflict have removed a third of supply, threatening semiconductor production with chemical, logistical, and energy disruptions. Meanwhile, Synopsys unveiled Ansys 2026 R1 tools, and Meta revealed four new AI chips for GenAI workloads. Semiconductor Engineering

Sponsor Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more. KYZEN