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AI-Technology-Inc

Proven Die-Attach Pastes and Films
Low moisture absorption proven to meet AEC Grade-0 and MSL Level-1 reliability. Wafer level applicable DAF. Up to 250° wire-bonding and rapid curable for ultimate productivity.
AI Technology, Inc.
Industry Press
StratEdge Takes High-Reliability Packaging on the Road for CSMantech, Space Tech Expo USA, and IMS 2026
StratEdge Corporation
Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC
Indium Corporation
SEMI and 23 Member Companies Urge U.S. Congress to Extend Advanced Manufacturing Investment Credit
SEMI
ViTrox Showcases Smart Manufacturing Innovations at MetalTech & Automex 2026
ViTrox Corporation Sdn Bhd
ZEISS Receives Honorary Pin from the German ENT Society
ZEISS
Nikon NEXIV VMF-K6561 Achieves Full 600 mm Panel Coverage
Nikon Corporation
Indium Corporation Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
Indium Corporation
Global Semiconductor Materials Market Revenue Reaches Record $73.2 Billion in 2025, SEMI Reports
SEMI
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Plasma-Etch

Handheld Plasma Activation
Plug it in and start cleaning; no gas hookup! Versatile all-in-one solution you can take anywhere and activate almost anything in seconds! Learn more.
Plasma Etch
Surfx-Technologies
What Year Was It?
Catastrophic Eruption of Mount St. Helens
What Year
Mount St. Helens has a catastrophic eruption and becomes the most economically destructive volcanic event in the history of the United States.
See the answer below.
Tresky
Sponsor
Balazs-Nanoanalysis

Analytical Solutions
Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions.
Balazs Nanoanalysis
XYZTEC
Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
What Year Was It Answer
Catastrophic Eruption of Mount St. Helens
Answer: May 18, 1980
May 19, 2026
Intel CEO says foundry business is gaining momentum as customer interest grows
Intel CEO Lip-Bu Tan said its foundry business is improving, driven by 18A yield gains and rising customer interest. He expects multiple commitments and aims to compete with TSMC while advancing U.S. chip manufacturing ambitions.
CNBC
Sponsor
Dr.-Tresky-AG

1 of 10 Applications: Eutectic Bonding
Swiss made Tresky die bonders can be fitted with temperature controlled chucks and protective gas suited to eutectic die bonding of chips with AuSn bumps for opto-electronic components.
Dr. Tresky AG
Google I/O primer: Alphabet’s AI showcase is its chance to wow Wall Street
Alphabet shares have surged 140% as investors bet on its AI comeback, but Google must prove its roadmap at I/O. The company will showcase Gemini upgrades and agentic tools spanning search, cloud, Android, and commerce to challenge rivals.
CNBC
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Technical Paper
Sponsor
Amkor-Technology

Electromigration Performance Of Fine-Line Cu RDL For HDFO Packaging
A study on HDFO packages uncovers copper RDL reliability, highlighting failure modes, resistance shifts, and critical current capacity. Read more.
Amkor Technology, Inc.
Canada Spins Off Photonics Lab
Canada announced plans to spin off the Canadian Photonics Fabrication Center (CPFC) into a commercial entity, aiming to attract investment and jobs. The move shifts the NRC-run compound semiconductor facility toward an industry-driven model while maintaining government ownership stake.
EE Times
ASML, Tata Electronics Partner for India’s First 300-mm Semiconductor Fab
ASML signed a strategic partnership with Tata Electronics to supply advanced lithography tools and expertise for India’s first 300-mm semiconductor fab in Dholera, Gujarat, supporting an facility producing chips for automotive, mobile, IoT, and AI applications.
EE Times
Sponsor
Pac-Tech

LAPLACE® LAR 600A Saves Energy
Fast 4-8s reflow, massive energy savings, and 90 × 90 mm² precision scanning make LAPLACE® LAR 600A the ultimate choice for sustainable reflow processes.
PacTech
Technical Papers
Automated X-Ray Metrology: Enhancing Quality and Efficiency in Wafer and Panel-Level Applications
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
MORE TECHNICAL PAPERS
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MicroCircuit-Laboratories-LLC

Rapid Package Seam Seal Changeover
The Robotic Cover Sealer (RCS) enables rapid assembly changeover on < 5 minutes from a 3 x 3 mm to 50 x 70 mm package. Package tooling may be adjustable or tool less.
MicroCircuit Laboratories, LLC
Confusion Grows With More Interconnect Options And Tradeoffs
As chip designs and packaging grow complex, engineers face expanding interconnect choices to move massive AI data efficiently. They increasingly adopt layered, mixed protocols across chiplets, packages, and systems, balancing performance, power, and ecosystem compatibility amid rising complexity and standardization.
Semiconductor Engineering
How Elon Musk and Sam Altman went from besties to bitter rivals
Musk and Sam Altman’s once-close partnership over OpenAI has collapsed into a high-profile courtroom battle, as Musk alleges the startup abandoned its nonprofit mission, enriched insiders, and betrayed founding promises, while both sides race in the AI commercialization boom.
CNBC
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
Weekly news roundup: TSMC faces AI supply strain as Samsung, Intel, and Apple test foundry alternatives
AI-driven demand strains TSMC’s dominance as major tech firms explore Samsung and Intel for supply-chain resilience despite yield and cost challenges. Meanwhile, companies like Cyient, Hanwha, and Intel advance packaging, foundry expansion, and ecosystem growth across global semiconductor markets.
Digitimes
Semiconductor Society Warns Samsung Strike Could Devastate Korea's Chip Ecosystem
Korean Society of Semiconductor Engineering urges Samsung Electronics and its union to cancel a planned general strike and resume talks, warning of a devastating impact on Korea’s semiconductor ecosystem, suppliers, research and talent pipeline amid rising global AI competition.
Seoul Economic Daily
Sponsor
Brewer-Science

Temporary Bonding Materials
Boost throughput and quality with Brewer Science's BrewerBOND® VersaLayer temporary bonding system for high-temperature (400˚C) and high-stress applications.
Brewer Science
ASML to partner with India’s Tata Electronics
ASML partnered with Tata Electronics to advance India’s semiconductor ambitions, supplying lithography technology for a planned 300mm foundry in Gujarat while also supporting talent training, supply chains, and R&D as India targets global chipmaking status by 2032.
Taipei Times
Cerebras IPO Revives AI Chip Startup Fever
Cerebras surged onto NASDAQ with a $5.5 billion IPO that valued the AI chipmaker at $66 billion, as investors backed rivals to Nvidia. Demand for AI inference, OpenAI ties, and wafer-scale chips outweighed stiff competition and technical risks.
EE Times
Sponsor
Master-Bond

Electrically Insulating, Toughened Epoxy
Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened epoxy system that transfers heat effectively and can be used for bonding, sealing, coating, potting and glob topping.
Master Bond
Chip Industry Week in Review
US approved Nvidia H200 chip sales path to 10 Chinese firms but no shipments yet, while industry groups seek CHIPS tax credit extension. TSMC projects $1.5T IC revenue by 2030, and firms expand AI photonics and semiconductor partnerships globally.
Semiconductor Engineering
Sponsor
Plasmatreat-GmbH

Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH
Today's Sponsor
Uyemura
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Test Your Knowledge
What is Bromine used for?
See answer below.
Circuit-Technology-Center
Quote of the Day
You cannot shake hands with a clenched fist.
Indira Gandhi
Sponsor
kyzen

IC Device & Micro-Electronic Cleaning
Answering the needs of packaging engineers, Kyzen offers modern cleaning chemistry proven effective for all IC devices & micro-electronics. Cost effective cleaning is no longer a challenge.
Kyzen Corporation
Industry Calendar
May 18, 2026
Surface Preparation & Cleaning Conference—SPCC
SEMI
May 26, 2026
The 2026 IEEE 76th Electronic Components and Technology Conference
ECTC
Jun 17, 2026
3D & Systems Summit
SEMI
Jul 6, 2026
CHIPcon: From Chiplets to Systems
IMAPS
Jul 6, 2026
ThermCon: Semiconductor Thermal Management
IMAPS
FULL INDUSTRY CALENDAR
Henkel-AG-Co
Cartoon of the Day
Cartoon
"I'm convinced that all corporations are evil, but Bruce Wayne says free market capitalism is the only thing that can save the world."
Copyright © Randy Glasbergen
Sponsor
CyberOptics

A Universal AI-Powered Segmentation Model
A new universal deep learning model enhances automated optical inspection by accurately segmenting images for both PCBAs and semiconductors. It boosts defect detection efficiency, simplifies model management & supports auto-programming.
Nordson Test and Inspection
Ontos-Equipment-Systems
Test Your Knowledge Answer
What is Bromine used for?
Answer: Water Purification as an alternative to chlorine. Brominated compounds are used for water treatment in swimming pools and hot tubs and are also used to control algae and bacterial growth in industrial processes.