semiconductor
packaging news
Sponsor
Tresky

DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
Industry Press
Henkel Taps Industry Experts for Webinar to Address Design Developments and Material Needs for Next-Gen AI
Henkel AG & Co.
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
Koh Young Technology
Antaira Technologies Achieves SEMI E187 Certification for Semiconductor Cybersecurity
Antaira Technologies
Advantest Announces Strategic Partnership with Applied Materials and Joins EPIC Platform
Advantest
CEZAMAT Boosts Advanced Photonics R&D with UV Nanoimprint System from EV Group
EV Group
SEMICON Southeast Asia 2026 to Convene Leaders in Malaysia
SEMI
ISRL USA and AIIP Sign MOU to Build America's First Dedicated Semiconductor SubFAB R&D Facility
AI Infrastructure Partners
Fraunhofer IPMS opens up new possibilities for industrial communication with LI-FI GRATHUS®
Fraunhofer IPMS
MORE INDUSTRY PRESS
Sponsor
Dr.-Tresky-AG

Swiss made die bonders from Tresky
Ideal for high-mix, low-volume production at highest quality. They are perfect for many uses, just like a Swiss Army Knife. Operator training takes only minutes.
Dr. Tresky AG
Circuit-Technology-Center
What Year Was It?
The First Earth Day
What Year
Earth Day, an event to increase public awareness of the world's environmental problems, is celebrated in the United States for the first time.
See the answer below.
Muhlbauer
Sponsor
Surfx-Technologies

Particle-Free Plasma Cleaning
Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more.
Surfx Technologies
Nordson-ASYMTEK
Sponsor
Master-Bond

Medical Grade, Toughened Epoxy
Master Bond Supreme 121AOMed is a thermally conductive, electrically insulating adhesive that resists repeated autoclaving and is used for bonding, sealing and encapsulation.
Master Bond
What Year Was It Answer
The First Earth Day
Answer: April 22, 1970
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April 23, 2026
SK hynix Breaks Ground on P&T7 Advanced Packaging Fab in Cheongju, Wafer-level Packaging Set for 2028 Ramp
SK hynix ramps up AI memory expansion, breaking ground on its KRW 19T P&T7 advanced packaging plant in Cheongju while advancing U.S. plans. Surging HBM demand lifts prices and margins, with Q1 profits set to hit record highs ahead of earnings.
TrendForce
Sponsor
Ormet-TLPS

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Server CPU Prices Up as Much as 20% Since March; Intel May Raise Prices Another 8%–10% in 2H26
Surging AI demand is driving CPU price hikes, with consumer chips up 5–10% and server CPUs 10–20%. Intel and AMD plan further increases as lead times stretch and capacity tightens, with constraints likely sustaining higher pricing through 2027.
TrendForce
Peer viewpoint: semiconductor innovation for telecommunication networks
Telecom networks are evolving rapidly to handle higher speeds & volumes. Henkel surveyed 170 semiconductor leaders to reveal how performance, reliability & advanced integration are driving next-gen infrastructure.
Technical Paper
Sponsor
StratEdge-Corporation

Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
Intel lands Tesla as first major customer for 14A chip technology
Tesla CEO Elon Musk said Tesla will use Intel's next-generation 14A process to manufacture chips for its Austin Terafab AI complex, marking Intel’s first major customer win and boosting its foundry ambitions, while Tesla expanded investment plans.
Reuters
TSMC shows smaller, faster chips without a pricey new tool from ASML
TSMC unveiled next-generation chip technologies A13 and N2U, aiming for smaller, faster, cheaper chips for AI, smartphones and laptops. The company will enhance existing ASML EUV machines instead of adopting costly high-NA systems, accelerating its scaling roadmap.
Reuters
Sponsor
Indium-Corporation

Proven Flip-Chip Flux for AI Packages
WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications.
Indium Corporation
Technical Papers
Alpha Particle Emissions: An Overlooked Risk for Soft Errors in Advanced Packaging
Revolutionizing IC Packaging with High-Density RDL Technology
EOTPR Fine pitch probing for die-to-die interconnect failure analysis in chiplet devices
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
Package Assembly Design Kits: The Future of Advanced Package Design
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
Eliminating Interfacial Delamination in High-Power Automotive Devices
MORE TECHNICAL PAPERS
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
TSMC plans to open chip packaging plant in Arizona by 2029, executive says
TSMC plans to open an advanced chip packaging plant in Arizona by 2029, expanding CoWoS and 3D-IC capacity. The company aims to ease AI chip bottlenecks as it brings packaging work currently done in Taiwan closer to US customers.
Reuters
TSMC Unfolds Map for Process, Packaging Tech
TSMC unveils chip roadmap featuring A14 1.4-nm GAA process and A13/A12 derivatives for AI and edge, alongside N2U 2-nm. It introduces photonics and advanced packaging to cut power use and latency while scaling AI data-center performance without high-NA EUV.
EE Times
Sponsor
MicroCircuit-Laboratories-LLC

Seam Seal Hermetic Packages with Auer Carriers and 3D Trays
MCL's Robotic Cover Sealer (RCS) enables the utilization of industry standard tooling used in Die and Wire Bonding. Reduced handling, decreased cost and an RCS sealing process provides the lowest cost in hermetic package sealing.
MicroCircuit Laboratories, LLC
Powerchip predicts substantial jump in quarterly gross margin and profits
Powerchip Semiconductor Manufacturing raises chip prices amid tight supply and AI-driven demand, expects strong gross margin and profit growth this quarter. The company sees rising utilization, a return to profitability & expanding memory, packaging & 3D AI foundry businesses.
Taipei Times
Micron pushes US Congress to curb Chinese competitors
Micron Technology urges US lawmakers to pass the MATCH Act, which would tighten export controls on chipmaking equipment to China, targeting CXMT, YMTC and SMIC, while restricting foreign service access, aiming to curb China’s memory industry on national security grounds.
Taipei Times
Sponsor
Amkor-Technology

Amkor Antenna in Package (AiP) Solutions
As demand for packages that support 5G increase, Amkor is ready with the successful implementation of AiP/AoP technology. Learn more.
Amkor Technology, Inc.
Google unveils chips for AI training and inference in latest shot at Nvidia
Google is splitting training and inference into specialized eighth-generation TPUs to challenge Nvidia in AI hardware. The chips deliver up to 2.8x training performance and 80% better inference, use SRAM-based architecture for low-latency AI agents, and see growing adoption.
CNBC
AI Agent Designs a RISC-V CPU Core From Scratch
In 2025, Verkor.io used its agentic AI system Design Conductor to autonomously design VerCore, a RISC-V CPU core in 12 hours, achieving performance comparable to a 2011 Intel Celeron and marking a milestone in end-to-end AI chip design.
IEEE Spectrum
Sponsor
Advanced-Component-Labs

Quick Turn I/C Package Substrates USA Fabrication – THIN "Stay Flat" CORES
Organic Substrates/High Density Interposers - 20µm Dielectrics /12µm Traces 50um Cores - ITAR Approved. Learn more.
Advanced Component Labs, Inc.
Indian Researchers Develop Molecular Memristor for Neuromorphic Computing
IISc Bangalore's CeNSE researchers develop a ruthenium-based molecular memristor delivering 14-bit resolution and 4.1 TOPS/W, enabling energy-efficient neuromorphic computing. They design crossbar AI inference chips for edge applications, targeting 22 nm fabrication.
EE Times
Sponsor
CyberOptics

Accurate Corner Fill Inspection SQ3000™
Nordson Test & Inspection advances industry software with AI-driven algorithms and SQ3000's MRS technology, delivering unmatched accuracy by eliminating reflections for precise, high-quality measurement applications.
Nordson Test & Inspection
Today's Sponsor
Uyemura
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Test Your Knowledge
When did Time magazine name the computer its "Man of the Year"?
See answer below.
Henkel-AG-Co
Quote of the Day
"It does not matter how slowly you go as long as you do not stop."
Confucius
Sponsor
Ontos-Equipment-Systems

The Next Step in Surface Prep!
All-new Ontos Clean Atmospheric Plasma System. Create pristine, atomically-controlled, activated
surfaces without a vacuum chamber.
Ontos Equipment Systems
Industry Calendar
Apr 28, 2026
29th Annual Components for Military & Space Electronics Conference (CMSE)
TJ Green
Apr 29, 2026
SEMIEXPO Heartland 2026
SEMI
May 5, 2026
SEMICON Southeast Asia 2026
SEMI
May 11, 2026
Advanced Semiconductor Manufacturing Conference—ASMC 2026
SEMI
May 12, 2026
iMAPS New England 52nd Symposium
iMAPS
FULL INDUSTRY CALENDAR
EV-Group
Cartoon of the Day
Cartoon
"It's your attitude, not your aptitude that determines your altitude. That's the philosophy that got me kicked out of pilot school."
Copyright © Randy Glasbergen
Sponsor
Brewer-Science

Temporary Bonding Materials
Brewer Science offers temporary bonding solutions with high adhesion and high thermal stability (≥ 400˚C) to enable thinning ≤ 50 µm.
Brewer Science
Circuit-Technology-Center
Test Your Knowledge Answer
When did Time magazine name the computer its "Man of the Year"?
Answer: December 26, 1982. The first non-human to receive the award since its creation in 1927. Describing the personal computer as 1982's "greatest influence for good or evil."