semiconductor
packaging news
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
AI-Technology-Inc
Viewpoint
February 18, 2025

VIEWPOINT 2025: Dirk Schade, Global Business Development, Xyztec



VIEWPOINT 2025: Dirk Schade, Global Business Development, Xyztec
Dirk Schade, Global Business Development, Xyztec
Xyztec drives innovation in bond testing

As the technology leader in bond testing, xyztec continues to lead the way in innovation, redefining precision, speed, and efficiency in the semiconductor packaging industry. With the rapid development of microelectronics, the demand for reliable and high-performance bond testing solutions is greater than ever.

In 2024, we have set new industry standards with our Sigma bond testers. They feature unparalleled force measurement, the Nano Control Shear Sensor for precise alignment, and advanced automation capabilities. These innovations enable manufacturers to achieve exceptional accuracy and high throughput in various applications, from wafer-level testing to large-area bond evaluations.

Semiconductor companies are moving to in-house chip design to gain greater control over their product roadmaps and supply chains. In-house chip design is driving the industry away from general-purpose processors and toward more customized hardware.

By integrating AI-driven pattern recognition and customizable automation, we aim to optimize test processes and enable seamless integration into smart manufacturing workflows. This is being done in line with the latest technologies to increase efficiency and meet environmental requirements.

Despite ongoing challenges, the global semiconductor industry is vibrant, and xyztec is proud to work with leading customers to address these needs directly. Together, we research and develop new solutions to minimize quality variability, improve process stability, and deliver the highest quality standards.

In this exciting journey, xyztec remains committed to its goal of shaping the future of bond testing and driving the growth of the semiconductor packaging industry.

Dirk Schade, Global Business Development
Xyztec
http://www.xyztec.com
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Balazs-Nanoanalysis

Analytical Solutions
Balazs™ provides analytical services to high-tech industries with a commitment to absolute quality control. As part of Air Liquide, we have a global presence & offer comprehensive solutions.
Balazs Nanoanalysis
Master-Bond