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February 25, 2025
VIEWPOINT 2025: Bob LePage, Sales Engineer, Circuit Technology Center
Demand for BGA component re-balling services is expected to increase yet again in 2025. We have enormous BGA component re-balling capacity, industry-leading expertise, and unmatched flexibility to support BGA re-balling requirements. Expansion and growth of our component tinning services department is planned for 2025. Automated Robotic Hot Solder Dip technology is utilized to meet precise customer requirements and handle a wide variety of device types. Additional tinning machines were ordered in late 2024 to meet this increasing demand. Innovation and improvements are constantly taking place in our circuit board rework and damage repair service department, a specialty service we pioneered decades ago and for which we are so widely recognized. Thanks to our highly skilled staff of rework and repair professionals, Circuit Technology Center celebrated our 41st year in business in 2024. After 41 years, we are still here, staffed with the industry's best, and we are proud to be considered the industry's most trusted source for circuit board and component rework, modification, damage repair, and BGA re-balling and tinning services. Bob LePage, Sales Engineer Circuit Technology Center http://www.circuitrework.com |
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