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February 28, 2025
VIEWPOINT 2025: Konrad Roessler, CEO, Heidelberg Instruments Mikrotechnik GmbH
In today's competitive semiconductor manufacturing landscape, efficiency and sustainability are essential for success. As multiple layers of circuitry are applied onto base materials, generating precise patterns by lithography is crucial. The goal for manufacturers is to optimize yield, minimize scrap, and keep costs low. Triggered by AI and the need for more high-end chips, there is very much activity in industrial R&D for Advanced Packaging. Many architectures and technologies are being developed, on silicon or glass or polymers, first on wafer level, already expanding to panel level. Heidelberg Instruments with its maskless lithography systems is well positioned for that demand. In 2025 will be tested a system for higher resolution down to 1 micron with deep sub-micron overlay accuracy. The maskless systems offer high flexibility and adaptability for fast progress in technology development. In manufacturing, exposure speed is paramount. In 2024, we introduced a high-speed system and the first such tool was delivered to customer. In the near future, it will be complemented by more exposure power which is important for thick or insensitive photoresists. For reliable and quick recognition of fiducials and alignment marks even under difficult conditions, AI assisted vision technology is being used. We are expecting an exciting and eventful year 2025 and hope that it will be characterized by peaceful competition and not by crises and conflicts. Konrad Roessler, CEO Heidelberg Instruments Mikrotechnik GmbH https://heidelberg-instruments.com/ |
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