April 3, 2024
Pac Tech Asia Invests in Capacity Expansion of Malaysian Factory
Pac Tech Packaging Technologies GmbH (PacTech) is proud to announce a $10 million investment to enhance the capacity of its subsidiary, PacTech Asia Sdn. Bhd. (PacTech Asia), ...
|
March 12, 2024
Pac Tech Appoints New Vice Presidents to Lead Business Units
Pac Tech Packaging Technologies GmbH (PacTech) proudly announces the internal promotions of Ms. Sy Jiun Sim and Mr. Matthias Fettke as Vice Presidents to lead key ...
|
April 13, 2022
PacTech announces new website launch
PacTech announces the launch of its newly revamped website. This newly redesigned website offers quick and easy access to essential information and features that offers ...
|
May 14, 2020
Bonding Technologies of Tomorrow and Beyond
PacTech's advanced laser assisted processing for minimal invasive selective bonding and ultrashort forming of highest reliable and stress-less solder interconnections.
|
August 22, 2019
Vertical Laser Assisted Bonding for Advanced 3.5D Chip Packaging
PacTech's "3.5D" Laser Assisted Chip Packaging Technology for vertical connection of chip to die stack and 3D horizontal die stacking (LAPLACE). It's compatible with solder, ...
|
July 9, 2019
SB²-WB: A new process solution for advanced wire-bonding
New Technology for Wire-Soldering is the ideal solution for reliable laser-soldered wire connections for multifunctional systems and modules. It combines standard ...
|
April 25, 2017
Annette Burczyk & Dr. Thorsten Teutsch assume new management duties for PacTech Group
As the Group has announced, Annette Burczyk and Dr. Thorsten Teutsch took over the executive management of the PacTech Group on April 1st, 2017. Heinrich Lüdeke, who ...
|
June 15, 2016
PacTech USA celebrates 15 years in Silicon Valley: expanding services & capabilities!
PacTech is pleased to announce the 15th anniversary of PacTech USA in Santa Clara! Thriving for a decade and a half at a time when Silicon Valley companies ...
|
October 20, 2010
Wafer Level Packaging of Compound Semiconductors
The microelectronics industry has implemented a number of different Wafer Level Packaging (WLP) technologies for high volume manufacturing ...
|
