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| Technical Papers Index | |||
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Apr 14, 2023 Defluxing of Copper Pillar Bumped Flip-Chips The process of creating interconnects on flip chips using copper pillar bumping has gained popularity as an alternative to the ... ZESTRON Mar 10, 2023 Functional testing of 0.3mm pitch WLP Today's electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin ... Ironwood Electronics Mar 2, 2023 Vacuum Fluxless Reflow Technology for Fine Pitch Interconnect Bumping Applications A process for fine pitch bumping involving vacuum and formic acid reflow (VFAR) suitable for high volume manufacturing is described. ... Heller Industries, Inc. Feb 19, 2023 Master Advanced Packaging Inspection Heterogeneous advanced semiconductor packages like SiP are quickly outpacing traditional inspection technologies. Learn how to master advanced package inspection. ... Koh Young America, Inc. Jan 19, 2023 Optimized Reflow Solder TIMs Processes for Heterogeneous Packages Void rates related to solder TIM (sTIM) layers are studied across different reflow processes including vacuum assisted reflow, formic reflow, ... Heller Industries, Inc. Dec 20, 2022 Packaging Solutions for Unique Markets The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. From a market segment perspective, MLF/QFN packaging solutions ... ... Amkor Technology, Inc. Dec 6, 2022 Keys to Component Lead Tinning Success The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold ... Circuit Technology Center Nov 18, 2022 How Semiconductor Fabricators are Working Through Global FFKM Shortages The global shortage of FFKM seals, caused by environmental restrictions and the Russia-Ukraine conflict, continues to impact semiconductor fabricators, while ... Greene Tweed Nov 1, 2022 Mobile Antennas and Power Devices that Break the Mold New liquid mold compound encapsulants are enabling advances in active mold packaging using laser direct structuring. This technique holds great ... Henkel Corporation Oct 3, 2022 Atmospheric Oxygen-only Plasma for Decapsulation of Advanced Packages Work presented in this paper demonstrates how artifact-free Microwave Induced Plasma (MIP) decapsulation enables true root cause failure analysis of ... JIACO Instruments |
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