Technical Paper: Defluxing of Copper Pillar Bumped Flip-Chips

Technical Paper

Defluxing of Copper Pillar Bumped Flip-Chips

The process of creating interconnects on flip chips using copper pillar bumping has gained popularity as an alternative to the conventional solder bumping method. This article aims to explore how the performance of copper pillar interconnects can be improved by means of defluxing.
ZESTRON

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