Industry Press
Magnetic sensors are officially rushing to TMR
YOLE Group
Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System
Hitachi High-Tech
Ironwood introduces high performance near zero footprint elastomer socket
Ironwood Electronics
Brooks Instrument Introduces New MFCs for High-Temperature Environments
Brooks Instrument
Meyer Burger publishes Annual Report 2023 after a strategic shift in a year
Meyer Burger Technology AG
Indium Corporation Celebrates 90 Years of Materials Science Innovation
Indium Corporation
One Part Epoxy Changes from Red to Clear Under UV Light
Master Bond
Advanced Semiconductor Packaging Patent Monitor: What you can get from data intelligence
KnowMade
MORE INDUSTRY PRESS
What Year Was It?
The day was Mar 18. What year was it?
Wells and Fargo Start Shipping and Banking Company
What Year
In New York City, Henry Wells and William G. Fargo join with several other investors to launch their namesake business.
See the answer below.
What Year Was It Answer
Wells and Fargo Start Shipping and Banking Company
Answer: March 18, 1852
March 19, 2024
Nvidia CEO Jensen Huang announces new AI chips: ‘We need bigger GPUs’
Nvidia unveiled its latest AI chips and software at a developer's conference, aiming to fortify its position as a leader in the AI industry. The new Blackwell generation, led by the GB200 chip, promises enhanced capabilities to meet growing demands, while revenue-generating NIM software facilitates easier AI deployment.
CNBC
This Transistor Can Be Reconfigured on the Fly
Researchers at TU Wien in Vienna have introduced a groundbreaking innovation in chip design, unveiling intelligent transistors capable of flexible reprogramming at the hardware level. Departing from traditional semiconductor technology, these transistors utilize electrostatic doping, enabling dynamic task-switching for enhanced adaptability and efficiency in data processing.
IEEE Spectrum
How to Select RF Test Socket
Selecting the right RF test socket involves several factors – frequency, insertion loss, return loss, impedance matching, contact force, contact resistance, durability, thermal performance, etc.
Technical Paper
MWC 2024: AI, Quantum and Telcos, Oh My!
At Mobile World Congress (MWC) 2024, Barcelona witnessed a transformative shift in mobile tech discourse. AI, quantum, and telecoms emerged as key themes, reflecting a maturation in their application. Companies like Qualcomm and IBM showcased sophisticated AI strategies, while Nvidia's AI-RAN Alliance aims to redefine MNOs' roles in the era of intelligent connectivity.
EE Times
Google Tainan data center plan still under assessment
Google Taiwan managing director Tina Lin announced that Google is evaluating market demand for a new data center in Tainan, adjusting plans accordingly. Emphasizing continued investment, she highlighted the expansion of the Changhua County data center and upcoming office buildings in Taiwan.
Taipei Times
TSMC to build two chip packaging fabs in Chiayi
TSMC announces plans for two new cutting-edge chip packaging fabs in Chiayi County, aiming to tackle supply shortages driven by soaring demand for AI chips. Construction to start in May, with 3,000 jobs expected. The move signifies a significant investment to meet market demand.
Taipei Times
Driving Into the Future: The Next Phase in Automotive Compute Package Adoption
Automotive compute processors advance rapidly with NXP introducing 5nm processors in 2020, followed by Mobileye's EyeQ Ultra in 2022 and TSMC's 3nm in 2023. Evolving from distributed ECUs to centralized DCUs improves scalability and reliability for software-defined vehicles. Complex architectures now integrate specialized functional blocks for processing vast sensor data, necessitating a shift towards chiplet-based designs for improved efficiency and yield.
3DInCites
Foxconn subsidiary reportedly in talks to set up facility in India
A Foxconn subsidiary is in talks to invest in India, drawn by the burgeoning smartphone industry in the southern regions. The move reflects a trend of tech giants flocking to India, signaling potential growth and investment opportunities in the sector.
Digitimes
TSMC to build 2 advanced IC packaging plants in Chiayi
Vice Premier Cheng Wen-tsan announced TSMC's plan to construct two cutting-edge IC packaging plants in Chiayi County, Taiwan, with groundbreaking set for May. The project aims to meet rising demand for advanced chips, creating 3,000 jobs and reinforcing Taiwan's semiconductor leadership.
Focus Taiwan
Optimizing Energy At The System Level
The optimization of energy consumption now requires holistic consideration of hardware and software. From architecture to implementation, collaboration is vital. Energy efficiency is shifting from computational to operational optimization, necessitating domain-specific computing and early software consideration for power savings.
Semiconductor Engineering
India wants to be a global chip powerhouse in 5 years
India aims to become one of the top five semiconductor producers worldwide in five years, amidst the complex global market dynamics. With initiatives to reduce reliance on China, investments from companies like Qualcomm and Foxconn, and plans for semiconductor plants, India gears up for a significant role in global value chains.






CNBC
TSMC Considering Advanced Chip Packaging Capacity in Japan
TSMC mulls expanding advanced packaging capacity in Japan. This could boost Japan's semiconductor industry reboot. Options include introducing CoWoS tech, enhancing processing power and reducing space. No decisions made yet. TSMC aims to double CoWoS output by 2025.
Yahoo! Finance
The City In The Tower: 3D ICs Transform The Electronics System Landscape
3D ICs are revolutionizing electronics by stacking chips vertically, enhancing performance, reducing energy consumption, and enabling innovative designs. This transformative technology promises to reshape the electronics system landscape, driving advancements in various sectors.
Semiconductor Engineering
Tech war: ASML's threat to expand outside the Netherlands is watched with interest in China
ASML, a vital semiconductor equipment supplier, faces geopolitical tension as its expansion beyond the Netherlands draws scrutiny from China. The move amplifies concerns in the ongoing tech war over critical supply chains and strategic technologies.
South China Morning Post
Laid-off techies face 'sense of impending doom' with job cuts at highest since dot-com crash
Tech workers face challenges in finding employment as layoffs surge to levels not seen since 2001. Amidst the job market turmoil, skilled professionals navigate uncertainty, emphasizing the need for reskilling and adaptability in the ever-evolving tech landscape.
CNBC
Samsung to win more than US$6bn for US investments
The US plans to award over US$6 billion to Samsung Electronics, fueling its expansion beyond a Texas project. This, alongside a US$5 billion grant to rival TSMC, aims to bolster semiconductor production on US soil, part of the CHIPS Act initiative.
Taipei Times
China's semiconductor production challenges could be boon for Europe
China, leading in semiconductor consumption and aspiring to AI supremacy, alarms the US. Amid trade tensions, the US blacklists chip giant SMIC over military apprehensions. China retaliates with an export ban. Despite sanctions, Chinese firms innovate, grappling with outdated tech, hiking costs.
Euro News
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Test Your Knowledge
What are the two dimensions apart from length and width?
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Quote of the Day
"Science is a wonderful thing if one does not have to earn one's living at it."
Albert Einstein
Industry Calendar
Mar 18, 2024
IMAPS Device Packaging 2024 PDC
IMAPS
Mar 20, 2024
SEMICON CHINA
SEMI
Mar 21, 2024
Advanced Packaging for Medical Microelectronics
IMAPS
Apr 9, 2024
Mitigating Supply Chain Risks: On-Shore Assembly Solutions for Long-Lifecycle Systems Webinar
Rochester Electronics
Apr 30, 2024
The 27th Annual Components for Military & Space Electronics (CMSE) Conference & Exhibition
TJ Green Associates, LLC
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Cartoon
"If you pay your invoice on time, it will mess up our accounting system, so it's better if you keep paying late."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
What are the two dimensions apart from length and width?
Answer: Depth and time