We search for industry news, so you don't need to.
  Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Nordson ASYMTEK
Home  I  News  I  Exclusives  I  White Papers  I  Calendar  I  Corporate News  I  Advertising  I  Site Map
February 8, 2010

Daily Circulation Over 35,000


NEW Hesse & Knipps BONDJET BJ915L
for your leadframe applications
Bond Jet BJ920Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more…
Hesse & Knipps

Test Your Knowledge
The tendency of a drill bit to make off-center, out-of-round holes, that are not perpendicular is called what?
Answer bottom right column.


ShinEtsu Photoresists, perfect for:
3D packaging, WLP, TSV and wafer bonding
PhotoresistsFor stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion. Learn more…
ShinEtsu

Letters Submit
No letters for today.

On This Day
February 8, 1672 - Isaac Newton read his first optics paper before Royal Society in London.


Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation

Cartoon of the Day
image
"I haven't read your proposal yet, Bob, but I already have some great ideas on how to improve it."
Copyright © Randy Glasbergen
Top Story  
10 Reasons to be Optimistic about the IC Industry
Are you uncertain about the 2010 IC industry recovery? It may help to consider these actual data points and current expectations that offer ...
IC Insights

When bonding accuracy really counts!
Sub-micron Die Bonder
Sub-micron Die BonderOne platform handles thermo-compression, thermo-sonic, epoxy, high force and Indium bump bonding. Smallest footprint for an advanced, sub-micron system. Ideal for MEMs, opto, flip chip, detectors, high-reliability and more…
Finetech

Viewpoint 2010
 
Bob Sykes, CTO, XYZTEC
imageAlthough the market was slow in 2009, XYZTEC took the initiative to invest in long term projects, one of them being new products to address green technology, like solar, and semiconductor trends such as 3D and ever reducing geometry! In addition, we experienced a 30% increase in personnel; not common during a recession. These efforts provide the ...
 
Industry News  
Where The Money Is
System-Level Design sat down to discuss where the value has shifted in the supply chain with Tom Quan, director at TSMC; Kalar Rajendiran, senior ...
Chip Design Magazine
Korea Targets the Recovery and Beyond
Optimism about the short and long term prospects for the semiconductor industry was heard throughout SEMICON Korea, held on February 3-5 in ...
Semi
Kulicke & Soffa Q1 results top Street, shares soar
Kulicke & Soffa Industries Inc posted quarterly results that blew past analyst expectations, riding on the recovery in the semiconductor ...
Reuters
Applied Korea at Center of IP Theft Case
South Korean prosecutors said Applied Materials Korea staff "extensively" gathered secret Samsung memory chip production technology and passed ...
Semiconductor International
ASE sees profit growth in 2009; beats 4Q09 guidance
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported a 9.5% profit growth but a 9.2% revenue drop compared to ...
Digitimes
Semiconductor companies predict higher revenue
Business in the semiconductor industry is improving, highlighted by a string of upbeat earnings forecasts from several large chip makers over ...
Arizona Republic
Chip spies arrested in South Korea
Just what we need in the boring old chip industry, a John LeCarre style tale of corporate espionage, and intrigue. South Korean prosecutors ...
TG Daily
Leap In Quantum Computing
A major hurdle in the ambitious quest to design and construct a radically new kind of quantum computer has been finding a way to manipulate the ...
Red Orbit
Samsung, Hynix Differ on Chip Outlook
Samsung Electronics and Hynix Semiconductor are clashing over the outlook of the global chip market for 2010. The world's top two chip makers ...
Korea Times
TI says vision sharpened in R&D cuts
Texas Instruments Inc., a legendary font of innovation, cut its budget for research and development by almost half a billion dollars in 2009. ...
Dallas Morning News
Japan's Fujitsu says it made first 'iPad'
Apple's new tablet PC is not the first product to be called the "iPad". Japan's Fujitsu says it launched one years ago, and the name has also ...
AFP
Smartphones set to change the future
Smartphones are ushering in a new era of mobile Internet services. This type of phone has become an essential part of daily life for many ...
JoongAng Daily

ZESTRON Vapor Recovery Devices
Tremendous Process Savings through Vapor Recovery
Soldering Made SampleThe demand to recover and reuse waste vapor by utilizing highly efficient systems has increased dramatically across every manufacturing sector. Contact ZESTRON to receive a free process assessment. Learn more…
ZESTRON
Technology News  
Nexus One Ushering In Age Of ANC, MEMS Mics?
One great feature of the Google Nexus One is the fact that it has TWO microphones. Basically, one microphone is positioned directly on the ...
Phandroid
Startup joins UCLA tech incubator space to develop contactless electronic connections
Technology has potential to improve 'smart cards,' Internet infrastructure, entertainment electronics. UCLA has opened its on-campus ...
UC Los Angeles
MIT researchers build first germanium laser
MIT researchers have demonstrated the first laser built from germanium that can emit wavelengths of light useful for optical communications. ...
Science Centric
Electrons on the brink: Fractal patterns may be key to semi magnetism
Achievement of this goal necessitates a detailed understanding of what happens at the exact transition point when a semiconductor changes ...
Nanotechnology News

Does your reflow offer guarantees?
Ours Does
ATEK Reflow• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
ATEK Systems Group
Corporate News Submit
Imec and Holst Centre present at Int'l Solid State Circuit Conference
At the International Solid State Circuit Conference, imec and Holst Centre present their newest breakthroughs in ultra-low power design for ...
Imec and Holst Centre
New generation of FISCHERSCOPEŽ X-RAY: XDLM and XDAL series
The newest generation of the proven FISCHERSCOPEŽ XDAL and XDLM xray
spectrometers is now available. The development process focused on the...

Fischer Technology, Inc.
Carsem Receives Microsemi Corp's Best Supplier of the Year Award
Carsem announced it has received Microsemi Corporation's Best Supplier of The Year Award for 2009 for assembly and test services that were ...
Carsem

White Papers Submit
Feb 3, 2010    Optimal Correlation Using Probe Card Test & Analysis System
Feb 1, 2010    Closed Loop Metrology Correlation
Jan 29, 2010    The evolution of today's IC test solution
Jan 20, 2010    Wafer Bumping: Low Cost Solution for Wafer Packaging
Jan 11, 2010    Jetting Systems Technology
Dec 16, 2009    Advanced Probe Card Analysis

Today's Sponsor


Advanced Probe Card Analysis
New White Paper
Advanced Probe Card Analysis WPRising prices for probe cards reflect the development of new technologies that increase test throughput by testing large numbers of die simultaneously. Improve yields, speeds product development & reduces test costs. Learn more…
Rudolph Technologies, Inc.


Thermal Innovations that make
the World's Technology Cool
IEEE SEMI-THERM 26The 26th annual IEEE SEMI-THERM Semiconductor Thermal Modeling, Measurement and Management Symposium will be held February 21-25, at the Santa Clara Convention Center. Don't miss this important event for the thermal management field. Click for program & registration information…
IEEE SEMI-THERM

Quote of the Day
"One machine can do the work of fifty ordinary men. No machine can do the work of one extraordinary man." Elbert Hubbard


F&K Delvotec introduces
Automated Pull and Shear Tester
Bonding & TestingF&K Delvotec's Desk Top Micro-Factory has been enhanced. Using a New Camera system on the Pull/Shear test head we introduce Model 5600C. A fully automatic pull & shear test machine w/ pattern recognition. You can convert to an auto wire-bonder in 3 minutes? Learn more…
F&K Delvotec

Test Your Knowledge
The tendency of a drill bit to make off-center, out-of-round holes, that are not perpendicular is called what?
Answer: Splay or runout

The latest news... at your fingertips
How can you and your colleagues stay on top? Only if you posess the latest information. Learn how Semiconductor Packaging News can help.
Semiconductor Packaging News

Calendar Submit
Feb 8, 2010 - Semiconductor Reliability Course
Feb 15, 2010 - Failure and Yield Analysis
Feb 21, 2010 - IEEE SEMI-THERM 26
Mar 1, 2010 - MicroTech 2010 - Disruptive Technologies
Mar 1, 2010 - Introduction to IC Design & Fabrication

Newsletter Archives


Home  |  About Us  |  Advertising  |  Advertising Rates  |  Archives  |  Calendar  |  Corporate News
Contact Us  |  Free Subscription  |  Industry News  |  Exclusives  |  Letters  |  Viewpoint  |  White Papers
Search Category       Search Term   
To search a phrase, place it in quotes.
Semiconductor Packaging News - A Circuitnet Publication
We search for industry news so you don't need to.

Circuitnet LLC, 22 Parkridge Road, Haverhill, MA 01835 USA
Copyright © 2009 Circuitnet.    All rights reserved.
Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager


Visit Circuitnet for the latest electronics assembly news and information.