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Thu May 26 20:14:40 EDT 2016

Top Story May 26, 2016
ASE & SPIL Plan New Holding Company
Taiwan's top two chip test and packaging companies, Advanced Semiconductor Engineering Inc (ASE) and Siliconware Precision Industries Co (SPIL), will join hands in a new holding company, the firms said. ASE has spent a year working out the deal, which is part of consolidation in a global semiconductor industry hit by weakening demand and an increasingly saturated ...

Industry News
North American Semiconductor Equipment Industry Posts April 2016 Book-to-Bill Ratio of 1.10
North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 and a book-to-bill ratio of 1.10, according to ...
Communications and Computer Systems Drive IC Sales Across All Regions
Communication and computer systems are forecast to be two of the three largest system applications for IC sales in every global region--Americas, Europe, Japan ...
IC Insights
Semiconductor Merger Mania: A Change From Historical Norms?
In 2015, an amazing wave of consolidations struck the semiconductor industry. Proposed mergers approached $160B in market value and over $100B have already been ...
SEMICON West 2016 Expands Technical Programming by nearly 50%
As the opening day of SEMICON West approaches, the electronics manufacturing industry is experiencing disruptive changes, making "business as usual" a thing ...
Globalfoundries Working on Next-Gen FDSOI Process
The 22FDX fully-depleted silicon-on-insulator (FDSOI) process developed by Globalfoundries Inc. is on track to debut later this year and the company is ...
EE Times
Ultra-Dense 3-D Packaging for IoT
Smoltek AB (Gothenburg, Sweden) is dedicated to superseding Moore's Law, which merely scales the size of transistors, with what it believes is the more urgent need ...
EE Times

IoT Security is Imec Target
Engineers need to plug security holes in the Internet of Things, according to Imec launching a program with that goal. Separately, the research institute based ...
EE Times
The Trouble With MEMS
The advent of the Internet of Things will open up a slew of new opportunities for MEMS-based sensors, but chipmakers are proceeding cautiously. There are a number ...
Semiconductor Engineering
ITF2016: Learning curve goes on when Moore's Law ends
The semiconductor learning curve is one of the most perfect curves ever devised, Mentor CEO Wally Rhines told this week's ITF2016 in Brussels, and even if Moore's ...
Electronics Weekly
Taiwan backend firms seeing robust orders from HiSilicon
Demand for HiSilicon's chips has been robust, according to sources at Taiwan-based IC backend firms, which have identified the China-based fabless IC vendor ...
Samsung Elec to defend interests against Huawei patent suits
Tech giant Samsung Electronics Co Ltd said on Wednesday it will defend itself against patent lawsuits filed by smartphone rival Huawei Technologies. Huawei has filed ...
Moore on his Law and More
In a video interview from his home in Hawaii, Gordon Moore shared his views on the future of technology including the future of his landmark prediction that has fueled ...
EE Times

Press Releases
Indium's VP of Technology to Chair Workshop on Pb-Free Soldering Reliability at ECTC
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will chair the professional development course, Materials Considerations for Achieving High Reliability ...
Indium Corporation
Amkor Presenting at ECTC and Exhibiting at Booth #304
Amkor is pleased to be a Gold Gala sponsor at the upcoming Electronic Components and Technology Conference (ECTC) being held May 31st-June 3rd at The Cosmopolitan ...
Amkor Technology, Inc.
SHENMAO Exhibits at ECTC
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity ...
SHENMAO America, Inc.
Imec and Infineon Cooperate on 79 GHz CMOS Radar Sensor Chips for the Automotive Industry
The world-leading nanoelectronics research center imec and semiconductor manufacturer Infineon Technologies AG announced that they are cooperating in CMOS ...
Test Your Knowledge
Which two elements do you combine to produce brass: zinc, copper, nickel, cobalt?
See answer below.
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Quote of the Day
Motivation is everything. You can do the work of two people, but you can't be two people. Instead, you have to inspire the next guy down the line and get him to inspire his people.
Lee Iacocca
What Year Was It?
First Published Dow Jones Industrial Averages
First Published Dow Jones Industrial Averages
The Dow Jones Industrial Average was founded by Charles Dow and represented the dollar average of 12 stocks from leading American industries.

The day was May 26. What year was it?
May 23, 2016: EOS, ESD and How to Differentiate Short Course (Munich)
May 24, 2016: Wire Bonding Certification
May 30, 2016: Semiconductor Reliability and Qualification Short Course (Munich)
May 31, 2016: ECTC 2016
Jun 7, 2016: Advanced Thermal Management and Packaging Materials Short Course
Jun 20, 2016: Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules
Jun 21, 2016: iMAPS New England Annual Business Meeting
Cartoon of the Day
"We've devised a new security encryption code. Each digit is printed upside down."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
Which two elements do you combine to produce brass: zinc, copper, nickel, cobalt?
Answer: Zinc and copper