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High Precision Dispense Tips
Precision needlesThe DL Technology EZ-FLO needles are custom-designed for precision dispensing applications in advanced packaging. Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more...
DL Technology
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March 10, 2010

Daily Circulation Over 35,000


Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Nordson ASYMTEK

Test Your Knowledge
Whats the term for opposition to an electrical current in a conductor?
Answer bottom right column.


Dynaloy Solutions for WLP
Advanced Packaging Applications
Dynaloy Solutions for WLPDynaloy offers Dynastrip™ DL88 for improved safety and better cleaning in Wafer Level CSP applications. See Dynaloy's advanced solutions for Flip Chip Bumping, Cu Pillar, Micro Pillar, Fan-out, WLCSP, and other challenging packaging cleaning processes. Learn more…
Dynaloy LLC

Letters Submit
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On This Day
March 10, 1876 - The first discernible speech is transmitted over a telephone system when Alexander Graham Bell summons his assistant in another room by saying, "Mr. Watson, come here; I want you."


Webcast: Silicon Interposers with
TSVs and Thin-Film Capacitors
First Through-Silicon Via FoundryThe evolution of silicon interposers without Through Silicon Vias (TSVs) to interposers with TSVs. Webcast on March 17, will discuss mechanical benefits of attaching ICs to silicon and electrical benefits of passive and active elements including Implementation & reliability data. Learn more…
ALLVIA, Inc.

Cartoon of the Day
image
"I'm cutting back your hours from 80 a week to 40. You get every other minute off."
Copyright © Randy Glasbergen
Top Story  

NEW Hesse & Knipps BONDJET BJ915L
for your leadframe applications
Bond Jet BJ920Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more…
Hesse & Knipps
Industry News  
Orrick Team Cracks Chip World's Dr. Qu
For 10 years, semiconductor companies took their medicine from Dr. Qu. In case after case, Tessera Inc. relied on Jianman Qu's expert testimony ...
Law
Nintendo Surpasses Samsung as Top Consumer and Wireless MEMS Buyer
Culminating a neck-and-neck race, Nintendo in 2009 surpassed Samsung to become the world’s top purchaser of Microelectromechanical Systems ...
iSuppli Corporation
Why National Semiconductor Is Best Barometer
Company's diversified customer base shows demand from economic sectors where others have little to no exposure. If you queried a group of ...
Minyanville
Amkor Technology Installs Systems from SUSS MicroTec
SUSS MicroTec has received orders for multiple 300mm lithography systems from Amkor Technology Inc., an industry leading supplier of innovative ...
Market Watch
First Solar Signs Contract with PG&E for 300 MW Photovoltaic Solar Power Project
First Solar, Inc. announced a power purchase agreement to supply Pacific Gas and Electric Company with renewable electricity from a 300 megawatt ...
Market Watch
Bullish Views on Semiconductor Sector in 2010
"The recovery of semiconductor sector is gaining momentum after being able to manage and recover from periods of weak demands. Positive long ...
Chip Design Magazine
Inventories guide the trade
Will this quarter be a strong one for Cisco? IBM? Novellus? Micron? Pfizer? Caterpillar? Chevron? Gap? One of the most reliable indicators ...
Market Watch
Apple To Build 5 Million iPads In First Half 2010, Analyst Says
Apple is on track to build 5 million iPads in the first half of 2010, according to FBR Capital chip analyst Craig Berger. "We believe various ...
Barron's
Does the Cloud Need a Specialized Chip?
Tilera, a startup building chips that contain anywhere from 16 to 100 cores, said today it’s raised $25 million in a third round of funding ...
GigaOm
IC Insights boosts 2010 chip growth forecast to 27%
Market research firm IC Insights Inc. increased its estimate for 2010 semiconductor growth, saying it now expects chip revenue to increase 27% ...
EETimes
Interview with Chuck Thacker, PC pioneer
An engineer who helped develop a seminal prototype of the personal computer was recognized for his work even as he hammers away on the next ...
EE Times
HP jabs Apple in war of words over tablets
Hewlett-Packard Co. debuted an advertisement for its own tablet computer platform, slate, one day after Apple Inc. choose the Academy Awards ...
EE Times
Silicon MEMs Microphones Growing 35% in 2009
High-Flying Silicon MEMs microphone installations, which nearly doubled between 2006 and 2008, hit a head wind in 2009, according to the ...
A to Z of Materials
HP sues Asian firms over patents
Hewlett-Packard has filed a suit against four companies based in Hong Kong and Taiwan, accusing the defendants of patent infringement, ...
ZDNet

Does your vapor phase reflow
offer guarantees? Ours Does
ATEK Reflow• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
ATEK Systems Group
Technology News  
Silicon Power Unveils Touch 830 Flash Drive Clad in Stainless Steel
Silicon Power has a range of flash drives and other gear and the thing that most of its items have in common is that the flash drives put as ...
I4U News
Magnetic quantum dots herald way faster computers
A team of scientists at the University of Queensland (UQ) have shown off a semiconductor technology that they claim could revolutionise future ...
Tech Eye
Faster quality testing of photovoltaic modules
Previously many of PV module manufacturers had to queue at solar test institutes, waiting for months before their module testing could ...
Construction and Maintenance
A New Approach to MEMS Construction
Engineers understand the concepts involved in building a micro electromechanical system (MEMS) on a silicon wafer. Successive layers ...
EDN
IME and vendors join forces in 3-dimensional through-silicon via consortium
The Institute of Microelectronics in Singapore (IME) today announced its collaborative partnership with Singapore’s semiconductor industry ...
Nanowerk
Novel material paves the way for next-gen information technology
UQ researchers have successfully demonstrated a futuristic semiconductor technology that will pave the way for the next generation of electrical ...
University of Queensland Australia

Viscom's new wafer inspection system
High accuracy inspection of bare wafers & MEMS
S3088-IIViscom's new desktop system MX100IR inspects bare wafers, MEMS, wafer bonds, SOIs & Flip Chips. Wafers are transparent to the wavelength in the near infrared range generated by patented Si-Thru™ illumination. The MX100IR provides defect detection capabilities of embedded defects…
Viscom Inc.
Corporate News Submit

White Papers Submit
Feb 25, 2010    Equipment for UV processes combined with thin wafer handling
Feb 22, 2010    300 mm Lithography & Bonding Technologies for TSV
Feb 17, 2010    Detection of Faint Defects in CMOS Arrays
Feb 16, 2010    Achieving Thermal Control for Power Devices
Feb 12, 2010    All-surface Inspection for 3D interconnects & TSV Manufacturing
Feb 3, 2010    Optimal Correlation Using Probe Card Test & Analysis System

Today's Sponsor


ShinEtsu Resists - Perfect for 3D packaging,
WLP, TSV and wafer bonding
ShinEtsu ResistFor stress buffer, wafer bonding, copper pillar, RDL and 3D packaging. Low modulus, low temperature cure, low stress; g, h, or i-line sensitive, thick plating resists and dry films. Low dielectric constant; safe solvent; excellent prime-less adhesion.
ShinEtsu


ZESTRON - Your Global Partner for
Environmentally Sound Cleaning Processes
Soldering Made SampleReduce VOC emissions & lower chemistry consumption! Cutting-edge vapor recovery devices, pH-neutral formulations with the expertise and support capabilities of our engineering team ensures up to 46% savings in operating costs. Learn more…
ZESTRON

Quote of the Day
"The future has already arrived. It's just not evenly distributed yet."
William Gibson


Case Study & Application Note
Measure transparent materials
Transparent MaterialsControl the height and volume of your clear flux, epoxy or adhesive deposits with sub-micron precision. Learn more...
Cyber Technologies

Test Your Knowledge
Whats the term for opposition to an electrical current in a conductor?
Answer: Resistance

The latest news... at your fingertips
How can you and your colleagues stay on top? Only if you posess the latest information. Learn how Semiconductor Packaging News can help.
Semiconductor Packaging News

Calendar Submit
Mar 7, 2010 - Photovoltaic
Mar 8, 2010 - Introduction to Photovoltaic Technology
Mar 8, 2010 - Silicon Photovoltaic Cell Technology
Mar 9, 2010 - Introduction to Photovoltaic Technology
Mar 10, 2010 - CSTIC 2010

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