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Sep 19, 2019
Semiconductor Industry Upturn by Early 2020?
Reports of 2Q'19 financials from all of the major OEMs in our 213 company global sample show that their electronic equipment sales declined 1.4% compared to the same quarter of last year. This OEM group's combined sales growth peaked in 2018 and then declined and was still falling in the second quarter of this year. Strong seasonality traditionally overlays monthly world electronic equipment sales. ...
Why DRAM Won’t Go Away
Semiconductor Engineering sat down to talk about DRAM's future with Frank Ferro, senior director of product management at Rambus; Marc Greenberg, group ...
Semiconductor Engineering
Power Packaging for Automotive Semiconductors -- Now and Future
This white paper will provide a brief overview on value creation in the electrification segment, specifically for power semiconductor packaging.
Technical Paper
EUV Annual Perceptions Survey – 2019
8th Annual Perceptions Survey – 2019 (July) of 68 luminaries across 42 different companies about use of EUV. Confidence in EUV remains high * 73% predict ...
Semiconductor Engineering
A Comparison of Bulk and Insitu Ag Epoxy Die Attach Thermal Performance
PADKs Bring Value to Semiconductor Designs
Vertical Laser Assisted Bonding for Advanced 3.5D Chip Packaging
Collaborative Manufacturing in Photonics Packaging
MLE™ Maskless Exposure Technology
Delivering automotive quality IC packaging technology
Die Strength Characterization
Semiconductor Acquisitions Regain Momentum in 2019
This year's merger and acquisition announcements are driven by deals in networking and wireless connectivity ICs and by suppliers adding products for automotive ...
IC Insights
Is Fan-Out packaging still popular? Equipment & material companies are the heartbeats of this ecosystem
"Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established in low-end and high-end ...
3D InCites
Huawei promises smartest 5G phone, but who will be brave enough to buy?
Huawei launches what could be the world's most powerful and feature-packed 5G smartphone, but the fate of the device in Europe will hang on whether it can ...
The Path to Smarter Fabs
Working from the mantra "None of us knows as much as all of us," SEMI invited manufacturers of electronic components and systems to come together and discuss ...
3D InCites
Memory market expected to rebound in 2020
The emerging AI, IoT and 5G applications will be stimulating related chip and component demand, with a rebound likely to take place in the memory market next ...
Semicon Taiwan 2019 opens
Semicon Taiwan 2019 opens today, focusing on cutting-edge technologies, including those concerning 5G and AI, with its forums to feature heavyweight speakers from ...
Supporting the 3D Megatrend in Semiconductor Manufacturing
We've waited a long time for this, and now it's here. There is a 3D megatrend happening in semiconductor manufacturing, as scaling alone does not meet the ...
3D InCites
Sep 17, 2019: Overview of Semiconductor Manufacturing - Santa Clara, CA
Sep 19, 2019: Overview of Semiconductor Manufacturing - Portland, OR
Sep 26, 2019: Overview of Semiconductor Manufacturing - Wakefield, MA
Sep 26, 2019: FREE Webinar - Cleaning Before Conformal Coating
Today's Sponsor
Test Your Knowledge Answer
Which one of these important figures was not born around the same time as Sigmund Freud: Thomas Edison, Vincent Van Gogh, Woodrow Wilson, Karl Marx
See answer below.
Nordson DAGE Joins UK T&I Consortium for High-Volume Battery Manufacturing
Nordson DAGE is delighted to announce its success in joining a group of leading UK companies, including Williams Manufacturing Group and Unipart, to advance the UK's ...
Nordson DAGE
Elements of Indium by Indium Corporation: Wetting
Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal ...
Indium Corporation
High Tg, Ultra Low Viscosity Epoxy meets NASA Low Outgassing Specifications
Master Bond Supreme 112 is a new two part epoxy for bonding, sealing, potting, and impregnation applications. It is a heat curable system with a very low viscosity of 50-200 cps ...
Master Bond
Quote of the Day
Tolerance is the positive and cordial effort to understand another's beliefs, practices, and habits without necessarily sharing or accepting them.
Joshua Loth Liebman
What Year Was It?
Nevada Site of First Underground Nuclear Explosion
What Year
The US detonates a 1.7 kiloton nuclear weapon in an underground tunnel at the Nevada Test Site, a 1375 square mile research center located 65 miles north of Las Vegas.
The day was Sep 19. What year was it?
Cartoon of the Day
"We're installing a USB port so it's easier to recharge you after lunch."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
Which one of these important figures was not born around the same time as Sigmund Freud: Thomas Edison, Vincent Van Gogh, Woodrow Wilson, Karl Marx
Answer: Karl Marx-1818. Freud was born 1856, Edison 1847, VanGogh 1853, Wilson 1856
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