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Datacon Multi-Chip Die Bonder2200 evo!
imageDispenser, die attach unit and flip chip unit in one module! An accuracy of10µm@3s at highest through-put of up to 7,000 UPH! 2200 evo: ultimate flexibility and best cost of ownership. Learn more…
Datacon Technology GmbH
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May 12, 2008

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To X-Ray and Beyond
Dage introduces CT for 3D modeling
imageWe're sure you'll agree that X-ray has changed non-destructive analysis. Take it to the next level with Computerized Tomography. The XD7600NT provides the fastest CT reconstruction in the industry and can be switched from 2D to 3D modes. Learn more…
Dage Precision Industries

Test Your Knowledge
Which one of the following is not in the same time zone as Italy: France, Germany, Libya, Greece
See the answer below.


 
Worried about solder spheres
New White Paper provides solutions.
imageA new production method delivers spheres with a level of quality, repeatability and control not achievable through traditional manufacturing methods. Solder Sphere Perfection, it's not as elusive as you think. Learn more...
Henkel Corporation
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On This Day
May 12, 1996 - IBM and Sears signed a deal to sell Prodigy to an investment group called International Wireless. The two companies cofounded the online company in 1984 and invested more than $1 billion in the venture.


 
Semiconductor Packaging News
Advertising delivers!
Introduce your products or service in our daily newsletter and see how web based advertising delivers results. Monitor the activity on our free tracking software. Learn more...
Semiconductor Packaging News

Cartoon of the Day
image
"We have a birthday in the office today. My request for a new chair is one year old today!"
Copyright © Randy Glasbergen
Top Story  
Reporter's Notebook: The IC industry has matured, so what?
I was pretty annoyed over lunch yesterday, and it wasn't because I'd just broken a front tooth on an olive pit. I had just come from the closing ...
EETimes

An AOI that finds all defects
Improve quality and yield of production
imageTechnology for inspecting includes: Thickfilm, Thinfilm, LTCC, Adhesive, Overglaze, Solar Cells, Gold (Printed, plated), All printed or electroplated Layers. Learn more by clicking …
EPP
Industry News  
Ultra Low-Cost Notebook PCs Poised for Consumer Acceptance as Additive and Educational Devices, But Not as Blockbusters
Ultra low-cost notebook PCs have received considerable attention as a potential solution to the digital divide in developing countries ...
IDC
Tough year ahead for semiconductor industry
The outlook for the semiconductor industry for the remainder of the year is not encouraging given the seemingly imminent recession in the US ...
The Edge Daily
ASE Inc. and ASE Test Announce Anticipated Effective Date of Proposed 'Going Private' Acquisition of ASE Test by ASE Inc
Advanced Semiconductor Engineering, Inc. and its majority-owned subsidiary ASE Test Limited today announced May 30, 2008 as the ...
Ticker Technologies
Chipscale advanced packaging services (V-CAPS) accomplishes major milestone in Vietnam venture
Vietnam-Chipscale Advanced Packaging Services (V-CAPS) announced the official presentation of their investment certificate from the ...
IntellAsia
Multi-Chip Packages
Today’s advanced devices require advanced solutions. Multi-Chip Package (MCP) solutions from Numonyx deliver customers the valuable space ...
Numonyx
Small firms hold key for chip manufacturers
While the opportunity bucket for Indian semiconductor suppliers predominantly includes large MNCs such as the Nokias and Ciscos, the ...
Howrah News Service
Samsung Still Keeps Dominance in TVs, Chips
Uncertainties were unexpectedly high in Samsung Electronics’ global TV and semiconductor businesses, in which the South Korean technology has ...
Korea Times
Small band of Valley employees plays key role for Motorola
Though substantially diminished in number, Motorola Inc.'s Valley employees are playing a key role in helping the battered electronics ...
Arizona Republic
NXP's Claasen: 50 IC companies are still too many
The IC industry will shrink from 450 companies to at most 50, with two to three large specialists in each application domain, according to Theo ...
EETimes
AMD's New Roadmap: Can It Find the Way?
Advanced Micro Devices (AMD) has revamped its server processor roadmap with plans to jump to six and then 12 cores in the first half of 2010 ...
Seeking Alpha
Pinto: Grid Parity Coming Soon
Depending on where you live in the world, grid parity for solar energy is coming soon or has already arrived, according to Mark Pinto, ...
Semiconductor International

Die Bonding Made Easy
Precision X-Form Needles
imageThe DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined from solid stainless steel utilizing DL Technology's patented EZ-FLO design.
DL Technology
Technology News  
Fujitsu climbs volcano to test chips
The top of a dormant volcano in Hawaii might seem like an unlikely place to work on improving the reliability of computer chips, but that's ...
Computerworld New Zealand
Boffins aim to mass produce nanowire circuits
An international team of scientists has developed a new technique for fabricating nanowire photonic and electronic integrated circuits that ...
IT News

Fuel Cell development
White Paper Download
imageFuel Cell development requires precise deposition control & film thickness. Download this white paper to learn about advanced technologies from USI.
Ultrasonic Systems, Inc.

Corporate News Submit
Applied Materials Ships 200th Producer APF System
Applied Materials, Inc. announced the shipment of its 200th Applied Producer APF® system. Providing customers with a unique family of CVD1 ...
Applied Materials
Indium Corporation Announces Promotion
Indium Corporation announces the promotion of Karl Pfluke to the position of Senior Account Manager for the Metals & Chemicals Business ...
Indium Corporation
White Papers Submit
Apr 1, 2008 Flatness measurements
Mar 27, 2008 Photoresist Application with Ultrasonic Coating Technology
Event Calendar Submit
  May 12, 2008  Technology Roadshow for 3D Integration and Packaging
 
  May 12, 2008  2008 SEMATECH Litho Forum
 
  May 13, 2008  HiTEC 2008
 
  May 13, 2008  Knowledge Services Seminar
 
  May 14, 2008  Fundamentals of Product Marketing
 
  May 14, 2008  IET and FSA International Semiconductor Forum
 
  May 14, 2008  Technology Roadshow for 3D Integration and Packaging
 
  May 15, 2008  SEMI Arizona Breakfast Forum
 
Most Popular Most read news from May 9, 2008
Who will buy Jazz
Jazz Technologies Inc., which is on the block, has yet to announce a buyer. Earlier this year, foundry specialist Jazz said that it had ...
EETimes
Actual data shows March global chip market up 7.3%
The global market for semiconductors was $25.51 billion in March according to data from World Semiconductor Trade Statistics (WSTS), ...
EETimes
Today's Sponsor

YESTech's X-Ray Inspection Systems
Yield Enhancement Solutions
imageYESTech offers a versatile and comprehensive line of X-Ray inspection systems providing fast and complete inspection of critical components, packages and other electronic assemblies. Learn more…
YESTech


 
Case Study & Application Note
Measure transparent materials
image Control the height and volume of your clear flux, epoxy or adhesive deposits with sub-micron precision. Learn more...
Cyber Technologies

Quote of the Day
“When you tell a customer to move her mouse to the top of the screen, and she picks up the mouse and puts it at the top of the monitor, you know it's going to be a long hour.”
Tim Hapy of Wizard Electronics on computer support


 
Stop Drop Testing…
Bond test at high-speed instead
imageDage, the leader in bond testing technology, has gone high-speed. The 4000HS high-speed bond tester is an exceptional alternative to drop testing and is fully JEDEC compliant. Once again, Dage is setting the standard with brittle fracture joint analysis. Learn more…
Dage Precision Industries

Test Your Knowledge
Which one of the following is not in the same time zone as Italy: France, Germany, Libya, Greece
Answer: Greece (1 hour ahead of Italy)

The latest news... at your fingertips
How can you and your colleagues stay on top? Only if you posess the latest information. Learn how Semiconductor Packaging News can help.
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