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Aug 22, 2019
GlobalFoundries, Arm Close in on 3D Chip Integration
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Chipmaker GlobalFoundries and semiconductor IP firm Arm say they’ve completed the design for a test silicon 3D chip using technology capable of making a million 3D connections per square millimeter. Their technology binds two wafers of chips together with densely packed vertical copper links. The companies see it as a path to boosting the movement of data for applications such as machine ...
IEEE Spectrum
The Need For and Value of Semiconductor Industry Organizations
Recognizing the need fand value of semiconductor industry organizations, in 1994, Jodi Shelton and CEOs of fabless IC companies founded the Fabless Semiconductor ...
3D InCites
Delivering automotive quality IC packaging technology
Growth in the automotive market comes with demanding performance and quality requirements. New enabling technologies means strategic partnerships with ...
Technical Paper
Tempered Growth Forecasts and Longer Range Glimmers of Hope
The IMF (International Monetary Fund) stated in its July update of the World Economic Outlook. "We are revising downward our projection for global growth to 3.2% ...
SEMI
Vertical Laser Assisted Bonding for Advanced 3.5D Chip Packaging
Collaborative Manufacturing in Photonics Packaging
MLE™ Maskless Exposure Technology
Delivering automotive quality IC packaging technology
Die Strength Characterization
False Fine Leak Testing of Hermetic Packages
Power Packaging for Automotive Semiconductors -- Now and Future
Chiplets: Open Market or Joint Venture?
"Chiplet" has become a buzzword and like most of its kind, the success of the buzzword predates the widespread availability of the product by a large margin. However, ...
Semiconductor Engineering
More 5G Handsets Hit the Chinese Market
The third quarter has always been the traditional peak season for consumer electronics in China. After half a year of market downturn, major mobile phone manufacturers ...
EE Times
IBM Debuts DDR Alternative
IBM defined at Hot Chips a new interface for the 2020 version of its Power 9 CPUs. The Open Memory Interface (OMI) will enable packing on a server more main memory ...
EE Times
Samsung, SK hynix slip in chip sales in H1
South Korea's two biggest memory chip makers Samsung Electronics and SK hynix slipped to second and fourth place, respectively, in a global ranking of chip sales due ...
The Korea Herald
ChipMOS, OSE to post sales growth in 2H19
A ramp-up in orders for NAND flash memory will boost revenues at backend houses ChipMOS Technologies and Orient Semiconductor Electronics (OSE) in the second ...
Digitimes
AI's Memory Problem
Artificial intelligence, which allows computers to learn and perform specific tasks such as image recognition and natural language processing, is loosely inspired ...
EE Times
GlobalFoundries, Arm Close in on 3D Chip Integration
Chipmaker GlobalFoundries and semiconductor IP firm Arm say they've completed the design for a test silicon 3D chip using technology capable of making a million 3D ...
IEEE Spectrum
Aug 29, 2019: FREE Webinar - Surface Cleanliness Assessment
Sep 17, 2019: Overview of Semiconductor Manufacturing - Santa Clara, CA
Sep 19, 2019: Overview of Semiconductor Manufacturing - Portland, OR
Sep 26, 2019: Overview of Semiconductor Manufacturing - Wakefield, MA
Today's Sponsor
Test Your Knowledge Answer
What is Valentina Tereshkova's claim to fame?
See answer below.
Indium Features WS-446HF Flip-Chip and Ball-Attach Flux at SEMICON Taiwan
Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei, Taiwan. WS-446HF flux  ...
Indium Corporation
CyberOptics to Demonstrate AVLS3 and NanoResolution MRS Sensors at SEMICON Taiwan
CyberOptics® Corporation will exhibit at SEMICON Taiwan, September 18 to 20, 2019 at the Taipei Nangang Exhibition Center in booth # L0310. During the show, the ...
CyberOptics® Corporation
Trymax Receives Order from a Leading-Edge Photonics Research Organization
Trymax Semiconductor Equipment BV (Trymax) announced it has received an order from NanoLab@TU/e of Eindhoven University of Technology. The NEO 200A series ...
Trymax Semiconductor Equipment BV
Quote of the Day
"Just think how happy you would be if you lost everything you have right now, and then got it back again."
Anonymous
What Year Was It?
Althea Gibson First African-American on U.S. Tennis Tour
What Year
The United States Lawn Tennis Association accepts Althea Gibson into their annual championship at Forest Hills, New York, making her the first African-American player to compete in a U.S. national tennis competition.
The day was Aug 22. What year was it?
Cartoon of the Day
Cartoon
"I'll be a little late for our meeting. I'm trying to download some enthusiasm from the cloud."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
What is Valentina Tereshkova's claim to fame?
Answer: She was the first woman in space on June 6, 1963 and is now a retired Russian cosmonaut, engineer, and politician.
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