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Mar 22, 2019
Making Chip Packaging Simpler
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The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing processes, packaging is taking on a much broader and more strategic role. Many of the new packages are application-specific, and they are an integral part of the system ...
Semiconductor Engineering
North American Semiconductor Equipment Industry Posts February 2019 Billings
North America-based manufacturers of semiconductor equipment posted $1.86 billion in billings worldwide in February 2019. The billings figure is 1.7% lower than the ...
SEMI
Gold Planar Bumps for Flip Chip Bonding with Challenging Applications
Achieving consistent, quality Au Planar bumps has been a challenge that the industry has been trying to meet for years. This case study explore these difficult ...
Technical Paper
Intel Lakefield Uses 3D Stacking; SEMI Europe’s 3D & System Summit
At CES 2019, Intel previewed a new client platform, code-named "Lakefield". It featured the first iteration of its new innovative Foveros 3D packaging technology. ...
3D InCites
Challenges in Automotive Package Development
3 Ways to Increase Plasma Uniformity
UV-Adhesive Bonding for Stud-pull
Role of Sockets in IC Product Life Cycle
MRS Sensor Technology for Challenging Measurement & Inspection
Gold Planar Bumps for Flip Chip Bonding with Challenging Applications
Sequential Infiltration Synthesis: A New Lithographic Enhancement Method
A Very Noisy Signal: Intel Circuit Squashes Side-Channel Sniffing
The Georgia Tech team concluded that it would take an attacker up to 3,579 times longer to figure out the encryption key for their circuit, compared with a standard ...
IEEE Spectrum
China smartphone maker Xiaomi beats profit view, sees more global expansion
Chinese smartphone maker Xiaomi Corp said its fourth-quarter net profit more than tripled to $275.59 million, on stronger revenue. That exceeded the average ...
Reuters
EUV Mask Readiness Challenges
Left to right, Harry Levinson, principal at HJL Lithography, Emily Gallagher, principal member of the technical staff at Imec; Chris Spence, vice president of advanced ...
Semiconductor Engineering
Slow And Cautious Start To 2019 For Memory Manufacturers
Both NAND and DRAM prices began dropping in the second half of 2018 after a couple years at record highs. Product oversupply and excess inventories are signaling ...
Semiconductor Engineering
Samsung Elec leapfrogs to No. 2 in global foundry market Q1
Samsung Electronics which in 2017 vowed to make foundry business No. 2 in the world achieved the goal in less than two years as it is expected to finish the first quarter ...
Pulse
ASE to roll out AiP technology for 5G mmWave
Advanced Semiconductor Engineering (ASE) under ASE Technology Holding will have its antenna-in-package (AiP) technology ready for volume production for 5G mmWave ...
Digitimes
Semiconductor shares rise as Micron predicts memory recovery
Shares of semiconductor companies worldwide rose, after U.S. chipmaker Micron Technology Inc predicted a recovery in a memory market saddled with oversupply as ...
Reuters
Falling NAND flash prices to drive SSD adoption in enterprise, datacenter apps
NAND flash prices continue to fall dragging down SSD prices further, which will be driving the adoption of SSDs in enterprise and datacenter applications, according ...
Digitimes
Mar 21, 2019: FREE Webinar - Should You Clean PCBs?
Mar 25, 2019: Design for Reliability Conference
Mar 31, 2019: ISS Europe 2019
Apr 8, 2019: Overview of Semiconductor Manufacturing - Hsinchu, Taiwan
Today's Sponsor
Test Your Knowledge Answer
What's the thickness of Earth's atmosphere?
See answer below.
Yxlon and Japanese Nagoya Electric Works announce collaboration for the Semicon Industry
YXLON International have announced a collaboration with the Japanese company Nagoya Electric Works (NEW). The collaboration includes the development and distribution ...
YXLON International
EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon
EV Group (EVG) announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo ...
EV Group
New Vishay Space-Saving Ultrabright LEDs Produce High Luminous Flux and Intensity
New Yorker Electronics is now distributing the new Vishay Optoelectronics VLD.1232 Series of Space-Saving Blue and True Green Ultrabright LEDs. These semiconductors ...
New Yorker Electronics
Meyer Burger awarded contract for its MAiA® 6.1 cell coating equipment
Meyer Burger Technology Ltd announced the successful conclusion of an order from an existing, major Asian customer for its high performance MAiA® 6.1 platform which ...
Meyer Burger Technology Ltd
Quote of the Day
"Age is not a particularly interesting subject. Anyone can get old. All you have to do is live long enough."
Groucho Marx
What Year Was It?
Triangle Shirtwaist Fire in New York City
What Year
In one of the darkest moments of America's industrial history, the Triangle Shirtwaist Company factory in New York City burns down, killing 145 workers.
The day was Mar 25. What year was it?
Cartoon of the Day
Cartoon
"Don't think of me as a 54 year old applicant. Think of it as getting two 27 year olds for the price of one!"
Copyright © Randy Glasbergen
Test Your Knowledge Answer
What's the thickness of Earth's atmosphere?
Answer: The Earth's atmosphere is an extremely thin sheet of air extending from the surface of the Earth to the edge of space. The Earth is a sphere with a roughly 8000 mile diameter; the thickness of the atmosphere is about 60 miles.
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