Semiconductor Packaging News
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October 20, 2014
Circulation Over 35,000
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What Year Was It?
Congress Investigates Reds in Hollywood
Congress Investigates Reds in Hollywood
The notorious Red Scare kicks into high gear in Washington, as a Congressional committee begins investigating Communist influence in one of the world's richest and most glamorous communities: Hollywood.

The day was October 20, but what year was it?
Cartoon of the Day
"Can you check my calendar and see if I'm scheduled to give a damn today?"
Copyright © Randy Glasbergen
Top Story
IBM to Pay Globalfoundries $1.5 Billion to Take Chip Unit
IBM Corp said it would hive off its loss-making semiconductor unit to contract-chipmaker Globalfoundries Inc to focus on cloud computing and big data analytics. IBM will pay Globalfoundries $1.5 billion in cash over the next three years to take the chip operations off its hands ...
Industry News
TSMC to start production of 16nm process products in 2Q15
Taiwan Semiconductor Manufacturing Company (TSMC) will begin volume production of 16nm FinFET process products in the second quarter or early third quarter ...
Semiconductor Capital Spending to Increase by More Than 11% in 2014
Worldwide semiconductor capital spending is projected to total $64.5 billion in 2014, an increase of 11.4% from 2013 spending of $57.8 billion, according to ...
IMAPS 2014: The Future of Packaging is System Integration
The annual International Microelectronics and Packaging Society (IMAPS) International Symposium has always focused more on advancements in mainstream ...
3D InCites
Bottom-Up Self Assembly of Graphene Holds Promise for Spintronics
Not all graphene is alike. The way in which graphene is produced determines in large measure how it can be applied. The aim, of course, has been to produce ...
IEEE Spectrum
3D By Design: Exploring Viable Path Finding
Fruitful path finding eventually identifies solutions that are viable for mechanical, electrical, thermal, and cost (METC) requirements. Hopefully, ...
3D InCites
Memory Directions Uncertain
Semiconductor Engineering sat down with a panel of experts to find out what is happening in world of memories. Taking part in the discussion are Charlie ...
Semiconductor Engineering
TSMC shares up on Q3 results, optimistic outlook
Shares of Taiwan Semiconductor Manufacturing Co. moved higher after the company reported better-than-expected earnings for the third quarter, dealers said. ...
Focus Taiwan News
Chipmaker SanDisk forecasts lower revenue
Chipmaker SanDisk Corp forecasts current-quarter revenue below analysts' estimates due to supply constraints. SanDisk's shares fell 5% in extended ...
AMD’s First Female CEO Seeks Speedy Break With Past Woes
For a glimpse of the turnaround skills Lisa Su will have to put to work as new chief executive officer of chipmaker Advanced Micro Devices Inc. (AMD), ...
Apple Debuts Next-Gen Tablets, PC
As had been expected, Apple released updates to its iPad, PC, and operating systems during a live event. The iPad Air 2, iPad Mini 3, iMac, and Apple Mini ...
EE Times
Big Data In The Fab
A modern fab is a very complicated place, with a huge amount of information required to correctly process wafers. But even more data is created to characterize ...
Semiconductor Engineering
DDR Memory Testing Using Interposers
If you're a PCB layout designer, you've probably heard one or more test engineers complain, "Why can't you lay out the board so that it can be tested?" All ...
EE Times
European chipmakers Fighting back
Nestled in the foothills of the French Alps, Grenoble feels more like a skiing base camp than the centre of one of Europe's hottest technology clusters. ...
The Economist
TSMC Capex to Exceed $10B in FinFET Ramp-Up
Taiwan Semiconductor Manufacturing Co. said that it aims to increase its capital expenditures next year to more than US$10 billion as it accelerates its ramp-up ...
EE Times
Press Releases Submit
Indium Corporation's Mackie Honored by IMAPS
Indium Corporation's Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, was presented with the 2014 ...
Indium Corporation
MNBS 2014: from R&D to innovation
Yole Finance, the corporate finance services unit of Yole Développement collaborates with the European Commission and the Laboratory for Analysis ...
Yole Développement
White Papers Submit
High Capability Die Attach Film for Small Die Applications
Challenges in Supply of Ultralow Alpha Emitting Solder Materials
Enhancing System Functionality & Performance with the Right Packaging Solutions
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly
2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment
How Ultrasonics Finds the Smallest Bonded Wafer & Device Defects
Core PDN Analysis of Core & Coreless Substrates
Calendar Submit
Oct 22, 2014 - Conformal Coating & Precise Fluid Dispensing Process Technologies Workshop
Oct 23, 2014 - Technical Study: Concentration Monitoring & Control Techniques
Oct 28, 2014 - Intro to IC Design & Fabrication
Oct 28, 2014 - 'Wearable Electronics' - iMAPS New England Chapter Technical Meeting
Nov 3, 2014 - Understanding Semiconductor Technology & Business
Nov 12, 2014 - Understanding Semiconductor Technology & Business
Nov 13, 2014 - Overview of Semiconductor Manufacturing Austin, TX
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Quote of the Day
"Knowledge speaks, but wisdom listens."
Jimi Hendrix
Test Your Knowledge
What is Canada's highest mountain?
Answer: Mount Logan
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