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Top Story October 24, 2016
2.5D Surprises And Alternatives
Semiconductor Engineering sat to discuss advanced packaging issues with Juan Rey, senior director of engineering for Calibre at Mentor Graphics; Max Min, senior technical manager at Samsung; and Lisa Minwell, eSilicon's senior director of IP marketing. What follows are excerpts of that conversation. SE: Now that we're seeing real 2.5D and fan-out designs ...
Semiconductor Engineering

Industry News
TSMC, GF/Samsung Battle at 7nm
TSMC will go head-to-head with the partnership of IBM, Globalfoundries and Samsung to publicly detail rival 7nm processes at a technical conference in December. ...
EE Times
iPhone 7: Apple underwent a strategic change by selecting TSMC's inFO platform
Each year, Apple integrates more and more innovative technologies in its iPhone products. This year, with the new iPhone 7 and its A10 processor, the leading company ...
Yole Développement
The End Of Moore's Law Opens The Door For Open-Source
Moore's Law, as defined by Intel's Gordon Moore in 1965, is the predictive business model that "computing would dramatically increase in power, and decrease ...
Qualcomm nears $37 billion deal to buy NXP Semiconductors: source
Qualcomm Inc is nearing a deal to acquire NXP Semiconductors NV for around $37 billion, a person familiar with the matter said on Friday, as the U.S. company seeks ...
Qualcomm and NXP Semiconductor reportedly agree on deal at $110 per share
Qualcomm and NXP Semiconductor have agreed on a deal that will see the mobile chip giant acquire NXP at a price of $110 per share, according to CNBC. The deal was first ...
Breaking through fab barriers
Fast track implementation of new wafer fab designs is already under way to meet complex specifications of the future. Through construction of two of the world's ...

The Week In Review: Manufacturing
At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and ...
Semiconductor Engineering
Apple's 'A10' iPhone Chip Smokes the Competition, Says Linley Group
Linley Gwennap, director of the esteemed chip industry research firm that bears his name, and editor of its newsletter, "Mobile Chip Report," Thursday offered up ...
Globalfoundries China fab put on hold
The government of Chongqing has put on hold a deal with Globalfoundries for a joint venture 12-inch fab, according to industry sources. No progress has been made ...
North American Semiconductor Equipment Industry Posts September 2016 Book-to-Bill Ratio of 1.05
North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ...
DRAM Pushes Up Chip Forecast
The market for integrated circuits could eke out 1% revenue growth this year and 4% in 2017, thanks in part to a rebounding DRAM market, according to the latest ...
EE Times
Creating An Accurate FEOL CMP Model
For decades, semiconductor manufacturers have used chemical-mechanical polishing (CMP) as the primary technique for the smoothing and leveling (planarization) of ...
Semiconductor Engineering

Press Releases
Brooks Instrument Experts Discuss Mass Flow Technology at Institute for Electronics and Nanotechnology
Several experts in mass flow measurement, control and vaporization technologies from Brooks Instrument participated in an informative industry seminar recently at ...
Brooks Instrument
ams schedules 2017 multi-project wafer starts for analog foundry customers
ams AG announced its fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an updated schedule for 2017. The prototyping ...
ams AG
Akrion Systems Improves Process Capabilities on 450mm Wafers
Demonstrating significant progress in the development of next-generation technologies for the industry transition to computer chip production using 450mm wafers ...
Akrion Systems
Test Your Knowledge
The means whereby the deterioration encountered in natural aging is artificially reproduced and hastened is called what?
See answer below.
White Papers
Heat sinking through socket contact technologies
New Backside Protection Film Boosts WLCSP Reliability
Ultrasonic Inspection of Bonded Wafers
3D Glass Solutions Enables System on a Chip
Jetting Technology Improves Your Process
Panel Level Packaging Consortium
Integrated Fan-out Technology
Quote of the Day
"If an elderly but distinguished scientist says that something is possible, he is almost certainly right; but if he says that it is impossible, he is very probably wrong."
Arthur C. Clarke
What Year Was It?
Pablo Picasso Born
Pablo Picasso Born
Pablo Picasso, one of the greatest and most influential artists of the 20th century, is born in Malaga, Spain.
The day was Oct 25. What year was it?
Oct 25, 2016: SEMICON Europa
Nov 1, 2016: "Hermetic Packaging of Implantable Bio-Medical Devices: Development, Evolution...Future"
Nov 14, 2016: Overview of Semiconductor Manufacturing/ Portland, Or
Nov 14, 2016: MEPTEC Semiconductor Roadmaps Symposium/ San Jose, CA
Nov 17, 2016: Overview of Semiconductor Manufacturing! Austin, TX
Nov 30, 2016: Wire Bonding Certification
Dec 5, 2016: Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules
Cartoon of the Day
"If we learn from our mistakes, shouldn't I try to make as many mistakes as possible?"
Copyright © Randy Glasbergen
Test Your Knowledge Answer
The means whereby the deterioration encountered in natural aging is artificially reproduced and hastened is called what?
Answer: Accelerated Aging