Semiconductor Packaging News
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September 19, 2014
Circulation Over 35,000
Test Your Knowledge
What is the name of the meeting of industrial nations in 1987 that called for the elimination of ozone-depleting substances?
See answer below.
What Year Was It?
Nevada Site of First Underground Nuclear Explosion
Nevada Site of First Underground Nuclear Explosion
The US detonates a 1.7 kiloton nuclear weapon in an underground tunnel at the Nevada Test Site, a 1375 square mile research center located 65 miles north of Las Vegas.

The day was September 19, but what year was it?
Cartoon of the Day
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"I want you to find a bold and innovative way to do everything exactly the same way it's been done for 25 years!"
Copyright © Randy Glasbergen
Top Story
Major Trends Shaping Future of IC Industry
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I caught IC Insights' Bill McClean's talk at the IMAPS Arizona luncheon. In addition to predicting a steady growth trend for the semiconductor industry that will reach double digits by 2016, followed by a cyclical downturn to -1%in 2017, McClean also discussed some major trends ...
3D InCites
Industry News
TSMC has faith in maintaining global lead in 28nm process
Taiwan Semiconductor Manufacturing Co. said that it is confident it will maintain the lead it holds over its global peers in the advanced 28 nanometer ...
Focus Taiwan News
A new contender for 'post silicon' electronics?
Harvard researchers have engineered a quantum material called a correlated oxide to perform comparably with the best silicon switches. They achieved a ...
Compound Semiconductor
SEMI Posts August 2014 Book-to-Bill Ratio of 1.04
North America-based manufacturers of semiconductor equipment posted $1.35 billion in orders worldwide in August 2014 and a book-to-bill ratio of 1.04 ...
SEMI
TSMC still confident in maintaining global lead
Taiwan Semiconductor Manufacturing Co. said that it is confident it will maintain the lead it holds over its global peers in the advanced 28 nanometer ...
The China Post
18 Views of the Silicon Horizon
The semiconductor industry will see "good but not great growth," with rates in the high single digits, in 2014 and beyond, according Bill McClean, president ...
EE Times
Don't Damage Thin Devices When Testing
Everyone wants thin, light mobile devices. That's why the newly released iPhone 6 is thinner than its predecessors. Thinner devices are driving the ...
EBN
Why Investments At Advanced Nodes Matter
Despite all the talk about rising costs of development, uncertainties about lithography and talk about the death of Moore's Law, a record number of ...
Semiconductor Engineering
SEMI Releases Second Quarter 2014 Worldwide PV Equipment Market Statistics Report
SEMI reported the worldwide PV manufacturing equipment billings and bookings for the second quarter of 2014. Worldwide billings increased to $319 ...
SEMI
Is IBM fab deal sealed?
The seemingly on-again, off-again negotiations between IBM and GlobalFoundries over IBM's microchip manufacturing operations may have reached a ...
Albany Times Union
EDA Vendors Prepare For 7nm
It's not too early to begin looking at design tools for the 7nm, even though the node is not expected to be production-ready until later this decade. While ...
Semiconductor Engineering
How To Buy Used Fab Tools
Buying used equipment is a good way to find viable tools at reasonable prices. But the used equipment market is not a simple place to shop for good deals. ...
Semiconductor Engineering
3D IC Notes from SEMICON Taiwan 2014
I attended the 3D IC Technology Forum at SEMICON Taiwan 2014, where many of the discussions focused on the latest memory announcements in 3D ICs from ...
3D InCites
Asia-Pacific IC Usage Domination Growing
Asia-Pacific is the dominant market for ICs for most products categories. The exceptions being Europe, leading in the automotive sector, and the ...
EE Times
Press Releases Submit
Optomec Signs Agreement with Multistation
Optomec announced that it has signed an agreement with Multistation SAs to be its representative in France for its LENS family of 3D Metal Printers. The versatile ...
Optomec
AI Technology, Inc (AIT) Develops Temporary Bonding Wax
As devices such as cell phones, cameras, and tablets continue to shrink, there is also a big push to shrink the "thickness" of these devices, and hence ...
AI Technology, Inc (AIT)
Graphene Market is Forecast to Reach $149.1 Million Globally by 2020
According to a new report by Allied Market Research titled, "Global Graphene Market -- Industry Analysis, Trends, Share, Opportunities and Forecast ...
Allied Market Research
Global LED Market is Expected to Reach $42.7 Billion by 2020
According to a new market research report by Allied Market Research titled, "Global Light Emitting Diode (LED) Market, 2013 - 2020" the global LED ...
Allied Market Research
White Papers Submit
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly
2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment
How Ultrasonics Finds the Smallest Bonded Wafer & Device Defects
Core PDN Analysis of Core & Coreless Substrates
Dispenser Provides Volumetric Scan and Process Feedback
Vertical Level Socket Testing
Designing in Thermal Control for Power Modules
Calendar Submit
Sep 18, 2014 - Failure and Yield Analysis Short Course (San Jose)
Sep 18, 2014 - Medical Electronics Symposium
Sep 18, 2014 - Cleaning Before Conformal Coating
Oct 14, 2014 - 'Human Error Prevention' Seminar
Oct 23, 2014 - Technical Study: Concentration Monitoring & Control Techniques
Oct 28, 2014 - Intro to IC Design & Fabrication
Nov 3, 2014 - Understanding Semiconductor Technology & Business
Today's Sponsor
Quote of the Day
"We make a living by what we get, we make a life by what we give."
Sir Winston Churchill
Test Your Knowledge
What is the name of the meeting of industrial nations in 1987 that called for the elimination of ozone-depleting substances?
Answer: Montreal Protocol
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