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Jan 16, 2019
More 2.5D/3D, Fan-Out Packages Ahead
A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advanced ...
Semiconductor Engineering
VIEWPOINT 2019: Thomas Uhrmann, Director of Business Development, EV Group
The semiconductor industry is experiencing a profound shift in what is driving its future innovation. Increasingly, fewer device manufacturers are able to follow the path of "More Moore" and lithographically scale to smaller design nodes due to the exponentially rising costs associated with optical and EUV lithography ...
EV Group
IC Socket Footprint -- Why is it important?
An IC socket can be defined as an electromechanical device, which provides a removableinterface between the IC package and the system circuit board with minimal effect ...
Technical Paper
ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities
SEMI held its annual Industry Strategy Symposium (ISS 2019) at the Ritz Carlton in Halfmoon Bay, CA January 6-9, 2019. Many high-level executives represented key ...
3D Incites
Gold Planar Bumps for Flip Chip Bonding with Challenging Applications
Sequential Infiltration Synthesis: A New Lithographic Enhancement Method
Achieving Low Voiding for Power Devices
Socket Cleaning on Handlers without Auto-Clean Functions
Active Optical Cable Transceiver Packaging Trends
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation
Multichip Integrated Copper Clip Package Technology
Weak year ahead for TSMC
Rising chip demand for data centers, AI and IoT applications will still fail to offset the impact of falling demand for Apple's iPhones and other smartphones on 2019 ...
In CEO Search, Intel Still Hasn't Found What It's Looking For
Intel Corp. has been trying to fill the most prominent role in the $400-billion chip industry for more than six months. The company's board still hasn't found what ...
Chasing Reliability In Automotive Electronics
Assuring reliability in automotive electronics has set off a scramble across the semiconductor supply chain and unearthed a list of issues for which there is ...
Semiconductor Engineering
What AI Is... And Isn't
AI is very good at some things. It may never be good at others. The challenge is figuring out where it can help the most, and then making the cost calculation ...
Semiconductor Engineering
NAND flash chipmakers slowing down capacity expansion, says DRAMeXchange
The global market for NAND flash memory will remain in oversupply in 2019, as the outlook for end-market demand stays weak, according to DRAMeXchange. NAND flash ...
Flash Capex Projected to Decline
Memory chipmakers are expected to shell out about $26 billion on flash memory capex in 2019, a decline of about 18% from an estimated $31.9 billion last year ...
EE Times
8K taking off
A number of IT vendors and display device makers highlighted a variety of end-market 8K display products at the recently concluded CES 2019, heralding that the 8K ...
Jan 22, 2019: 'The Challenges of Quick Turn Automated Conformal Coating' & 'Lead Time Apocalypse'
Jan 23, 2019: SEMICON Korea 2019
Jan 28, 2019: SEMI 3D & Systems Summit
Feb 18, 2019: CMOS, BiCMOS and Bipolar Process Integration
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Test Your Knowledge Answer
What was the name amazon.com going to be named at first?
See answer below.
NAURA Akrion Ships First Wet Stations for China Market
NAURA Akrion Inc recently shipped multiple batch immersion wet processing stations to China, the first process equipment to ship there since its purchase ...
NAURA Akrion Inc
Indium Corporation Experts Honored with IMAPS 2018 Best Paper Award
Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS' 51st International Symposium ...
Indium Corporation
Brooks Instrument Licenses DLI Vaporizer Technology to Ceres Technologies
Brooks Instrument has licensed its direct liquid injection (DLI) vaporizer technology to Ceres Technologies, Inc., headquartered in Saugerties, NY. The Brooks ...
Brooks Instrument
Quote of the Day
"There is no more need to learn computer terminology to use a computer than there is to learn the names of your digestive enzymes in order to enjoy a good meal."
Michael Rothenberg
What Year Was It?
Prohibition Takes Effect
What Year
The 18th Amendment to the U.S. Constitution, prohibiting the "manufacture, sale, or transportation of intoxicating liquors for beverage purposes," is ratified on this day.
The day was Jan 16. What year was it?
Cartoon of the Day
"Johnny Cash, Eddie Money, Andrew Gold, Bread, Big & Rich... I think I found the boss's iPod."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
What was the name amazon.com going to be named at first?
Answer: Jeff Bezos wanted to name his new Web venture "Cadabra" -- as in "abracadabra." But his attorney convinced him that this magical moniker sounder a bit too much like "cadaver." Reluctantly, Bezos went with his second choice: Amazon.com.