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Dec 13, 2018
Intel Steps Toward Heterogeneous Integration
Intel demonstrated a new 3D packaging technology for face-to-face stacking of logic, scheduled to be available in the second half of next year. The company also tipped a new processor microarchitecture and a new graphics architecture on a day when its chief architect laid out the company's vision for future computing architectures. The 3D packaging technology, known as Foveros, is the culmination of two ...
EE Times
Searching for the Perfect Artificial Synapse for AI
What's the best type of device from which to build a neural network? Of course, it should be fast, small, consume little power, have the ability to reliably store ...
IEEE Spectrum
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation
Article describes a process for the uniform deposition of electroless nickel on sputtered or vapor deposited aluminum pads in various crystal orientations, and, secondarily ...
Technical Paper
The Growing Promise Of Printed Electronics
Printing electronics using conductive ink rather than lithography is starting to move out of the research phase, with chipmakers now looking at how to commercialize ...
Semiconductor Engineering
Achieving Low Voiding for Power Devices
Socket Cleaning on Handlers without Auto-Clean Functions
Active Optical Cable Transceiver Packaging Trends
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation
Multichip Integrated Copper Clip Package Technology
IC Socket Footprint -- Why is it important?
Surface Mount Guidelines for Amkor's DRMLF®
U.S. tribunal to review ruling on Qualcomm request for iPhone ban
The U.S. International Trade Commission (ITC) said it would review a ruling that a ban on imports of some iPhones into the United States was not in the public interest ...
China's hacking against U.S. on the rise
A senior U.S. intelligence official said that Chinese cyber activity in the United States had risen in recent months, targeting critical infrastructure in what may be ...
Samsung to shut mobile phone plant in China's Tianjin
Samsung Electronics will cease operations at one of its mobile phone manufacturing plants in China, the company said, as its sales in the world's biggest smartphone ...
Anritsu, Qualcomm Connect Using 5G Standalone
While initial 5G connections are likely to be a combination of existing LTE and 5G New Radio, work is well underway to produce connections that use 5G NR only. To that ...
EE Times
Fab Tool Sales Expected to Decline in 2019
After what is expected to be a second-straight record sales year in 2018, the semiconductor equipment market is projected to decline by 4% next year before recovering ...
EE Times
Transistors Keep Moore's Law Alive
An Intel fellow explores the outlook for Moore's Law in this first in a series of articles, focusing here on changes in logic processes that led us to the present. Intel ...
EE Times
TSMC to expand 8-inch fab capacity for robust demand for automotive, IoT
Taiwan Semiconductor Manufacturing Company (TSMC) is looking to expand its 8-inch fab capacity to meet strong chip demand for automotive electronics, IoT and ...
NAND flash price rebound to be short-lived
NAND flash prices have rebounded slightly and are expected to register a short-lived rally prior to the Lunar New Year holiday, according to industry sources. NAND flash ...
Dec 12, 2018: SEMICON Japan
Jan 6, 2019: Industry Strategy Symposium--ISS 2019
Jan 8, 2019: SEMI Pavilion at CES 2019
Jan 14, 2019: Overview of Semiconductor Manufacturing - Munich, Germany
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Test Your Knowledge Answer
Whose army were canned foods developed to feed?
See answer below.
Semiconductor Equipment Sales Forecast: $62 Billion in 2018 A New Record
Releasing its Year-End Total Equipment Forecast at the annual SEMICON Japan exposition, SEMI reported that worldwide sales of new semiconductor manufacturing equipment ...
LiFi: mainstream or niche technology?
LiFi represents a strong potential technology, announces Yole and PISEO. However, both partners do see two major challenges that could prevent the technology from ...
Yole Développement
Acu-Gage wins Patent for ACU-THIK™ Proprietary Thickness Measuring Technology
Acu-Gage Systems has been awarded Patent No. 10,088,304 by the United States Patent and Trademark Office for our ACU-THIK™ precision thickness measuring system. ...
Acu-Gage Systems
Sputtering or Chemical Plating?
More than twenty years ago, material manufacturers were competing with each other to develop adhesiveless copper clad laminates for the next generation flexible circuits. ...
DKN Research
Quote of the Day
"Talent is cheaper than table salt. What separates the talented individual from the successful one is a lot of hard work."
Stephen King
What Year Was It?
Amundsen Reaches South Pole
What Year
Norwegian Roald Amundsen becomes the first explorer to reach the South Pole, beating his British rival, Robert Falcon Scott.
The day was Dec 14. What year was it?
Cartoon of the Day
"I guess arcade tokens are better than no bonus at all."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
Whose army were canned foods developed to feed?
Answer: Napoleon's