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Full automation bond testers
A Sigma eliminates human error and comes with game-changing automation capabilities, robotic handlers, and smart vision cameras for operator-free bond testing and analysis. Learn more.
xyztec
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| Press Release |
June 18, 2026 - Click the title to read the full press release.
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor ...
Amkor Technology, Inc.
June 18, 2026
TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor ...
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May 21, 2026
Amkor Technology Expands U.S. Advanced Packaging Footprint with Additional Land in Arizona
Amkor Technology, Inc. reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment ...
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January 21, 2026
Revolutionizing IC Packaging with High-Density RDL Technology
Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability.
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November 25, 2025
Package Assembly Design Kits: The Future of Advanced Package Design
This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity.
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October 8, 2025
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona
Amkor Technology, Inc., in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced ...
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October 1, 2025
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
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September 3, 2025
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
Amkor Technology, Inc. announced revised plans for the location of the company's new semiconductor advanced packaging and test facility in Arizona. The facility will be ...
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August 13, 2025
Eliminating Interfacial Delamination in High-Power Automotive Devices
This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
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July 31, 2025
Amkor Technology Reports Financial Results for the Second Quarter 2025
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2025. Second Quarter 2025 Highlights Net sales $1.51 billion; Gross profit $182 million ...
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July 16, 2025
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
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Fusion and Hybrid Bonding Experts
EVG's industry-leading process solutions, expertise and HI Competence Center accelerate the development and implementation of heterogeneous integration technology.
EV Group
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