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TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology, Inc.
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| Press Release |
May 21, 2026 - Click the title to read the full press release.
Amkor Technology, Inc. reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment ...
Amkor Technology
July 27, 2026
Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging
Amkor Technology, Inc. announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation ...
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July 13, 2026
A New Optical Ball Grid Array Package Development for Automotive Optical Sensor
This study develops a robust optical ball grid array package for automotive image sensors, optimizing materials, design, and processes to mitigate thermal stresses, improve reliability, and meet stringent ADAS qualification requirements.
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June 18, 2026
TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor ...
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May 21, 2026
Amkor Technology Expands U.S. Advanced Packaging Footprint with Additional Land in Arizona
Amkor Technology, Inc. reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment ...
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January 21, 2026
Revolutionizing IC Packaging with High-Density RDL Technology
Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability.
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November 25, 2025
Package Assembly Design Kits: The Future of Advanced Package Design
This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity.
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October 8, 2025
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona
Amkor Technology, Inc., in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced ...
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October 1, 2025
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
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September 3, 2025
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
Amkor Technology, Inc. announced revised plans for the location of the company's new semiconductor advanced packaging and test facility in Arizona. The facility will be ...
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August 13, 2025
Eliminating Interfacial Delamination in High-Power Automotive Devices
This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
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| Sponsor |
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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