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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
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| Press Release |
April 15, 2026 - Click the title to read the full press release.
Leading semiconductor test equipment supplier Advantest Corporation announced the opening of two Advantest Innovation Centers—one located on the company's campus in San Jose ...
Advantest
April 23, 2026
Advantest Announces Strategic Partnership with Applied Materials and Joins EPIC Platform
Advantest Corporation announced that it will join Applied Materials' new EPIC (Equipment and Process Innovation and Commercialization) platform in Sunnyvale, Calif. ...
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April 15, 2026
Advantest Announces Opening of Strategic Innovation Center
Leading semiconductor test equipment supplier Advantest Corporation announced the opening of two Advantest Innovation Centers—one located on the company's campus in San Jose ...
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February 26, 2025
VIEWPOINT 2025: Ira Leventhal, Vice President of Applied Research and Technology, Advantest America, Inc.
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January 29, 2024
VIEWPOINT 2024: Ira Leventhal, Vice President of Applied Research and Technology, Advantest America, Inc.
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January 25, 2023
VIEWPOINT 2023: Sunil Banwari, Vice President of Business Development, Advantest Corporation
Heterogenous packages face several quality and reliability challenges, with thousands of potential failure points and no visibility: • Bump reliability: Voids and cracks • TSV reliability: Partial fill and copper plating cracking • Lane trace reliability: Bridge shorts • Driver and receiver: Parametric variation, aging ...
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January 19, 2021
VIEWPOINT 2021: Keith Schaub, Vice President of Technology and Strategy, Advantest
Despite the challenges presented by a world reeling from pandemic and economic disruption, Advantest was able to perform well throughout 2020, owing in part to robust demand for memory and SoC test systems for devices used in data centers and game consoles. Thanks to Advantest's broad customer base and strong ...
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January 2, 2019
VIEWPOINT 2019: Judy Davies, VP of Global Marketing Communications, Advantest
As the semiconductor content in automobiles continues to expand rapidly, the IC industry may have found its Next Big Thing in smart, electrified vehicles. Growth in this market is revving up with semiconductor applications in automotive electronics projected to be one of the fastest growing segments for the IC business. The ...
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
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