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| Viewpoint | |
January 25, 2023
VIEWPOINT 2023: Sunil Banwari, Vice President of Business Development, Advantest Corporation
• Bump reliability: Voids and cracks • TSV reliability: Partial fill and copper plating cracking • Lane trace reliability: Bridge shorts • Driver and receiver: Parametric variation, aging Active monitoring and response to the above die-to-die interconnect defects are vital to help resolve them. With our analytics ecosystem partners, Advantest has developed our growing Advantest Cloud Solutions (ACS) portfolio of products that address these challenges. ACS Edge™, our secure edge-compute and analytics solution for fast algorithmic AI-based decision-making, connects to a user's test equipment via a private, high-speed encrypted link. It leverages the advanced container hub to run their protected applications while keeping their data and analytics secure. The ACS Solution Store enables partners and users to develop and access real-time data infrastructure solutions and software applications. We have worked closely with industry partners this year on unique analytic solutions. In 2023, we expect partners to provide more best-in-class solutions that take advantage of the ACS infrastructure, including edge computing. These offerings will allow users to make real-time decisions optimizing yield, quality, cost and time-to-market for heterogeneous packages using AI, machine learning, and real-time data retrieval. Sunil Banwari, Vice President of Business Development, Advantest Cloud Solutions Advantest Corporation http://www.advantest.com |
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