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Particle-Free Plasma Oxide Reduction
Turnkey plasma systems for semiconductor packaging. Highly reliable. Perfect for high-mix or high-volume manufacturing. Learn more.
Surfx Technologies
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| Press Release |
July 31, 2025 - Click the title to read the full press release.
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2025. Second Quarter 2025 Highlights Net sales $1.51 billion; Gross profit $182 million ...
Amkor Technology, Inc.
January 21, 2026
Revolutionizing IC Packaging with High-Density RDL Technology
Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center applications with improved reliability.
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November 25, 2025
Package Assembly Design Kits: The Future of Advanced Package Design
This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and complexity.
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October 8, 2025
Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona
Amkor Technology, Inc., in collaboration with the Trump Administration, announces the groundbreaking and expanded planned investment of its new state-of-the-art outsourced ...
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October 1, 2025
Novel Molded FCBGA Package Platform For Highly Reliable Automotive Applications
This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional FCBGA designs.
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September 3, 2025
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
Amkor Technology, Inc. announced revised plans for the location of the company's new semiconductor advanced packaging and test facility in Arizona. The facility will be ...
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August 13, 2025
Eliminating Interfacial Delamination in High-Power Automotive Devices
This study demonstrates that coating power devices with APTES adhesion promoter after wire bonding eliminates interfacial delamination, providing a simpler alternative to lead frame roughening technology.
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July 31, 2025
Amkor Technology Reports Financial Results for the Second Quarter 2025
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2025. Second Quarter 2025 Highlights Net sales $1.51 billion; Gross profit $182 million ...
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July 16, 2025
Current Characterization of Various Cu RDL Designs In Wafer Level Packages (WLP)
This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
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June 13, 2025
Analysis Of Multi-Chiplet Package Designs and Requirements for Production Test Simplification
This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows.
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April 30, 2025
Amkor Technology to Present at the J.P. Morgan Global Technology Conference
Amkor Technology, Inc. announced that it will participate in the J.P. Morgan Global Technology, Media and Communications Conference on Tuesday, May 13, 2025. ...
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