We search for industry news, so you don't need to.
Press Releases

September 6, 2017  -  Click the title to read the full press release.

SST Vacuum Reflow Systems to Present Technical Paper at CIOE
SST Vacuum Reflow Systems and Palomar Technologies announced they will be exhibiting assembly and packaging systems at the China International Optoelectronic Exposition (CIOE) ...

Palomar Technologies, Inc.
March 15, 2018
Palomar Tech Introduces 6532HP: Ultra High Accuracy Die Bonding System
Palomar Technologies, Inc. is delighted to announce the introduction of their newest die bonding system: the 6532HP (HP for High Precision, High Production, High Performance). ...
September 6, 2017
SST Vacuum Reflow Systems to Present Technical Paper at CIOE
SST Vacuum Reflow Systems and Palomar Technologies announced they will be exhibiting assembly and packaging systems at the China International Optoelectronic Exposition (CIOE) ...
July 11, 2016
Wedge and Die Bond Demos at SEMICON West 2016
Palomar Technologies announced product demos at SEMICON West 2016. The 9000 Wedge Bonder, 3880 Die Bonder, and SST 5100 with QuikCool™ system will be showcased through live ...
April 20, 2016
Palomar Technologies to Exhibit at SEMICON Southeast Asia and SMT Nuremberg
Palomar Technologies announced they will be exhibiting at SEMICON Southeast Asia at the SPICE Arena in Penang, Malaysia on April 26-28 in booth #209. They will ...
November 10, 2015
Palomar Technologies Performs Live Demonstrations at productronica 2015
Palomar Technologies announced they will be performing live demonstrations of the 8000i Wire Bonder,9000 Wedge Bonder, and SST International's Model ...
October 28, 2015
Palomar Technologies Exhibits at IMAPS 48th Annual Symposium on Microelectronics
Palomar Technologies announced that it will be exhibiting at the IMAPS 48th International Symposium on Microelectronics. Visit us at booth #511 ...
September 24, 2015
Palomar Technologies Introduces The 3880 Die Bonder
Palomar Technologies announced the launch of its latest product: the 3880 Die Bonder. The 3880 Die Bonder features a new fully integrated Z-Theta bidirectional bond head ...
July 10, 2015
Palomar Technologies Exhibits at SEMICON West 2015 Showcasing Bonder Demos
Palomar Technologies announced that they will perform product demos at booth #5968 at SEMICON West 2015 on July 14-16 at the Moscone Center in San Francisco ...
June 11, 2015
Palomar Technologies' President & CEO is EY Entrepreneur of Year Finalist
EY announced that President and Chief Executive Officer, Bruce Hueners of Palomar Technologies is a finalist for the EY Entrepreneur Of The Year 2015 Award ...
May 11, 2015
Palomar Technologies Introduces the 9000 Wedge Bonder to Germany at SMT Hybrid Packaging
Palomar Technologies will be introducing the 9000 Wedge Bonder to Germany at the 2015 SMT Hybrid Packaging conference in Nuremberg, Germany on May 5-7. They will ...