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Press Releases

September 6, 2017  -  Click the title to read the full press release.

SST Vacuum Reflow Systems to Present Technical Paper at CIOE
SST Vacuum Reflow Systems and Palomar Technologies announced they will be exhibiting assembly and packaging systems at the China International Optoelectronic Exposition (CIOE) ...

Palomar Technologies, Inc.
December 5, 2018
Palomar Technologies Offering Silver Sintering to Meet the Needs for RF GaN Power Amplifiers
Palomar Technologies announced new epoxy die attach capabilities for silver sintering. Developed to meet growing demands for RF GaN power amplifiers, which are ...
November 29, 2018
Palomar Technologies Announces First Photonics Innovation Center in Singapore
Palomar Technologies announced that Evan Hueners, Product Marketing Manager for Palomar Technologies, will present Advanced Photonic Packaging: Empowering IoT and ...
September 19, 2018
Palomar Technologies Enlarges Engineering Lab to Meet Increased Demand for Photonics Solutions
Palomar Technologies announced it is enlarging its engineering laboratory to meet the increased demands of customers developing advanced photonics solutions ...
September 17, 2018
Technologies Awarded ISO 9001:2015 Certificate
Palomar Technologies announced the successful completion of its International Organization for Standardization (ISO) 9001:2015 audit for its corporate offices in Carlsbad ...
March 15, 2018
Palomar Tech Introduces 6532HP: Ultra High Accuracy Die Bonding System
Palomar Technologies, Inc. is delighted to announce the introduction of their newest die bonding system: the 6532HP (HP for High Precision, High Production, High Performance). ...
September 6, 2017
SST Vacuum Reflow Systems to Present Technical Paper at CIOE
SST Vacuum Reflow Systems and Palomar Technologies announced they will be exhibiting assembly and packaging systems at the China International Optoelectronic Exposition (CIOE) ...
July 11, 2016
Wedge and Die Bond Demos at SEMICON West 2016
Palomar Technologies announced product demos at SEMICON West 2016. The 9000 Wedge Bonder, 3880 Die Bonder, and SST 5100 with QuikCool™ system will be showcased through live ...
April 20, 2016
Palomar Technologies to Exhibit at SEMICON Southeast Asia and SMT Nuremberg
Palomar Technologies announced they will be exhibiting at SEMICON Southeast Asia at the SPICE Arena in Penang, Malaysia on April 26-28 in booth #209. They will ...
November 10, 2015
Palomar Technologies Performs Live Demonstrations at productronica 2015
Palomar Technologies announced they will be performing live demonstrations of the 8000i Wire Bonder,9000 Wedge Bonder, and SST International's Model ...
October 28, 2015
Palomar Technologies Exhibits at IMAPS 48th Annual Symposium on Microelectronics
Palomar Technologies announced that it will be exhibiting at the IMAPS 48th International Symposium on Microelectronics. Visit us at booth #511 ...