Technical Papers Index
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448 technical papers.

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Aug 11, 2023
Reliably Reinforce BGAs While Minimizing Stress on Solder Joints
Learn how to reinforce BGAs while minimizing stress on solder joints with capillary underfill, edge bond and corner fill and ...

Aug 2, 2023
Series A: Electrical Insulation of Al2O3-Coated Bonding Wire
We introduce ceramic (Al2O3) coating at nm scales deposited on metal wires for enhancing electrical insulation, adhesion to encapsulation and ...
OxWires Co., Ltd

Jul 25, 2023
Production Testing Of Discrete Power Products
Test steps and parameters for new and established power technologies. ...
Amkor Technology, Inc.

Jul 19, 2023
Essential Inspection Requirements in the Era of Convergence
The convergence of semiconductor packaging and board assembly is revolutionizing the industry with innovative inspection machines. This paper explores requirements ...
Koh Young America, Inc.

Jul 13, 2023
Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications
In this paper, a novel negative-tone, photosensitive, polymeric bonding material is proposed that can be used as a dielectric enabling ...
Brewer Science, Inc.

Jul 7, 2023
Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs
Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. ...

Jun 28, 2023
Vacuum FAR Technology For 15 microns and Below Advanced Packaging
This white paper discussed the impact of process parameters on vacuum fluxless solder reflow performance in Advanced Packaging applications with ...
Yield Engineering Systems (YES)

Jun 21, 2023
Heterogeneous IC Packaging: Optimizing Performance And Cost
The choice of packaging technology is influenced by the communication interface between chiplets. ...
Amkor Technology, Inc.

May 5, 2023
Improving SiC Power Devices with Laser Ohmic Contact Formation
Learn about the impact of laser-based OFC on the electrical characteristics of SiC-Ni interfaces and its effect on surface structures, ...
3D-Micromac AG

Apr 14, 2023
Defluxing of Copper Pillar Bumped Flip-Chips
The process of creating interconnects on flip chips using copper pillar bumping has gained popularity as an alternative to the ...

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