Industry Press
Magnetic sensors are officially rushing to TMR
YOLE Group
Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System
Hitachi High-Tech
Ironwood introduces high performance near zero footprint elastomer socket
Ironwood Electronics
Brooks Instrument Introduces New MFCs for High-Temperature Environments
Brooks Instrument
Meyer Burger publishes Annual Report 2023 after a strategic shift in a year
Meyer Burger Technology AG
Indium Corporation Celebrates 90 Years of Materials Science Innovation
Indium Corporation
One Part Epoxy Changes from Red to Clear Under UV Light
Master Bond
Advanced Semiconductor Packaging Patent Monitor: What you can get from data intelligence
KnowMade
MORE INDUSTRY PRESS
What Year Was It?
The day was Mar 18. What year was it?
Wells and Fargo Start Shipping and Banking Company
What Year
In New York City, Henry Wells and William G. Fargo join with several other investors to launch their namesake business.
See the answer below.
What Year Was It Answer
Wells and Fargo Start Shipping and Banking Company
Answer: March 18, 1852
March 18, 2024
image
TSMC Considering Advanced Chip Packaging Capacity in Japan
TSMC mulls expanding advanced packaging capacity in Japan. This could boost Japan's semiconductor industry reboot. Options include introducing CoWoS tech, enhancing processing power and reducing space. No decisions made yet. TSMC aims to double CoWoS output by 2025.
Yahoo! Finance
The City In The Tower: 3D ICs Transform The Electronics System Landscape
3D ICs are revolutionizing electronics by stacking chips vertically, enhancing performance, reducing energy consumption, and enabling innovative designs. This transformative technology promises to reshape the electronics system landscape, driving advancements in various sectors.
Semiconductor Engineering
How to Select RF Test Socket
Selecting the right RF test socket involves several factors – frequency, insertion loss, return loss, impedance matching, contact force, contact resistance, durability, thermal performance, etc.
Technical Paper
Tech war: ASML's threat to expand outside the Netherlands is watched with interest in China
ASML, a vital semiconductor equipment supplier, faces geopolitical tension as its expansion beyond the Netherlands draws scrutiny from China. The move amplifies concerns in the ongoing tech war over critical supply chains and strategic technologies.
South China Morning Post
Laid-off techies face 'sense of impending doom' with job cuts at highest since dot-com crash
Tech workers face challenges in finding employment as layoffs surge to levels not seen since 2001. Amidst the job market turmoil, skilled professionals navigate uncertainty, emphasizing the need for reskilling and adaptability in the ever-evolving tech landscape.
CNBC
Samsung to win more than US$6bn for US investments
The US plans to award over US$6 billion to Samsung Electronics, fueling its expansion beyond a Texas project. This, alongside a US$5 billion grant to rival TSMC, aims to bolster semiconductor production on US soil, part of the CHIPS Act initiative.
Taipei Times
China's semiconductor production challenges could be boon for Europe
China, leading in semiconductor consumption and aspiring to AI supremacy, alarms the US. Amid trade tensions, the US blacklists chip giant SMIC over military apprehensions. China retaliates with an export ban. Despite sanctions, Chinese firms innovate, grappling with outdated tech, hiking costs.
Euro News
Globalfoundries reportedly to implement personnel restructuring in Singapore and Taiwan amid speculation of job relocation to India
GlobalFoundries, a US-based pure-play foundry, undergoes personnel restructuring amidst rumors of relocating job roles from Singapore and Taiwan to India. Official confirmation from the company is awaited.
Digitimes
Chip Industry Week In Review
Europe's semiconductor landscape expands: Silicon Box plans a €3.2B panel-level foundry in Italy; imec to establish a chip tech pilot line in Spain. Cadence and Arm introduce automotive chiplet architecture. EU Parliament passes AI Act and Cyber Resilience Act. India boosts semiconductor industry.
Semiconductor Engineering
Taiwan-Japan Economic Summit galvanizes semiconductor collaboration amidst global trade shifts
Japan and Taiwan convened at the 2024 Taiwan-Japan (Kyushu) Economic and Trade Forum, where industry experts and government officials converged to strategize on enhancing cooperation in the semiconductor and innovation domains, fostering a dynamic partnership.
Digitimes
TSMC, NXP Scale Up Apprenticeships
TSMC and NXP join forces to expand apprenticeship programs, aiming to address semiconductor talent shortages. This collaborative effort aims to nurture skilled workers, fostering innovation and meeting the growing demands of the industry.
EE Times
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Test Your Knowledge
What are the two dimensions apart from length and width?
See answer below.
Quote of the Day
"Science is a wonderful thing if one does not have to earn one's living at it."
Albert Einstein
Industry Calendar
Mar 18, 2024
IMAPS Device Packaging 2024 PDC
IMAPS
Mar 20, 2024
SEMICON CHINA
SEMI
Mar 21, 2024
Advanced Packaging for Medical Microelectronics
IMAPS
Apr 9, 2024
Mitigating Supply Chain Risks: On-Shore Assembly Solutions for Long-Lifecycle Systems Webinar
Rochester Electronics
Apr 30, 2024
The 27th Annual Components for Military & Space Electronics (CMSE) Conference & Exhibition
TJ Green Associates, LLC
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Cartoon
"If you pay your invoice on time, it will mess up our accounting system, so it's better if you keep paying late."
Copyright © Randy Glasbergen
Test Your Knowledge Answer
What are the two dimensions apart from length and width?
Answer: Depth and time