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Aug 21, 2026 Intel may expand 2 nm chip outsourcing to TSMC Intel may expand its partnership with TSMC to include advanced 2nm chips for upcoming processors, combining its 18A technology with TSMC's N2P and potentially N2X processes. The move could boost production flexibility and demand for Taiwanese semiconductor suppliers. Taiwan News Aug 21, 2026 IBM Makes Quantum Cryogenics Modular, but Scaling Problems Remain IBM connected and cooled two cryogenic modules that can support multiple quantum processors, advancing its 2029 fault-tolerant roadmap. The architecture expands wiring capacity, tackles scaling limits and will later host Nighthawk processors. EE Times Aug 20, 2026 The Future Of AI Compute Won't Run On Just One Kind Of Chip Semiconductor Engineering's three-part discussion explores how AI data center architectures are evolving, featuring experts from Arm, Axiomise, Cadence, Expedera, Siemens EDA & Synopsys. The final installment examines emerging infrastructure, silicon, verification & HPC challenges. Semiconductor Engineering Aug 20, 2026 IBM Makes Quantum Cryogenics Modular, but Scaling Problems Remain IBM has connected and cooled two modular cryogenic systems, expanding wiring capacity and enabling quantum-processor interconnects. The advance supports scaling, but control electronics, reliability, maintenance and quantum links remain hurdles. EE Times Aug 20, 2026 Japan's Socionext Adds Intel's 18A-P to Foundry Mix Alongside TSMC Intel has won Socionext as an external customer for its 18A-P process, expanding foundry options beyond TSMC. The performance-enhanced node targets next-generation SoCs, while Intel advances 18A and prepares 14A for 2027 production and 2028 ramp. TrendForce Aug 20, 2026 SK hynix Reportedly Builds Silicon Valley HBM Team to Boost Customer Co-Design With U.S. Big Tech SK hynix is expanding its Silicon Valley HBM team to co-develop customer-specific architectures with major AI chipmakers. The effort targets HBM4 and beyond, deepening NVIDIA ties and helping secure future orders through early memory co-design. TrendForce Aug 20, 2026 Andes Condor Closure Came Amid Broader Cost-Cutting Effort Andes Technology is restructuring after aggressive expansion, closing its Condor Computing subsidiary and absorbing its RISC-V IP. The company aims to cut costs while focusing on AI, automotive and embedded markets, despite strong 2026 revenue growth. EE Times Aug 20, 2026 The U.S. banned Nvidia's best chips from going to China. Now it's trying to close a crucial loophole U.S. chip export controls face a loophole as Chinese AI firms reportedly access restricted Nvidia chips remotely through Southeast Asian data centers. Proposed legislation could expand controls, but enforcement challenges and industry resistance may limit its effectiveness. CNBC Aug 20, 2026 Chinese Chip Toolmakers Post 400% Profit Surge as Overseas Suppliers' Two-Year Backlogs Reshape the Industry AI-driven chip expansion is straining supplies of non-lithography equipment, creating opportunities for Chinese manufacturers. Domestic firms are benefiting from surging demand, shorter lead times and forced adoption, fueling strong 2026 growth. wccftech Aug 20, 2026 When Interoperability Becomes Infrastructure Matter is moving beyond interoperability to practical smart-home adoption, giving manufacturers ways to differentiate. The next challenge is maintaining device visibility and using data to improve design, usability, and products across lifecycles. EE Times |
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