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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
July 22, 2026 - Click the title to read the full press release.
Koh Young Technology is pleased to announce the promotion of Ramiro Mora to Service and Applications Manager for Mexico and South America. The promotion recognizes ...
Koh Young America
July 22, 2026
Koh Young America Promotes Ramiro Mora to Lead Service and Applications
Koh Young Technology is pleased to announce the promotion of Ramiro Mora to Service and Applications Manager for Mexico and South America. The promotion recognizes ...
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July 14, 2026
Koh Young America promotes Heriberto Cuevas to Country Manager
Koh Young proudly announces the promotion of Heriberto Cuevas to Country Manager for its Mexico and South America operations. In this expanded role, Cuevas will direct ...
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April 23, 2026
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
Koh Young is bringing its battle-tested platform to where that challenge is being solved at the 2026 IEEE Electronic Components and Technology Conference (ECTC), ...
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April 1, 2026
Koh Young Announces Two Sales and Service Changes to Strengthen its Customers in the U.S. and Canada
Koh Young America announced two changes within its North American organization. Dave Nemeth has been named Sr. Manager, Eastern Regional Sales, covering eastern ...
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January 27, 2026
Koh Young to Showcase Advanced Inspection and Smart AI Factory Solutions at SEMICON Korea 2026
Koh Young will exhibit at SEMICON Korea 2026, held February 11–13, 2026 at COEX in Seoul. Visitors can meet the team at COEX 3F, Hall C, Booth C850, where Koh Young ...
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December 1, 2025
Koh Young Highlighting 3D Inspection for Advanced Packaging at SEMICON Japan
Koh Young Technology will showcase its latest semiconductor inspection portfolio at SEMICON Japan 2025, held from December 17 to 19 at Tokyo Big Sight in Booth E5528. ...
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November 5, 2025
Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business
Koh Young Technology has appointed Jeff Lee as Head of Industrial Solutions Business. In this role, he will oversee Global Sales, Product Planning, Technical Support, and the company's ...
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October 29, 2025
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
Koh Young will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore ...
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October 1, 2025
Koh Young to Showcase Semiconductor Metrology and Advanced Packaging Inspection Solutions at iMAPS
Koh Young Technology will make its first appearance at iMAPS 2025, the premier event for microelectronics and advanced packaging, taking place September 29 through October 2, 2025 ...
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September 16, 2025
Koh Young, Fuji, Kurtz ERSA Drive Smart Manufacturing Solutions at Kunshan, China Technical Seminar
Koh Young Technology, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on ...
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| Sponsor |
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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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