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Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech
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| Press Release |
July 15, 2026 - Click the title to read the full press release.
Heller Industries announced the appointment of Mike DePauw as Senior Key Account Manager, reinforcing the company's continued investment in growth, customer partnership ...
Heller Industries
July 15, 2026
Heller Industries Appointment of Senior Key Account Manager Mike DePauw
Heller Industries announced the appointment of Mike DePauw as Senior Key Account Manager, reinforcing the company's continued investment in growth, customer partnership ...
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March 11, 2026
VIEWPOINT 2026: David Heller, CEO, Heller Industries
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December 17, 2025
Reflow Technology Leader Completes End-to-End SMT Process Capability at New Collaborative Venue
Heller Industries becomes the latest partner to join THE SMT FUTURE EXPERIENCE, bringing reflow oven expertise to complete the technology chain for the venue's live SMT production line. ...
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January 30, 2024
VIEWPOINT 2024: Christopher Morath, Chief Operating Officer, Heller Industries, Inc.
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March 2, 2023
Vacuum Fluxless Reflow Technology for Fine Pitch Interconnect Bumping Applications
A process for fine pitch bumping involving vacuum and formic acid reflow (VFAR) suitable for high volume manufacturing is described. A joint study between Heller Industries ...
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February 6, 2023
VIEWPOINT 2023: Christopher Morath, Chief Operating Officer, Heller Industries, Inc.
In 2022 Heller's business reached a near-record level for Electronics Assembly and hit a record for Semiconductor packaging. During this very high demand, our exceptional operations team was able to mitigate the Shanghai COVID lockdown of Q2 by shifting production to Korea and ramping China production in a closed-loop ...
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January 19, 2023
Optimized Reflow Solder TIMs Processes for Heterogeneous Packages
Void rates related to solder TIM (sTIM) layers are studied across different reflow processes including vacuum assisted reflow, formic reflow, and pressurized (autoclave) ...
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September 15, 2020
Complete Warpage Control for Wafers and Panels
Effective warpage mitigation is increasingly critical for semiconductor advanced packaging applications, such as fan-out. Heller Industries has developed a unique ...
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February 20, 2020
VIEWPOINT 2020: Christopher Morath, Chief Operating Officer, Heller Industries, Inc.
Heller is currently seeing a rebound from a first half of 2019 downturn which we saw accompanied by a shift in business from China to other regions such as SE Asia and Eastern Europe as a result of the US/China trade war. For 2020 through 2022 we foresee significant growth driven by megatrends such as 5G networks ...
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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