| Press Release |
June 4, 2026 - Click the title to read the full press release.
YINCAE announced the relocation of its office from Albany, New York to a new facility located at 93 Broadway, Menands, NY 12204. The move supports the company's continued ...
YINCAE Advanced Materials
July 31, 2026
YINCAE to Showcase Breakthrough at IMAPS 2026
YINCAE Advanced Materials will showcase its latest innovations in advanced semiconductor packaging materials at the 59th International Symposium on Microelectronics ...
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July 17, 2026
YINCAE Introduces UF 66UV: UV/Thermal Dual-Cure Optical Underfill
YINCAE Advanced Materials is pleased to announce the launch of UF 66UV, a next-generation UV and thermal dual-cure underfill designed for advanced optoelectronic, ...
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July 2, 2026
YINCAE to Showcase Advanced Materials at IICIE 2026
YINCAE will showcase its latest innovations in advanced materials and packaging technologies at the International Integrated Circuit Innovation Expo (IICIE) 2026 ...
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June 4, 2026
YINCAE Announces Office Relocation to Menands, New York
YINCAE announced the relocation of its office from Albany, New York to a new facility located at 93 Broadway, Menands, NY 12204. The move supports the company's continued ...
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January 6, 2026
YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium
YINCAE Advanced Materials will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026 ...
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October 20, 2025
YINCAE Advanced Materials announces UF 66L Optical Clear Underfill
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors ...
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October 17, 2025
YINCAE Advanced Materials announces UF 66L Optical Clear Underfill
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors ...
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October 3, 2025
YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity
YINCAE has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for advanced semiconductor packaging. ...
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October 1, 2025
Visit the YINCAE Advanced Materials booth at iMAPS 2025, booth 817
YINCAE is a developer, manufacturer, and supplier of high-performance coatings, adhesives and electronic/optoelectronic materials. Our products support critical steps from ...
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September 8, 2025
YINCAE Showcases High-Performance Materials at IMAPS 2025
YINCAE is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, September 30 - October 1. Visitors will experience ...
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