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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
October 1, 2025
Visit the YINCAE Advanced Materials booth at iMAPS 2025, booth 817
We invite you to visit the YINCAE Advanced Materials booth at iMAPS 2025, booth number 817.
YINCAE is a developer, manufacturer, and supplier of high-performance coatings, adhesives and electronic/optoelectronic materials Our products support critical steps from wafer-to-package to final device integration, with an emphasis on enhancing throughput, lowering costs, and meeting demanding performance and reliability standards. We emphasize quality management (ISO 9001 certified) and sustainable practices in our operations.
YINCAE will be introducing a new product, Diamond Underfill UF 158D, at the show. This underfill delivers 8 W/m-K thermal conductivity, a new record for heat dissipation in advanced semiconductor packaging. This product combines high thermal conductivity performance with excellent mechanical reliability, low CTE mismatch, and strong adhesion. It is optimized for flip-chip, 2.5D/3D packaging, and high density interconnects. See attached press release.
YINCAE will also be exhibiting at SMTAI in Rosemont, IL October 19-23. Please visit us at booth number 2551.
YINCAE Advanced Materials
For more information visit:
http://www.yincae.com
January 6, 2026
YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium
YINCAE Advanced Materials will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026 ...
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October 20, 2025
YINCAE Advanced Materials announces UF 66L Optical Clear Underfill
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors ...
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October 17, 2025
YINCAE Advanced Materials announces UF 66L Optical Clear Underfill
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors ...
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October 3, 2025
YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity
YINCAE has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for advanced semiconductor packaging. ...
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October 1, 2025
Visit the YINCAE Advanced Materials booth at iMAPS 2025, booth 817
YINCAE is a developer, manufacturer, and supplier of high-performance coatings, adhesives and electronic/optoelectronic materials. Our products support critical steps from ...
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September 8, 2025
YINCAE Showcases High-Performance Materials at IMAPS 2025
YINCAE is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, September 30 - October 1. Visitors will experience ...
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March 13, 2025
YINCAE: UF 158UL Redefines Underfill for Large Chips
YINCAE announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips ...
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February 4, 2025
UF 120LA: The Next-Gen High reliability, 100% flux residue compatible and reworkable underfill
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA ...
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June 30, 2023
YINCAE Launches Snap Cure, Highly filled,100% No-Clean Flux Residue Compatible Underfill: UF 120HA
YINCAE ha announced the launch of its new product UF 120HA. The innovative underfill material is specifically designed to provide a fast-flow, lower temperature cure for high ...
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March 31, 2023
YINCAE Launches Breakthrough Thermal Underfill: UF158A2
YINCAE has announced the release of its breakthrough product: Thermal Underfill - UF 158A2. Designed for use in a variety of electronic devices, not only can UF158A2 ...
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