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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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| Press Release |
May 20, 2026 - Click the title to read the full press release.
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method ...
Fraunhofer IPMS
June 26, 2026
Fraunhofer IPMS brings international elite of IC design to Dresden
The Fraunhofer Institute for Photonic Microsystems IPMS Fraunhofer Institute for Photonic Microsystems IPMS is becoming a meeting point for international cutting-edge research ...
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May 27, 2026
Optical wireless quantum security: free-space QKD and Li-Fi in one system
The German consortium QuINSiDa has achieved a major step towards mobile quantum-secure communication. They demonstrated a one-of-a-kind free-space data transfer ...
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May 20, 2026
The Future of Chip Integration: Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
Breakthrough in chip manufacturing: As part of the European APECS pilot line, researchers at Fraunhofer Institute for Photonic Microsystems IPMS have developed a method ...
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March 25, 2026
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials
CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in ...
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March 18, 2026
A new level of thin-film characterization is within reach
The Fraunhofer Institute for Photonic Microsystems IPMS has launched the publicly funded SMut project, in collaboration with its partners Credoxys and SweepMe! to develop ...
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February 25, 2026
Fraunhofer IPMS collaborates with Korean TSN Lab
The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the "Global Cooperative R&D" funding ...
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February 2, 2026
Cutting-edge research for the European AI market
On October, the 1st 2025, the NeAIxt research project was launched, bringing together over 55 partners from across the EU. The project's long-term goal is to strengthen ...
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November 5, 2025
From Semiconductor Technology to Quantum Computing: Light Modulation Solutions for Japan's Key Industries
The Fraunhofer Institute for Photonic Microsystems IPMS in Germany is a leading research institute in the area of spatial light modulators (SLMs), a technology that ...
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July 21, 2025
Fraunhofer IPMS and DIVE Optimize Semiconductor Processes with Cutting-Edge Measurement System
The Fraunhofer Institute for Photonic Microsystems IPMS, in collaboration with DIVE imaging systems GmbH, has achieved a major milestone in resource-efficient semiconductor ...
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June 26, 2025
Design tools for improved hardware security of RFETs
Chip design is a crucial step in the development of application-specific microelectronic components and must take functionality, reliability and security aspects into ...
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Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
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