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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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| Press Release |
February 25, 2026 - Click the title to read the full press release.
Heraeus Electronics will exhibit in Booth 1438 at APEC 2026 (IEEE Applied Power Electronics Conference and Exposition) at the Henry B. Gonzalez Convention Center in San Antonio ...
Heraeus Electronics
February 25, 2026
Heraeus Electronics Brings Fully Matched Power Module Systems and DTS® Innovation to APEC 2026
Heraeus Electronics will exhibit in Booth 1438 at APEC 2026 (IEEE Applied Power Electronics Conference and Exposition) at the Henry B. Gonzalez Convention Center in San Antonio ...
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February 4, 2026
Heraeus Electronics to Share Packaging Insights in Three Presentations at CIPS 2026
Heraeus Electronics is proud to announce its participation at the 2026 CIPS Conference & Exhibition in Dresden, March 10–12. The company will deliver three technical ...
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September 15, 2025
Heraeus Electronics to Introduce Vertical Wire Bonding Innovation at SEMICON West 2025
Heraeus Electronics will showcase its latest innovation in Booth 353 at SEMICON West 2025, taking place October 7–9 at the Phoenix Convention Center in Arizona. At the ...
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August 21, 2025
Heraeus Electronics Announces Interactive Cermet Thick Film Workshop, September 17–18, 2025
Heraeus Electronics today announced its upcoming Interactive Cermet Thick Film Workshop, taking place from September 17–18, 2025 at the Heraeus Electronics Application ...
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August 6, 2025
Heraeus Materials Singapore Celebrates 40 Years of Innovation and Partnership
Heraeus Materials Singapore Pte. Ltd. (HMSL) proudly celebrates its 40th year of operations in Singapore. To mark this significant milestone, the company is hosting an ...
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May 13, 2025
Heraeus Electronics Showcases Sustainable Semiconductor Materials at SEMICON Southeast Asia 2025
Heraeus Electronics will exhibit at SEMICON Southeast Asia 2025, spotlighting its sustainable and high-performance solutions for advanced packaging. This year's participation ...
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April 15, 2025
Heraeus Electronics to Debut New Die Top System Material at PCIM Europe 2025
Heraeus Electronics will highlight its latest advancements in high-reliability materials for power electronics through a series of live presentations at PCIM Europe 2025, scheduled ...
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June 26, 2024
Heraeus Electronics Joins EU-Funded Project FastLane to Accelerate Future of Sustainable Power Electronics
Heraeus Electronics is proud to announce its participation in the FastLane project, an ambitious EU-funded initiative aimed at revolutionizing the European value chain ...
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June 12, 2024
Heraeus Successfully Defends Patent for Metal Sintering
Heraeus Electronics GmbH & Co KG announces the successful defense of its key European patent no. EP 3215288 B1. This patent encompasses ...
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May 23, 2024
Heraeus Electronics to Debut New Silver Sinter Paste for Module Attach Applications at PCIM Europe
Heraeus Electronics will introduce its latest product innovation, the mAgic PE360 Silver Sinter Paste, in Hall 6, Booth 6-310 at PCIM Europe. The event will take place June 11-13 ...
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