| Sponsor |
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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
October 17, 2025 - Click the title to read the full press release.
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors ...
YINCAE Advanced Materials
January 6, 2026
YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium
YINCAE Advanced Materials will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026 ...
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October 20, 2025
YINCAE Advanced Materials announces UF 66L Optical Clear Underfill
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors ...
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October 17, 2025
YINCAE Advanced Materials announces UF 66L Optical Clear Underfill
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors ...
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October 3, 2025
YINCAE Launches Diamond Underfill UF 158D with 8 W/m·K Thermal Conductivity
YINCAE has introduced Diamond Underfill UF 158D, delivering 8 W/m·K thermal conductivity—a new standard in heat dissipation for advanced semiconductor packaging. ...
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October 1, 2025
Visit the YINCAE Advanced Materials booth at iMAPS 2025, booth 817
YINCAE is a developer, manufacturer, and supplier of high-performance coatings, adhesives and electronic/optoelectronic materials. Our products support critical steps from ...
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September 8, 2025
YINCAE Showcases High-Performance Materials at IMAPS 2025
YINCAE is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, September 30 - October 1. Visitors will experience ...
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March 13, 2025
YINCAE: UF 158UL Redefines Underfill for Large Chips
YINCAE announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips ...
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February 4, 2025
UF 120LA: The Next-Gen High reliability, 100% flux residue compatible and reworkable underfill
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA ...
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June 30, 2023
YINCAE Launches Snap Cure, Highly filled,100% No-Clean Flux Residue Compatible Underfill: UF 120HA
YINCAE ha announced the launch of its new product UF 120HA. The innovative underfill material is specifically designed to provide a fast-flow, lower temperature cure for high ...
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March 31, 2023
YINCAE Launches Breakthrough Thermal Underfill: UF158A2
YINCAE has announced the release of its breakthrough product: Thermal Underfill - UF 158A2. Designed for use in a variety of electronic devices, not only can UF158A2 ...
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