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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems

Press Release

September 9, 2025 - Click the title to read the full press release.

Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T

Akrometrix, LLC recently announced the next generation in thermal warpage metrology with its PS600T system. This system greatly improves temperature uniformity ...

Akrometrix

September 9, 2025
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
Akrometrix, LLC recently announced the next generation in thermal warpage metrology with its PS600T system. This system greatly improves temperature uniformity ...

February 28, 2025
Akrometrix Announces 30 Year Anniversary as the Industry Leader in Thermal Warpage Metrology
Professor Ifeanyi Charles Ume founded Akrometrix out of Georgia Tech 30 years ago, to address issues in PCB flatness, using the shadow moiré warpage measurement technique. ...

February 11, 2025
Effect of Package Warpage and Composite CTE on Failure Modes in Board-Level Thermal Cycling
This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and surface strain data.

January 17, 2017
Akrometrix Announces First Shipment of FOWLP Panel Warpage Metrology System
Akrometrix, LLC announced the shipment of its first warpage metrology system specifically designed for FOWLP Panel applications -- the AKM600P ...

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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond