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Die-Module Attach for High Power Devices
High flexibility film and paste adhesives for large die and module attach. Outstanding thermal conductivity with low moisture absorption stress-free bonding.
AI Technology, Inc.
Plasmatreat-GmbH
Press Release
July 15, 2025  -  Click the title to read the full press release.

Siemens collaborates with SK keyfoundry to launch 130nm automotive power semiconductor Calibre PERC PD



Siemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) ...

Siemens
October 6, 2025
Siemens and ASE collaborate on workflows for ASE's VIPack advanced packaging platform
Siemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), to develop 3Dblox-based workflows for the ...
October 3, 2025
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC ...
September 24, 2025
Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro
Siemens Digital Industries Software announced today Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations ...
July 25, 2025
Siemens and UMC collaborate to advance EM/IR drop analysis with mPower technology
Siemens Digital Industries Software announced that it has collaborated with United Microelectronics Corporation (UMC) to implement Siemens' mPower™ software ...
July 15, 2025
Siemens collaborates with SK keyfoundry to launch 130nm automotive power semiconductor Calibre PERC PD
Siemens Digital Industries Software announced that SK keyfoundry, in collaboration with Korea Siemens EDA, has launched a 130nm automotive PDK (Process Design Kit) ...
May 23, 2025
Siemens to bring advanced timing constraint capabilities to EDA design flow
Siemens Digital Industries Software announced that it has entered into an agreement to acquire Excellicon. This will bring Excellicon's best-in-class software for the development ...
May 2, 2025
Siemens and Intel Foundry advance collaboration
Siemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference ...
April 28, 2025
Siemens and TSMC extend collaboration to drive semiconductor design innovation
Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration ...
November 21, 2024
Infineon and Siemens collaborate to bring AURIX TC4x to next generation software-defined vehicles
Siemens Digital Industries Software announced today its ongoing collaboration with Infineon to combine Siemens’ embedded automotive software platform, based on ...
November 11, 2024
Siemens extends Veloce hardware-assisted verification and validation with new Innexis shift-left software
Siemens Digital Industries Software announced today the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation ...
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EZ-FLO High Precision Dispense Tips
Each needle is machined from solid stainless steel as opposed to rolled tubing. The resulting smoother internal profile enhances material flow and consistency. Learn more.
DL Technology
kyzen