semiconductor
packaging news
Sponsor
AI-Technology-Inc

Die-Module Attach (Pastes & Films)
Die-Attach Adhesives with low moisture absorption for MSL Level-1 applications for reliability. Outstanding thermal conductivity with low moisture absorption- stress-free bonding.
AI Technology, Inc.
ECTC
Press Release
April 14, 2025  -  Click the title to read the full press release.

ISFET-based pH sensor-control successfully miniaturized and optimized for easy use



The Fraunhofer Institute for Photonic Microsystems IPMS has achieved another milestone in chemical liquid analysis. The electronics required to control ...

Fraunhofer Institute for Photonic Microsystems
April 18, 2025
Smart and compact sensors with Edge-AI
A newly launched interdisciplinary research project involving universities of Brandenburg and research institutions is developing new technological approaches for better ...
April 14, 2025
ISFET-based pH sensor-control successfully miniaturized and optimized for easy use
The Fraunhofer Institute for Photonic Microsystems IPMS has achieved another milestone in chemical liquid analysis. The electronics required to control ...
April 3, 2025
New cryostatic systems elevate current research on Qubits
The Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS has recently acquired new cryostats for the research on qubits and the qualification of superconducting ...
January 27, 2025
Faster and increased precision in the failure analysis of microelectronic components through the use of AI
Quality assurance is a key enabler for modern microelectronics which is only possible if powerful techniques for screening, fault isolation and failure diagnostics are available. ...
November 7, 2024
Research for the future, application transfer for the present
Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological ...
October 23, 2024
Fraunhofer IPMS and BASF celebrate ten years of collaboration
More power, more energy-efficiency, more complexity - manufacturers of modern microchips are constantly facing new challenges, also regarding the electrical connections required. ...
May 23, 2024
Fraunhofer IPMS supports the 300 mm process development of smart power technologies
In a joint development project spanning around one year, important progress was made in the production of "Smart power technologies". Fraunhofer IPMS provided significant ...
April 2, 2024
Material characterization of printed electronics
How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures ...
March 13, 2024
Cold Spin-Electronics for Quantum Technologies
The demand for electronics that operate at low temperatures is growing and becoming ever more important, especially for applications in the field of quantum computing ...
March 1, 2024
Innovation in sensor technology: development of a new pH sensing layer
Fraunhofer Institute for Photonic Microsystems IPMS announces a significant advance in chemical and biochemical analysis. The team led by Dr. Olaf R. Hild, Head of the Chemical ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Indium-Corporation

Proven SiPaste® for Ultrafine Printing
Boost SPI yields with SiPaste® C201HF. Formulated for fine feature printing, it combines superior non-wet open performance with excellent stencil print transfer efficiency.
Indium Corporation
Pac-Tech