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Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
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| Press Release |
February 11, 2025 - Click the title to read the full press release.
Festo introduces the VEFC mass flow controller, the company's latest entry into its Controlled Pneumatics family of solutions. The VEFC features precisely controlled flow ...
Festo
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Buy Ceramic Dispensing Needles Online
Ceramic needles with Luer Lok for conductive epoxies and encapsulation. The ceramic molding process allows for smaller more precise inner diameters with a glass like finish. Buy Online.
DL Technology
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