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Hermetic Package Seam Seal with HDHS® Technology
Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS.
MicroCircuit Laboratories, LLC
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| Press Release |
February 11, 2025 - Click the title to read the full press release.
Festo introduces the VEFC mass flow controller, the company's latest entry into its Controlled Pneumatics family of solutions. The VEFC features precisely controlled flow ...
Festo
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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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