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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

February 11, 2025 - Click the title to read the full press release.

Festo Introduces the VEFC Mass Flow Controller for Precise Control of Inert Gases

Festo introduces the VEFC mass flow controller, the company's latest entry into its Controlled Pneumatics family of solutions. The VEFC features precisely controlled flow ...

Festo

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Chiplets and Advanced Packaging
Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now.
XYZTEC