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packaging news
Sponsor
Amkor-Technology

Packaging Solutions for Unique Markets
The MLF/QFN packaging technology is the fastest-growing IC packaging solution today. MLF/QFN packaging solutions represent a >111B-unit market across five unique markets.
Amkor Technology, Inc.
Ormet-TLPS
Press Release
February 11, 2025  -  Click the title to read the full press release.

Festo Introduces the VEFC Mass Flow Controller for Precise Control of Inert Gases



Festo introduces the VEFC mass flow controller, the company's latest entry into its Controlled Pneumatics family of solutions. The VEFC features precisely controlled flow ...

Festo
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Sponsor
Ironwood-Electronics

94GHz Elastomer Socket BGA1440
Test a 75 watt BGA device with high performance elastomer using a simple swivel lid mechanism. Elastomer connects each signal with -1dB insertion loss
Pic: C24548.jpg
Ironwood Electronics
Master-Bond