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Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
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| Press Release |
February 11, 2025 - Click the title to read the full press release.
Festo introduces the VEFC mass flow controller, the company's latest entry into its Controlled Pneumatics family of solutions. The VEFC features precisely controlled flow ...
Festo
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