June 20, 2025
Advanced Microelectronic Packaging and Fiber Optics Technologies for the Military, Defense & Security Industries
As modern military systems become increasingly compact, autonomous, and software-driven, the need for robust microelectronic integration and secure optical communication grows exponentially.
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April 29, 2025
Tresky Automation presents contract manufacturing service for packaging at PCIM 2025
Tresky Automation is excited to introduce its new contract manufacturing service for packaging at PCIM 2025. This innovative service offers customized solutions for ...
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December 12, 2024
Ultrasonic Bonding in semiconductor industry – The fast and clean process
Ultrasonic die bonding revolutionizes semiconductor assembly with rapid processing, strong bonds, and low thermal stress. It excels in bonding dissimilar materials, advancing applications like power devices, RF components, and 3D packaging in modern electronics.
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December 10, 2024
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic ...
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November 19, 2024
Tresky Automation is strengthening its portfolio by investing in the contract manufacturing sector
Tresky Automation is pleased to announce the latest addition to its machine park in the field of contract manufacturing. Customers will now benefit from a state-of-the-art ...
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November 11, 2024
Laser- and photodiodes DIE bonding in optoelectronics
In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role for the performance and lifespan of laser ...
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August 14, 2024
Large Area Sintering (Half-Bridge Modules) in Power Electronics
Process allows dispensing of over 100 mm² for large-area sintering applications, improving competitiveness and sustainability in e-mobility and power electronics where efficiency and reliability are essential.
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June 11, 2024
Tresky allows dispensing of over 100 mm² for large area sintering applications
The integration of large-area power modules with an area of over 100 mm² is highly relevant. These modules are of great importance for various applications in e-mobility ...
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June 5, 2024
Manual mode for maximum control and flexibility with DIE bonders
The DIE bonders from German specialist Tresky are equipped with a flexible, manual mode. This reduces the entry barrier for new users ...
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January 12, 2024
Motivation for pressure-assisted metallic sintering in Power Electronics
Paper provides an understanding of motivations and practical implications of pressure-assisted metallic sintering for power electronics by embracing an innovative technique.
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